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1. 发明授权

US4403294A Surface defect inspection system 失效
标题翻译：表面缺陷检查系统
公开(公告)号：US4403294A
公开(公告)日：1983-09-06
申请号：US211113
申请日：1980-11-28
申请人： Toshimitsu Hamada , Hiroshi Makihira , Yasuo Nakagawa , Makoto Udaka
发明人： Toshimitsu Hamada , Hiroshi Makihira , Yasuo Nakagawa , Makoto Udaka
IPC分类号： G01B11/00 , G01B11/24 , G01B11/30 , G01N21/88 , G06T1/00 , G06T7/00 , G01N21/48
CPC分类号： G01N21/88 , G06T7/001 , G06T2207/30164
摘要： A surface defect inspection system comprises an image pick-up device for picking up an image by sequentially scanning the surface of an object two-dimensionally, a threshold circuit for quantizing the image signal produced from the image pick-up device as a binary code, a pattern feature extracting device for making calculations for extracting the features of image patterns from the quantized signal in synchronism with the scanning, and for temporarily storing the result of the calculations, a pattern region end decision device for deciding that individual pattern regions have ended in one direction, and a defect decision device for reading out from the pattern feature extracting device the result of the calculations on the pattern features corresponding to the positions each of the patterns in the direction perpendicular to the one direction each time of the decision that each pattern region has ended, so that the feature of each pattern scanned is compared with a predetermined reference, thus deciding and an indication of producing the presence or absence of a defect.
摘要翻译：表面缺陷检查系统包括用于通过二维顺序地扫描对象的表面来拾取图像的图像拾取装置，用于量化由图像拾取装置产生的图像信号作为二进制代码的阈值电路，图案特征提取装置，用于进行与扫描同步地从量化信号中提取图像图案的特征的计算，并且用于临时存储计算结果;图案区域结束判定装置，用于决定各个图案区域已经结束一个方向，以及缺陷判定装置，用于从每个图案特征提取装置的每个图案每次都从与图形特征相对应的图案特征相对应的图案特征提取装置读出与每个方向垂直的方向上的位置的计算结果区域已经结束，使得所扫描的每个图案的特征与预定的裁剪进行比较因此，决定和产生缺陷的存在或缺失的指示。

2. 发明授权

US4410278A Method and apparatus for appearance inspection 失效
标题翻译：外观检查方法和装置
公开(公告)号：US4410278A
公开(公告)日：1983-10-18
申请号：US170181
申请日：1980-07-18
申请人： Hiroshi Makihira , Yasuo Nakagawa , Toshimitsu Hamada , Makoto Udaka
发明人： Hiroshi Makihira , Yasuo Nakagawa , Toshimitsu Hamada , Makoto Udaka
IPC分类号： G01N21/952 , G01N21/55 , G01N21/88
CPC分类号： G01N21/952
摘要： An apparatus for inspecting the outer peripheral surface of a cylindrical object is disclosed, in which the light in slit form is radiated on the surface of an object such as a nuclear fuel pellet at an angle thereto, the light regularly reflected on the surface is detected by a detector, the detected image signal is quantized at threshold values higher and lower than an average level, and the binary signals are used to detect surface losses separately from an unground part and a metal inclusion as a first detection process. The diffused light is radiated onto the surface of the nuclear fuel pellet at an angle thereto, parallel light rays are radiated onto the surface from the direction perpendicular thereto, the light reflected from the surface of the object is detected by a detector from the direction perpendicular to the surface, the detected image signal is quantized at a threshold level lower than an average level of the image signal for the normal surface, and the binary signal is used to detect, as a second detection process, a crack and a pit separately from a chip, said crack, pit or chip included in surface missing defects detected in said first detection process. The surface defects of the nuclear fuel pellet or the like are thus detected by separating them into at least three types including a chip, an unground part and a metal inclusion, and a crack and a pit.
摘要翻译：公开了一种用于检查圆柱形物体的外周表面的装置，其中狭缝形式的光以与其成角度的核燃料芯片的物体的表面上辐射，检测到表面上规则反射的光通过检测器，检测到的图像信号在高于和低于平均电平的阈值处被量化，并且二进制信号用于与未接地部分和金属夹杂物分开地检测表面损耗作为第一检测处理。散射光与核燃料芯块的表面成角度地辐射，平行的光线从与其垂直的方向辐射到表面上，从物体的表面反射的光由检测器从垂直的方向检测到的图像信号在比正常表面的图像信号的平均电平低的阈值处被量化，并且二进制信号用于作为第二检测处理分别检测裂纹和凹坑在所述第一检测过程中检测到的表面缺失缺陷中包含的裂纹，凹坑或芯片的芯片。因此，通过将核燃料粒子等的表面缺陷分离为包括芯片，未研磨部分和金属夹杂物以及裂纹和凹坑中的至少三种类型来检测。

