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1. 发明专利

JP2006230375A Water sensor 审中-公开
标题翻译：水传感器
公开(公告)号：JP2006230375A
公开(公告)日：2006-09-07
申请号：JP2005078022
申请日：2005-02-21
申请人： ▲広▼居喬 , Takashi Hiroi
发明人： HIROI TAKASHI
IPC分类号： A01G27/00 , G01N5/02
摘要： PROBLEM TO BE SOLVED: To improve an irrational water supply that is positive water supply in which in an automatic water supply apparatus of pot or planter, a bottle charged with water and having a tapered nozzle is invertedly driven into soil in the pot or water is quantitatively supplied from a water supply pump at a time set by a timer and which is not water supply of perceiving the dry state of soil in the pot and to provide an automatic water supply apparatus suitable for growth of plants by developing a water sensor with which the dry state and the amount of soil in a pot are automatically perceived.
SOLUTION: The tubular water sensor having a water sensing part with a trick in which in a structure (4) that nips a revolving shaft and has a water absorption part equipped with a water retention material at one side and a weight to balance the water absorption part at the other, when the water retention part sufficiently absorbs water, the water absorption part is dropped downward and when the water retention part is dried, the weight is dropped downward is arranged at the bottom of a pot and is interlocked with a water supply pump.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了改善正向供水的不合理供水，其中在锅或种植机的自动供水装置中，装有水并具有锥形喷嘴的瓶子被倒置成锅中的土壤或水由定时器设定的时间从供水泵定量供给，并且不是感知罐中土壤的干燥状态的供水，并且提供适于通过开发水来生长植物的自动供水装置传感器，干燥状态和锅中的土壤量自动被感知。解决方案：管状水传感器具有水感测部分，其具有捣蛋的结构（4），其在一侧旋转旋转轴并具有在一侧配备有保水材料的吸水部分和平衡重量吸水部在另一方面，当保水部充分吸水时，吸水部向下方落下，当保水部干燥时，重量向下落下配置在锅底部并与供水泵。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2008080078A Float type water trap 审中-公开
标题翻译： FLOAT型水带
公开(公告)号：JP2008080078A
公开(公告)日：2008-04-10
申请号：JP2006290509
申请日：2006-09-28
申请人： ▲広▼居喬 , Takashi Hiroi
发明人： HIROI TAKASHI
IPC分类号： A47K3/00
摘要： PROBLEM TO BE SOLVED: To correctly trap floating matter on the water surface in a bathtub to clean the water for solving the problem of discomfort as well as dirtiness given to users by the floating matter on the water surface in the bathtub because a plurality of people use the same water to leave a lot of floating matter on the water surface in the bathtub in an ordinary household bath since a separate purification device is rarely equipped, and as a water suction port exists on a wall surface at about 15 cm from the bottom of the bathtub, resulting in difficulty discharging the floating matter on the water surface even when the purification device is equipped.
SOLUTION: A water tank with a float is composed to have a water suction port on top of the water tank, with the float installed on op of the water tank as well, and a water suction pipe is installed through the float at the top to penetrate it to reach the water tank below. The water suction pipe of the float type water trap is connected to a suction water feed pump, a filter, etc., to form a circulation purification system to return water to the bathtub. The floating matter on the water surface in the bathtub is thus eliminated.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了正确地将浮游物质捕获在浴缸的水面上以清洁水以解决浴缸中水面上的浮动物质给用户带来的不适以及污垢的问题，因为许多人在普通家用浴缸中使用相同的水在浴缸的水面上留下大量浮动物质，因为单独的净化装置很少装备，并且作为吸水口存在于约15cm的壁表面即使在安装了净化装置的情况下，也难以从水浴面排出浮游物质。
解决方案：具有浮子的水箱组成在水箱顶部具有吸水口，浮子也安装在水箱上，吸水管通过浮子安装在顶部穿透它到达下面的水箱。浮子式集水器的吸水管连接到吸水泵，过滤器等，形成循环净化系统，将水回到浴缸。因此，消除了浴缸中水面上的浮动物质。版权所有（C）2008，JPO＆INPIT

