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1. 发明申请

WO2012166333A2 COATING FORMULATIONS FOR OPTICAL ELEMENTS 审中-公开
标题翻译：光学元件涂料配方
公开(公告)号：WO2012166333A2
公开(公告)日：2012-12-06
申请号：PCT/US2012/037734
申请日：2012-05-14
申请人： HONEYWELL INTERNATIONAL INC. , VARAPPRASAD, Desaraju , KOROLEV, Boris , MUKHOPADHYAY, Sudip
发明人： VARAPPRASAD, Desaraju , KOROLEV, Boris , MUKHOPADHYAY, Sudip
IPC分类号： C09D1/00 , G02B1/11 , B05D1/00
CPC分类号： G02B1/111 , C09D1/00 , C09D5/006 , C09D7/20 , C09D183/02
摘要： Anti-reflective coatings and coating formulations, optical elements and processes for preparing coating formulations and optical elements are described. The coating formulations are formed from at least one alkoxysilane material and at least one high boiling solvent. The coating formulation may be applied using roller coat processes.
摘要翻译：描述了防反射涂层和涂层配方，光学元件以及用于制备涂层配方和光学元件的方法。涂料制剂由至少一种烷氧基硅烷材料和至少一种高沸点溶剂形成。可以使用辊涂工艺涂布涂料。

2. 发明申请

WO2002081546A1 LOW DIELECTRIC CONSTANT MATERIALS AND METHODS OF PREPARATION THEREOF 审中-公开
标题翻译：低介电常数材料及其制备方法
公开(公告)号：WO2002081546A1
公开(公告)日：2002-10-17
申请号：PCT/US2001/032569
申请日：2001-10-18
申请人： HONEYWELL INTERNATIONAL INC. , APEN, Paul , LAU, Kreisler , LIU, Feng Quan , KOROLEV, Boris , BROUK, Emma , ZHEREBIN, Ruslan , NALEWAJEK, David , LEUNG, Roger
发明人： APEN, Paul , LAU, Kreisler , LIU, Feng Quan , KOROLEV, Boris , BROUK, Emma , ZHEREBIN, Ruslan , NALEWAJEK, David , LEUNG, Roger
IPC分类号： C08G63/78
CPC分类号： C08G61/12 , C07C13/615 , C07C13/64 , C07C15/54 , C07C17/10 , C07C17/269 , C07C2603/74 , C07C2603/90 , C07F7/0809 , C08F238/00 , C08G61/02 , H01L2924/0002 , C07C23/46 , C07C25/22 , H01L2924/00
摘要： The present invention is directed to low dielectric polymers and to methods of producing these low dielectric constant polymers, dielectric materials and layers, and electronic components. In one aspect of the present invention, an isomeric mixture of thermosetting monomers, wherein the monomers have a core structure and a plurality of arms, is provided, and the isomeric mixture of thermosetting monomers is polymerized, wherein polymerization comprises a reaction of an ethynyl group that is located in at least one arm of a monomer. In yet another aspect of the inventive subject matter, spin-on low dielectric constant materials are formed having a first backbone with an aromatic moiety and a first reactive group, and a second backbone with an aromatic moiety and a second reactive group, wherein the first and second backbone are crosslinked via the first and second reactive groups in a crosslinking reaction preferably without an additional crosslinker, and wherein a cage structure having at least eight (8) atoms is covalently bound to at least one of the first and second backbone.
摘要翻译：本发明涉及低介电聚合物以及生产这些低介电常数聚合物，介电材料和层以及电子元件的方法。在本发明的一个方面，提供其中单体具有核心结构和多个臂的热固性单体的异构体混合物，并且热固性单体的异构体混合物聚合，其中聚合包括乙炔基其位于单体的至少一个臂中。在本发明主题的另一方面，形成旋涂低介电常数材料，其具有具有芳族部分和第一反应性基团的第一主链和具有芳族部分和第二反应性基团的第二主链，其中第一并且第二主链在交联反应中通过第一和第二反应性基团交联，优选不含另外的交联剂，并且其中具有至少八个（8）原子的笼结构共价结合至第一和第二主链中的至少一个。