3. 发明授权

US4226539A Cylindrical body appearance inspection apparatus 失效
标题翻译：圆柱体外观检查装置
公开(公告)号：US4226539A
公开(公告)日：1980-10-07
申请号：US863345
申请日：1977-12-22
申请人： Yasuo Nakagawa , Hiroshi Makihira , Toshimitsu Hamada
发明人： Yasuo Nakagawa , Hiroshi Makihira , Toshimitsu Hamada
IPC分类号： G01N21/952 , G06G7/186 , G06G7/48 , G01N21/48
CPC分类号： G01N21/952 , G06G7/1865 , G06G7/48
摘要： An automatic cylindrical body appearance inspection apparatus comprises a cylindrical body appearance detecting device including rotating means for rotating the cylindrical body around its axis at a constant speed and detecting means for optically picking up an image of a cylindrical surface of the cylindrical body rotated by the rotating means and one-dimensionally scanning the image on a plane of real image thereof in a predetermined direction to extract a base line of the cylindrical surface of the cylindrical body as an image signal, an end surface appearance detecting device including a pair of detecting means each for optically picking up an image of each of opposite end surfaces of the cylindrical body and one-dimensionally scanning the image on a plane of real image thereof in a direction transverse to the predetermined direction to extract an image signal, transporting means for transporting the cylindrical body while it is positioned, from the cylindrical surface appearance detecting means to the end surface appearance detecting means and determining means for determining pass or fail or grade of a defect pattern on the surfaces of the cylindrical body based on the image signals derived from the cylindrical surface appearance detecting device and the end surface appearance detecting device, whereby the appearance of the cylindrical surface and the end surfaces of the cylindrical body under test is automatically inspected.
摘要翻译：一种自动圆柱体外观检查装置，包括：圆筒体外观检测装置，包括用于以恒定速度旋转圆筒体绕其轴线的旋转装置;以及检测装置，用于光学地拾取由旋转的旋转体旋转的圆筒体的圆柱形表面的图像在预定方向上对其图像的平面进行一维扫描，提取圆筒体的圆筒形表面的基线作为图像信号;端面外观检测装置，其包括一对检测装置用于光学拾取圆柱体的每个相对端面的图像，并在垂直于预定方向的方向上在其实像平面上一维扫描图像以提取图像信号;传送装置，用于传送圆柱形身体定位时，从圆柱形表面外观d 基于来自圆筒形外观检测装置和端面外观检测装置的图像信号，确定装置，用于确定圆筒体的表面上的缺陷图形的通过或失败或等级由此自动检查圆柱形表面和待测筒状体的端面的外观。

4. 发明授权

US4472056A Shape detecting apparatus 失效
标题翻译：形状检测装置
公开(公告)号：US4472056A
公开(公告)日：1984-09-18
申请号：US286068
申请日：1981-07-23
申请人： Yasuo Nakagawa , Hiroshi Makihira , Souhei Ikeda , Satoru Ezaki , Osamu Harada
发明人： Yasuo Nakagawa , Hiroshi Makihira , Souhei Ikeda , Satoru Ezaki , Osamu Harada
IPC分类号： G01B11/25 , H01R13/20 , H04N7/18
CPC分类号： G01B11/2518 , H01R13/20
摘要： Disclosed is a shape detecting apparatus comprising a slit projector for projecting a slit bright line on a number of objects arrayed in a line, an image forming lens for forming the bright line image, an image scanning mechanism for the bright line image formed through the image forming lens in a height direction of the object and a one-dimensional image sensing device for self-scanning the bright line image formed therein with an array of image sensing elements orthogonal to the scanning direction by the image scanning mechanism.
摘要翻译：本发明公开了一种形状检测装置，包括：狭缝投影仪，用于将一条狭缝亮线投射在排列成一行的多个物体上;形成用于形成亮线图像的成像透镜;用于通过图像形成的亮线图像的图像扫描机构; 在物体的高度方向形成透镜，以及一维图像感测装置，用于通过图像扫描机构与扫描方向正交的图像感测元件的阵列自身扫描其中形成的亮线图像。

