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    • 1. 发明授权
    • Microelectromechanical structures defined from silicon on insulator wafers
    • 由绝缘体上硅晶片定义的微机电结构
    • US06362512B1
    • 2002-03-26
    • US09468423
    • 1999-12-21
    • Joel A. KubbyJingkuang ChenAlex T. Tran
    • Joel A. KubbyJingkuang ChenAlex T. Tran
    • H01L2982
    • B81B3/0083B81C2201/0109B81C2201/019B81C2201/0191B81C2201/053G02B6/4214
    • A device structure is defined in a single-crystal silicon (SCS) layer separated by an insulator layer, such as an oxide layer, from a handle wafer. The SCS can be attached to the insulator by wafer bonding, and is selectively etched, as by photolithographic patterning and dry etching. A sacrificial oxide layer can be deposited on the etched SCS, on which polysilicon can be deposited. A protective oxide layer is deposited, and CMOS circuitry and sensors are integrated. Silicon microstructures with sensors connected to CMOS circuitry are released. In addition, holes can be etched through the sacrificial oxide layer, sacrificial oxide can be deposited on the etched SCS, polysilicon can be deposited on the sacrificial oxide, PSG can be deposited on the polysilicon layer, which both can then be patterned.
    • 器件结构被限定在由来自处理晶片的绝缘体层(例如氧化物层)分离的单晶硅(SCS)层中。 SCS可以通过晶片接合连接到绝缘体,并且通过光刻图案和干蚀刻被选择性地蚀刻。 可以在蚀刻的SCS上沉积牺牲氧化物层,在其上沉积多晶硅。 沉积保护性氧化物层,并集成CMOS电路和传感器。 释放了连接到CMOS电路的传感器的硅微结构。 此外,可以通过牺牲氧化物层蚀刻孔,牺牲氧化物可以沉积在蚀刻的SCS上,多晶硅可以沉积在牺牲氧化物上,PSG可以沉积在多晶硅层上,然后可以对其进行图案化。
    • 8. 发明授权
    • Monolithic spectrophotometer
    • 单片分光光度计
    • US06249346B1
    • 2001-06-19
    • US09467185
    • 1999-12-20
    • Jingkuang ChenJoel A. Kubby
    • Jingkuang ChenJoel A. Kubby
    • G01J336
    • G01J3/18G01J3/02G01J3/0218G01J3/0256G01J3/0259G01J3/2803
    • A micro spectrophotometer is monolithically constructed on a silicon substrate. The spectrophotometer includes a concave grating, which is used for dispersing optical waves as well as focusing reflected light onto a photodiode array sited on a silicon bridge. The silicon bridge is bent 90° from the surface of the silicon substrate in order to orthogonally intersect the output light from the grating. A precision notch is defined in the silicon substrate for coupling to an optical input fiber. Signal processing circuitry is etched on the substrate using conventional CMOS processes for initial processing of information received from the photodiode array.
    • 微型分光光度计在硅衬底上单片构造。 分光光度计包括凹光栅,其用于分散光波以及将反射光聚焦到位于硅桥上的光电二极管阵列上。 硅桥从硅衬底的表面弯曲90°,以便与光栅的输出光正交相交。 在硅衬底中限定了用于耦合到光输入光纤的精密凹口。 使用常规CMOS工艺在衬底上蚀刻信号处理电路,用于对从光电二极管阵列接收的信息进行初始处理。