3. 发明申请

US20130119250A1 DEFECT INSPECTION METHOD, AND DEVICE THEREOF 有权
标题翻译：缺陷检查方法及其设备
公开(公告)号：US20130119250A1
公开(公告)日：2013-05-16
申请号：US13697025
申请日：2011-04-05
申请人： Naoki Hosoya , Toshifumi Honda , Takashi Hiroi
发明人： Naoki Hosoya , Toshifumi Honda , Takashi Hiroi
IPC分类号： H01J37/28 , H01J37/22
CPC分类号： H01J37/28 , G06T7/001 , G06T7/136 , G06T2207/10061 , G06T2207/30148 , H01J37/222 , H01L22/12
摘要： A conventional pattern inspection, which compares an image to be inspected with a reference image and subjects the resulting difference value to the defect detection using the threshold of defect determination, has difficulty in highly-sensitive inspection. Because defects occur only in specific circuit pattern sections, false reports occur in the conventional pattern inspections which are not based on the position. Disclosed are a defect inspection method and a device thereof which perform a pattern inspection by acquiring a GP image in advance, designating a place to be inspected and a threshold map to the GP image on the GUI, setting the identification reference of the defects, next acquiring the image to be inspected, applying the identification reference to the image to be inspected, and identifying the defects with the identification reference, thereby enabling the highly-sensitive inspection.
摘要翻译：将待检查的图像与参考图像进行比较并将得到的差分值与使用缺陷确定的阈值进行缺陷检测相对照的常规图案检查在高灵敏度检查中是困难的。因为缺陷仅在特定的电路图形部分中发生，所以在常规图案检查中出现虚假报告，而不是基于位置。公开了一种缺陷检查方法及其装置，其通过事先获取GP图像，指定待检查地点和GUI上的GP图像的阈值图来进行图案检查，设置缺陷的识别参考，下一步获取要检查的图像，将所述识别参考应用于要检查的图像，以及使用所述识别参考来识别所述缺陷，由此实现高度敏感的检查。

4. 发明申请

US20120305768A1 Circuit-Pattern Inspection Device 有权
标题翻译：电路图形检测装置
公开(公告)号：US20120305768A1
公开(公告)日：2012-12-06
申请号：US13577719
申请日：2011-02-21
申请人： Takuma Yamamoto , Takashi Hiroi , Yusuke Ominami
发明人： Takuma Yamamoto , Takashi Hiroi , Yusuke Ominami
IPC分类号： G01N23/225
CPC分类号： H01J37/28 , H01J2237/2811 , H01J2237/2817 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： Provided is a circuit-pattern inspection device which enables efficient inspection of a semiconductor wafer by selectively inspecting areas on the semiconductor wafer, such as boundaries between patterns thereon, where defects are likely to occur during the step of producing the semiconductor wafer while changing the beam scanning direction for each area. Two-dimensional beam-deflection control is employed for inspection operations in a continuous-stage-movement-type circuit-pattern inspection device in which only one-dimensional scanning has been employed conventionally. That is, by employing a combination of an electron-beam-deflection control in a first direction parallel to the stage-movement direction and an electron-beam-deflection control in a second direction intersecting the stage-movement direction, it is possible to obtain an image of any desired area for inspection that is set within a swath. The amplitude of deflection signals for the electron-beam-deflection and the rise and fall timings of the signals are suitably controlled according to inspection conditions.
摘要翻译：提供一种电路图案检查装置，其能够通过选择性地检查半导体晶片上的区域，例如在其上的图案之间的边界上的区域，从而有效地检查半导体晶片，其中在制造半导体晶片的步骤期间可能会发生缺陷，同时改变光束每个区域的扫描方向。在通常仅采用一维扫描的连续级移动型电路图案检查装置中，进行二维光束偏转控制。也就是说，通过在平行于载物台移动方向的第一方向上的电子束偏转控制和与载物台移动方向相交的第二方向上的电子束偏转控制的组合，可以获得任何所需的检查区域的图像，其设置在条纹内。根据检查条件适当地控制电子束偏转的偏转信号的幅度和信号的上升和下降定时。