5. 发明授权

US4791586A Method of and apparatus for checking geometry of multi-layer patterns for IC structures 失效
标题翻译：用于检查IC结构的多层图案几何的方法和装置
公开(公告)号：US4791586A
公开(公告)日：1988-12-13
申请号：US812928
申请日：1985-12-23
申请人： Shunji Maeda , Hitoshi Kubota , Satoru Fushimi , Hiroshi Makihira , Takanori Ninomiya , Yasuo Nakagawa
发明人： Shunji Maeda , Hitoshi Kubota , Satoru Fushimi , Hiroshi Makihira , Takanori Ninomiya , Yasuo Nakagawa
IPC分类号： H01L21/66 , G06T7/00 , G06K9/00
CPC分类号： G06T7/001 , G06T2207/10056 , G06T2207/30148
摘要： Method of and apparatus for checking the geometry of multi-layer patterns for IC structures having identical functions, each of the multi-layer patterns including layer patterns arranged in different level layers, wherein electrical image signals corresponding to any two of the multi-layer patterns and having more than two levels are registered with each other and then compared to determine unmatched and matched portions. The comparison of the registered electric image signals may be performed with respect to their amplitude or their gradients. The registration and comparison of two electric image signals may be repeated for all of the layer patterns with the matched portions being no longer subjected to the registration and comparison. A defect detection signal is produced from finally unmatched portions, if any, of the electric image signals having undergone the said registration and comparison.
摘要翻译：用于检查具有相同功能的IC结构的多层图案的几何形状的方法和装置，每个多层图案包括布置在不同层级中的层图案，其中对应于多层图案中的任何两个的电图像信号并且具有两个以上的级别彼此登记，然后进行比较以确定不匹配和匹配的部分。登记的电图像信号的比较可以相对于它们的振幅或梯度进行。对于所有的层图案，可以对匹配的部分不再进行注册和比较来重复两个电图像信号的配准和比较。如果有的话，经过所述登记和比较的电子图像信号的最终不匹配的部分产生缺陷检测信号。

6. 发明授权

US4343553A Shape testing apparatus 失效
标题翻译：形状检测仪
公开(公告)号：US4343553A
公开(公告)日：1982-08-10
申请号：US181768
申请日：1980-08-27
申请人： Yasuo Nakagawa , Hiroshi Makihira , Yoshitada Oshida , Nobuyuki Akiyama
发明人： Yasuo Nakagawa , Hiroshi Makihira , Yoshitada Oshida , Nobuyuki Akiyama
IPC分类号： G01B11/25 , G01B11/00
CPC分类号： G01B11/2545
摘要： A shape detecting apparatus comprises a slit projecting means for projecting a slit image on a three-dimensional object such as a soldered area, a positioning means for positioning the three-dimensional object relative to the slit projecting means, an image pickup means for two-dimensionally scanning the slit image projected by the slit projecting means to pickup the image, a light segment extracting circuit including a center position extracting means for extracting a mean position (Z.sub.1 +Z.sub.2)/2 of two position signals Z.sub.1 and Z.sub.2 at which a video signal derived by transversely scanning the slit image by the image pickup means corresponds, to a first higher reference V.sub.1 when the video signal exceeds the first higher reference V.sub.1, a maximum value position extracting circuit for extracting a position Z corresponding to a maximum value of the video signal when the maximum value of the video signal is no higher than the first higher reference V.sub.1 and exceeds a second lower reference V.sub.2 and an erasing means for erasing the position signal when the maximum value of the video signal is no higher than the second lower reference V.sub.2, and a detecting means for detecting undersoldered condition and oversoldered condition by analyzing and evaluating the three-dimensional object based on the light segment position information derived from the light segment extracting circuit.
摘要翻译：一种形状检测装置，包括：狭缝突出装置，用于将缝合图像投射在诸如焊接区域的三维物体上;定位装置，用于相对于狭缝突出装置定位三维物体;图像拾取装置，对由狭缝投影装置投影的狭缝图像进行二维扫描以拾取图像;光段提取电路，包括中心位置提取装置，用于提取两个位置信号Z1和Z2的平均位置（Z1 + Z2）/ 2，通过图像拾取装置横向扫描狭缝图像导出的信号对应于当视频信号超过第一较高参考值V1时的第一较高参考V1，最大值位置提取电路，用于提取对应于最大值的位置Z 当视频信号的最大值不高于第一较高参考V1并且超过第二较低参考值V2和呃时，视频信号当视频信号的最大值不高于第二较低参考值V2时，用于擦除位置信号的灰度装置;以及检测装置，用于通过基于光段对三维物体进行分析和评估来检测底部状态和过弯状态从光段提取电路得到的位置信息。

7. 发明授权

US5059559A Method of aligning and bonding tab inner leads 失效
标题翻译：对准和粘接标签内引线的方法
公开(公告)号：US5059559A
公开(公告)日：1991-10-22
申请号：US265704
申请日：1988-11-01
申请人： Michio Takahashi , Tooru Mita , Yasuo Nakagawa , Toshimitsu Hamada , Hisafumi Iwata , Aizo Kaneda , Kouji Serizawa , Hiroyuki Tanaka , Koichi Sugimoto , Toshihiko Sakai , Keizo Matsukawa , Tsutomu Mimata
发明人： Michio Takahashi , Tooru Mita , Yasuo Nakagawa , Toshimitsu Hamada , Hisafumi Iwata , Aizo Kaneda , Kouji Serizawa , Hiroyuki Tanaka , Koichi Sugimoto , Toshihiko Sakai , Keizo Matsukawa , Tsutomu Mimata
IPC分类号： H01L21/00 , H01L21/603
CPC分类号： H01L21/67144 , H01L24/50 , Y10T29/49121
摘要： The present invention relates to a multi-pin chip mounting method and apparatus based on a TAB (Tape Automated Bonding) system in which leads formed on a tape and bumps formed an IC chip are aligned with each other and compress-bonded to each other. An IC chip having bumps formed on a surface thereof and inner leads formed on a carrier tape are disposed opposite to each other at a bonding station. A position of the IC chip on a stage is detected through the inner leads at the bonding station to determine the amount of correction of position of the stage. The inner leads and the IC chip are aligned with each other on the basis of the determined correction amount and are thereafter bonded to each other.
摘要翻译：本发明涉及一种基于TAB（磁带自动接合）系统的多针芯片安装方法和装置，其中形成在磁带上的引线和形成IC芯片的凸起彼此对准并且彼此压接。在其表面形成有凸起的IC芯片和形成在载带上的内部引线在接合台处彼此相对设置。通过焊接台的内部引线检测台架上的IC芯片的位置，以确定台阶位置的校正量。内部引线和IC芯片基于确定的校正量彼此对准，然后彼此结合。

8. 发明授权

US4872187A X-ray tomographic imaging system and method 失效
标题翻译： X射线断层成像系统及方法
公开(公告)号：US4872187A
公开(公告)日：1989-10-03
申请号：US156179
申请日：1988-02-16
申请人： Kozo Nakahata , Toshimitsu Hamada , Yasuo Nakagawa , Mineo Nomoto
发明人： Kozo Nakahata , Toshimitsu Hamada , Yasuo Nakagawa , Mineo Nomoto
IPC分类号： G01N23/04 , G01N23/18
CPC分类号： G01N23/18 , G01N23/046 , G01N2223/419
摘要： In an X-ray tomographic imaging system and method, an object to be inspected is irradiated with X-rays from an X-ray source to obtain an X-ray transmission image of the object. The X-ray transmission image is converted by an X-ray fluorescence image intensifier into a detection image. The intensity of the detection image is also intensified by the X-ray fluorescence image intensifier. A photo-electric converter converts the intensified detection image from the X-ray fluorescence image intensifier into an electrical signal. The object to be inspected is held by an object holder rotatably at a position in proximity to the X-ray source and movably in a direction of the axis of rotation of the object and a direction perpendicular to the rotation axis. The electrical signal from the photo-electric converter is processed to a cross-sectional image.
摘要翻译：在X射线层析成像系统和方法中，从X射线源照射X射线检查对象物，得到被检体的X射线透过图像。通过X射线荧光图像增强器将X射线透射图像转换成检测图像。 X射线荧光图像增强器也增强了检测图像的强度。光电转换器将强化的检测图像从X射线荧光图像增强器转换成电信号。待检查对象由物体保持器可旋转地保持在靠近X射线源的位置，并且可沿物体的旋转轴线和垂直于旋转轴线的方向移动。来自光电转换器的电信号被处理成横截面图像。