5. 发明授权

US07889911B2 Image processing unit for wafer inspection tool 有权
标题翻译：晶圆检测工具图像处理单元
公开(公告)号：US07889911B2
公开(公告)日：2011-02-15
申请号：US12170532
申请日：2008-07-10
申请人： Michio Nakano , Shigeya Tanaka , Yoshiyuki Momiyama , Takashi Hiroi , Kazuya Hayashi , Dai Fujii , Takako Fujisawa , Atsushi Ichige , Ichiro Kawashima
发明人： Michio Nakano , Shigeya Tanaka , Yoshiyuki Momiyama , Takashi Hiroi , Kazuya Hayashi , Dai Fujii , Takako Fujisawa , Atsushi Ichige , Ichiro Kawashima
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G06T2200/28 , G06T2207/30148
摘要： An image processing apparatus for wafer inspection tool that is able to perform continuously cell to cell comparison inspection, die to die comparison inspection, and cell-to-cell and die-to-die hybrid comparison inspection, employing a plurality of processors. This image processing apparatus for wafer inspection tool comprises a plurality of processors for performing parallel processing, means for cutting out image data including a forward end overlap and a rear end overlap at partition boundaries in order to cut serial data into a predetermined image size, means for distributing the cutout image data to the plurality of processors, and means for assembling results of processing performed by the plurality of processors. The forward end overlap is set greater than a pitch of the cell subject to cell to cell comparison inspection.
摘要翻译：一种用于晶片检查工具的图像处理装置，其能够执行连续的单元到单元比较检查，管芯到管芯比较检查，以及使用多个处理器的单元到单元和管芯到管芯之间的混合比较检查。这种晶片检查工具的图像处理装置包括用于执行并行处理的多个处理器，用于在分区边界处切出包括前端重叠和后端重叠的图像数据的装置，以便将串行数据切割成预定图像尺寸用于将剪切图像数据分配给多个处理器，以及用于组装由多个处理器执行的处理结果的装置。前端重叠被设定为大于细胞对细胞比较检查的细胞的间距。

6. 发明申请

US20100193686A1 Electron Beam Exposure Or System Inspection Or Measurement Apparatus And Its Method And Height Detection Apparatus 有权
标题翻译：电子束曝光或系统检测或测量装置及其方法和高度检测装置
公开(公告)号：US20100193686A1
公开(公告)日：2010-08-05
申请号：US12754181
申请日：2010-04-05
申请人： Masahiro Watanabe , Takashi Hiroi , Maki Tanaka , Hiroyuki Shinada , Yasutsugu Usami
发明人： Masahiro Watanabe , Takashi Hiroi , Maki Tanaka , Hiroyuki Shinada , Yasutsugu Usami
IPC分类号： H01J37/28 , G01N23/22
CPC分类号： H01J37/3174 , B82Y10/00 , B82Y40/00 , H01J37/20 , H01J37/21 , H01J37/222 , H01J37/226 , H01J37/265 , H01J37/28 , H01J37/304 , H01J2237/20235 , H01J2237/20292 , H01J2237/216 , H01J2237/2445 , H01J2237/24578 , H01J2237/2482 , H01J2237/2487 , H01J2237/2814 , H01J2237/2817 , H01J2237/2826 , H01J2237/304 , H01J2237/3175
摘要： An electron beam apparatus equipped with a height detection system includes an electron beam unit emitting an electron beam to the specimen, and a height detection system for detecting height of the specimen which is set on a table. The height detection system includes an illumination system configured to direct first and second beams of light through a mask with a multi-slit pattern to a surface of the specimen at substantially opposite azimuth angles and at substantially equal angles of incidence, first and second detectors which respectively detect first and second multi-slit images of the first and second beams reflected from the specimen and generate output signals thereof, and a device which receives the output signals and generates a comparison signal which is responsive to the height of the specimen. An objective lens of the electron beam unit is controlled in accordance with the comparison signal.
摘要翻译：配备有高度检测系统的电子束装置包括向样本发射电子束的电子束单元和用于检测设置在桌子上的样本的高度的高度检测系统。高度检测系统包括照明系统，其被配置为将第一和第二光束通过具有多狭缝图案的掩模以基本上相反的方位角和基本上相等的入射角度引导到样本的表面，第一和第二检测器分别检测从样本反射的第一和第二光束的第一和第二多个狭缝图像，并产生其输出信号;以及接收输出信号并产生响应于样本的高度的比较信号的装置。根据比较信号控制电子束单元的物镜。

7. 发明授权

US07728294B2 Semiconductor wafer inspection tool and semiconductor wafer inspection method 失效
标题翻译：半导体晶圆检查工具和半导体晶圆检查方法
公开(公告)号：US07728294B2
公开(公告)日：2010-06-01
申请号：US11808247
申请日：2007-06-07
申请人： Takashi Hiroi , Kenji Tanimoto , Yuko Sasaki , Hiroshi Makino
发明人： Takashi Hiroi , Kenji Tanimoto , Yuko Sasaki , Hiroshi Makino
IPC分类号： H01J37/21 , H01J37/26
CPC分类号： H01J37/20 , G01R31/307 , H01J37/222 , H01J37/244 , H01J37/28 , H01J2237/2008 , H01J2237/20235 , H01J2237/20292 , H01J2237/221 , H01J2237/24564 , H01J2237/24592 , H01J2237/28
摘要： A semiconductor wafer inspection tool and a semiconductor wafer inspection method capable of conducting an inspection under appropriate conditions in any one of an NVC (Negative Voltage Contrast) mode and a PVC (Positive Voltage Contrast) mode is provided. Primary electrons 2 are irradiated onto a wafer to be inspected 6 and the irradiation position thereof is scanned in an XY direction. Secondary electrons (or reflected electrons) 10 from the wafer to be inspected 6 are controlled by a charge control electrode 5 and detected by a sensor 11. An image processor converts a detection signal from the sensor 11 to a detected image, compares the detected image with a predetermined reference image, judges defects, an overall control section 14 selects inspection conditions from recipe information for each wafer to be inspected 6 and sets a voltage to be applied to the charge control electrode 5. A Z stage 8 sets the distance between the wafer to be inspected 6 and the charge control electrode 5 according to this voltage.
摘要翻译：提供能够在适当条件下进行NVC（负电压对比度）模式和PVC（正电压对比度）模式中的任一种的半导体晶片检查工具和半导体晶片检查方法。将一次电子2照射到要检查的晶片6上，并且其XY照射位置被扫描。来自待检查晶片的二次电子（或反射电子）10由充电控制电极5控制并由传感器11检测。图像处理器将来自传感器11的检测信号转换为检测图像，通过预定的参考图像判断缺陷，总体控制部分14从每个要检查的晶片的配方信息中选择检查条件6并设置要施加到充电控制电极5的电压.Za级8设置晶片之间的距离根据该电压检查6和充电控制电极5。

8. 发明授权

US07521676B2 Method and apparatus for inspecting pattern defects and mirror electron projection type or multi-beam scanning type electron beam apparatus 有权
标题翻译：用于检查图案缺陷和镜电子投影型或多光束扫描型电子束装置的方法和装置
公开(公告)号：US07521676B2
公开(公告)日：2009-04-21
申请号：US11601723
申请日：2006-11-20
申请人： Hirohito Okuda , Takashi Hiroi , Masaki Hasegawa , Shigeya Tanaka
发明人： Hirohito Okuda , Takashi Hiroi , Masaki Hasegawa , Shigeya Tanaka
IPC分类号： G01N23/225
CPC分类号： H01J37/026 , H01J37/292 , H01J2237/0048 , H01J2237/2817
摘要： The present invention provides a mirror electron projection (MPJ) type (SEPJ type included) scanning electron beam apparatus that is capable of performing condition setup, and a method and apparatus for inspecting pattern defects with the scanning electron beam apparatus. A mirror electron projection type defect inspection apparatus, which comprises a charging device for emitting a charging electron beam, electron beam irradiation means for shedding a mirror electron projection electron beam onto an inspection region near which an electrical potential distribution is formed, detection means for detecting secondary electrons or reflected electrons generated from a surface and proximity of the specimen, and defect detection means for detecting a defect by processing a mirror image signal that is detected by the detection means, includes irradiation condition optimization means for optimizing charging electron beam irradiation conditions.
摘要翻译：本发明提供一种能够进行条件建立的镜电子投射（MPJ）型（包括SEPJ型）扫描电子束装置，以及用扫描电子束装置检查图案缺陷的方法和装置。镜电子投影型缺陷检查装置，其包括用于发射充电电子束的充电装置，用于将镜电子投影电子束切除到形成有电位分布的检查区域的电子束照射装置，用于检测从检体的表面和邻近产生的二次电子或反射电子，以及用于通过处理由检测装置检测出的镜像信号来检测缺陷的缺陷检测装置，包括用于优化充电电子束照射条件的照射条件优化装置。