9. 发明授权

US5015097A Method for inspecting filled state of via-holes filled with fillers and apparatus for carrying out the method 失效
标题翻译：用于检查填充有填充物的通孔的填充状态的方法和用于执行该方法的装置
公开(公告)号：US5015097A
公开(公告)日：1991-05-14
申请号：US416934
申请日：1989-10-04
申请人： Mineo Nomoto , Takanori Ninomiya , Hiroya Koshishiba , Toshimitsu Hamada , Yasuo Nakagawa
发明人： Mineo Nomoto , Takanori Ninomiya , Hiroya Koshishiba , Toshimitsu Hamada , Yasuo Nakagawa
IPC分类号： G01N21/88 , G01N21/956 , G06T7/00 , H05K3/00 , H05K3/40
CPC分类号： G06T7/0004 , G01N21/95692 , G06T7/604 , G01N2021/95653 , G01N21/8806 , G06T2207/30141
摘要： A method for inspecting the filled state of a plurality of via-holes which pass through a non-conductive circuit board and are filled with a conductive substance and an apparatus for carrying out the method are disclosed.The surface of the circuit board is illuminated in two directions to generate shadows depending on the concave or convex state of the fillers in a plurality of via-holes. An optical image of the illuminated surface of the circuit board is detected. Each edge of the two shadow areas, which exist in the detected optical image and are generated in one via-hole by light irradiation in two directions, is detected. Whether the filler in this one via-hole is in the concave state or convex state is identified according to the mutual position relationship of the detected edges. The length of each shadow area is detected, and whether the concave state or convex state of the filler is within a predetermined allowance is decided according to the detection results. The area of the image of the filler is detected according to differences between the brightness of the board surface or of the via-hole wall and the brightness of the filler in the via-hole in the detected optical image, and whether the filler is lacking or not is decided according to the detection result.
摘要翻译：公开了一种用于检查通过非导电电路板并填充有导电物质的多个通孔的填充状态的方法和用于实施该方法的装置。电路板的表面在两个方向上被照亮，以产生取决于多个通孔中的填料的凹凸状态的阴影。检测电路板的被照射表面的光学图像。检测存在于所检测的光学图像中并且在两个方向上通过光照射在一个通孔中产生的两个阴影区域的每个边缘。根据检测到的边缘的相互位置关系来识别该通孔中的填充物是处于凹状还是凸状状态。检测每个阴影区域的长度，根据检测结果确定填料的凹状或凸状状态是否处于预定的余量内。根据检测到的光学图像中的基板表面或通孔壁的亮度与通孔中的填充物的亮度之间的差异来检测填充物的图像的面积，以及填充材料是否缺乏是否根据检测结果决定。

10. 发明授权

US4772125A Apparatus and method for inspecting soldered portions 失效
标题翻译：用于检查焊接部分的装置和方法
公开(公告)号：US4772125A
公开(公告)日：1988-09-20
申请号：US875974
申请日：1986-06-19
申请人： Kazushi Yoshimura , Takashi Hiroi , Takanori Ninomiya , Toshimitsu Hamada , Yasuo Nakagawa , Kohichi Karasaki
发明人： Kazushi Yoshimura , Takashi Hiroi , Takanori Ninomiya , Toshimitsu Hamada , Yasuo Nakagawa , Kohichi Karasaki
IPC分类号： G01B11/24 , G01N21/64 , G01N21/88 , G01N21/956 , G06T7/00
CPC分类号： G06T7/0006 , G01N21/95684 , G01N2021/95646 , G01N21/64 , G06T2207/10064 , G06T2207/30152
摘要： An apparatus for inspecting an appearance of soldered portions connected between the pads formed on a printed circuit board and leads of an electronic body part. A slit light beam is directed to portions to be inspected and scanned thereon with a light fluorescent image generated from the substrate portion of the printed circuit board and a dark fluorescent image generated from the leads, pads and soldered portions being detected with an image signal being generated in accordance therewith. The image signal is binarized and different functions are extracted from the binarized signal which functions are utilized in connection with other functions and previously obtained data to determine whether an abnormal portion is present or not in a predetermined position on the circuit board.
摘要翻译：一种用于检查连接在形成在印刷电路板上的焊盘和电子主体部分的引线之间的焊接部分的外观的装置。利用从印刷电路板的基板部分产生的荧光图像将狭缝光束引导到要检查和扫描的部分，并且从引线，焊盘和焊接部分产生的暗荧光图像被图像信号检测到根据其产生。图像信号被二值化，并且从二值化信号中提取不同的功能，该功能与其他功能相关联使用，并且先前获得的数据用于确定在电路板上的预定位置是否存在异常部分。

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