9. 发明申请

US20080302964A1 METHOD AND APPARATUS FOR INSPECTING INTEGRATED CIRCUIT PATTERN 有权
标题翻译：用于检查集成电路图案的方法和装置
公开(公告)号：US20080302964A1
公开(公告)日：2008-12-11
申请号：US12190388
申请日：2008-08-12
申请人： Hiroyuki Shinada , Mari Nozoe , Haruo Yoda , Kimiaki Ando , Katsuhiro Kuroda , Yutaka Kaneko , Maki Tanaka , Shunji Maeda , Hitoshi Kubota , Aritoshi Sugimoto , Katsuya Sugiyama , Atsuko Takafuji , Yusuke Yajima , Hiroshi Tooyama , Tadao Ino , Takashi Hiroi , Kazushi Yoshimura , Yasutsugu Usami
发明人： Hiroyuki Shinada , Mari Nozoe , Haruo Yoda , Kimiaki Ando , Katsuhiro Kuroda , Yutaka Kaneko , Maki Tanaka , Shunji Maeda , Hitoshi Kubota , Aritoshi Sugimoto , Katsuya Sugiyama , Atsuko Takafuji , Yusuke Yajima , Hiroshi Tooyama , Tadao Ino , Takashi Hiroi , Kazushi Yoshimura , Yasutsugu Usami
IPC分类号： G01N23/00 , G01R31/305
CPC分类号： G01R31/305 , G01R31/307 , H01J37/28 , H01J2237/2817
摘要： A circuit pattern inspection method and an apparatus therefor, in which the whole of a portion to be inspected of a sample to be inspected is made to be in a predetermined changed state, the portion to be inspected is irradiated with an image-forming high-density electron beam while scanning the electron beam, secondary charged particles are detected at a portion irradiated with the electron beam after a predetermined period of time from an instance when the electron beam is irradiated, an image is formed on the basis of the thus detected secondary charged particle signal, and the portion to be inspected is inspected by using the thus formed image.
摘要翻译：电路图案检查方法及其装置，其中待检查的样品的待检查部分的整体部分处于预定的改变状态，被检查的部分用成像高分辨率照射，在扫描电子束时，在从电子束照射的时刻起经过规定的时间后，在照射电子束的部分检测到二次带电粒子，根据这样检测的次级通过使用如此形成的图像来检查带电粒子信号，并检查待检查的部分。

10. 发明申请

US20050263703A1 Pattern inspection method and apparatus using electron beam 失效
标题翻译：使用电子束的图案检查方法和装置
公开(公告)号：US20050263703A1
公开(公告)日：2005-12-01
申请号：US11176344
申请日：2005-07-08
申请人： Takashi Hiroi , Asahiro Kuni , Masahiro Watanabe , Chie Shishido , Hiroyuki Shinada , Yasuhiro Gunji , Atsuko Takafuji
发明人： Takashi Hiroi , Asahiro Kuni , Masahiro Watanabe , Chie Shishido , Hiroyuki Shinada , Yasuhiro Gunji , Atsuko Takafuji
IPC分类号： G01N23/04 , G01N23/20 , G01N23/225 , G01Q30/04 , G02F1/13 , G06T1/00 , G21K7/00 , H01J37/22 , H01J37/244 , H01J37/28
CPC分类号： H01J37/244 , H01J37/28 , H01J2237/24465 , H01J2237/2817
摘要： A pattern inspection method and apparatus in which a charged particle beam is irradiated onto a surface of a specimen on which a pattern is formed, plural sensors simultaneously detect secondary particles emanated from the surface of the specimen by the irradiation, signals outputted from each sensor of the plural sensors which simultaneously detect the secondary particles are added, an image of the surface of the specimen on which the pattern is obtained from the added signals, and the image is processed to detect a defect of the pattern.
摘要翻译：一种图案检查方法和装置，其中带电粒子束照射到形成有图案的样本的表面上，多个传感器同时检测通过照射从样品表面发出的二次颗粒，从每个传感器输出的信号添加同时检测二次粒子的多个传感器，从附加的信号中添加从其获得图案的样本的表面的图像，并且处理图像以检测图案的缺陷。

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