3. 发明申请

WO2004000909A1 COMPOSITIONS AND METHODS FOR THERMOSETTING MOLECULES IN ORGANIC COMPOSITIONS 审中-公开
标题翻译：用于热分解有机组合物的组合物和方法
公开(公告)号：WO2004000909A1
公开(公告)日：2003-12-31
申请号：PCT/US2003/016450
申请日：2003-05-22
申请人： HONEYWELL INTERNATIONAL INC. , LAU, Kreisler , LIU, Feng Quan , KOROLEV, Boris , BROUK, Emma , ZHEREBIN, Ruslan , NALEWAJEK, David
发明人： LAU, Kreisler , LIU, Feng Quan , KOROLEV, Boris , BROUK, Emma , ZHEREBIN, Ruslan , NALEWAJEK, David
IPC分类号： C08G63/78
CPC分类号： C08G61/02 , C08G61/12 , C08G65/40 , C08G2650/60
摘要： In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arylene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.
摘要翻译：在制备低介电常数聚合物的方法中，提供了一种热固性单体，其中该热固性单体具有笼形化合物或芳基核心结构，以及共价结合笼形化合物或核心结构的多个臂。在随后的步骤中，将热固性单体引入聚合物中以形成低介电常数聚合物，其中掺入聚合物中包含位于至少一个臂中的三键的化学反应。考虑的笼状化合物和核心结构包括金刚烷，二金刚烷，硅，苯基和亚噻吩基，而优选的臂包括亚芳基，支链亚芳基和亚芳基醚。热固性单体可以有利地用于在电子器件中产生低k介电材料，并且聚合物的介电常数可以通过改变臂的整个长度来控制。

4. 发明申请

WO2003007337A2 LOW DIELECTRIC CONSTANT ORGANIC DIELECTRICS BASED ON CAGE-LIKE STRUCTURES 审中-公开
标题翻译：基于笼式结构的低介电常数有机电介质
公开(公告)号：WO2003007337A2
公开(公告)日：2003-01-23
申请号：PCT/US2002/021692
申请日：2002-07-08
申请人： HONEYWELL INTERNATIONAL INC. , LAU, Kreisler , LIU, Feng, Quan , KOROLEV, Boris , BROUK, Emma , ZHEREBIN, Ruslan , LEUNG, Roger
发明人： LAU, Kreisler , LIU, Feng, Quan , KOROLEV, Boris , BROUK, Emma , ZHEREBIN, Ruslan , LEUNG, Roger
IPC分类号： H01L
CPC分类号： C08F257/02 , C08F8/00 , C08G61/02 , C08G61/12 , C08G81/00 , C08L51/003 , H01B3/307 , H01B3/427 , C08L2666/02
摘要： A low dielectric constant material has a first backbone with an aromatic moiety and a first reactive group, and a second backbone with an aromatic moiety and a second reactive group, wherein the first and second backbones are crosslinked via the first and second reactive groups in a crosslinking reaction without an additional crosslinker, and wherein a cage structure having at least 10 atoms is covalently bound to at least one of the first and second backbone.
摘要翻译：低介电常数材料具有具有芳族部分和第一反应性基团的第一主链和具有芳族部分和第二反应性基团的第二主链，其中第一和第二主链经由第一和第二反应性基团在交联反应而没有额外的交联剂，并且其中具有至少10个原子的笼状结构与第一和第二主链中的至少一个共价结合。

5. 发明申请

WO2002083327A1 LAYERED STACKS AND METHODS OF PRODUCTION THEREOF 审中-公开
标题翻译：分层堆叠及其生产方法
公开(公告)号：WO2002083327A1
公开(公告)日：2002-10-24
申请号：PCT/US2002/011927
申请日：2002-04-16
申请人： HONEYWELL INTERNATIONAL INC. , THOMAS, Michael , DANIELS, Brian , APEN, Paul , NAMAN, Ananth , IWAMOTO, Nancy , KOROLEV, Boris , LI, Bo
发明人： THOMAS, Michael , DANIELS, Brian , APEN, Paul , NAMAN, Ananth , IWAMOTO, Nancy , KOROLEV, Boris , LI, Bo
IPC分类号： B05D7/00
CPC分类号： H01L21/02126 , H01L21/02203 , H01L21/02216 , H01L21/02282 , H01L21/02304 , H01L21/02362 , H01L21/312 , H01L21/3122 , H01L21/31695 , H01L21/76807 , H01L21/76828 , H05K1/0313
摘要： Low dielectric constant layered materials and a methof for making said layered materials comprising the steps of: a) providing a surface ; b) spinning a dielectric material on to the surface; c) curing the dielectric material to form a dielectric layer; d) spinning a low dielectric constant material on to the dielectric layer; and e) curing the low dielectric constant material to form a low dielectric constant layer. Each layer can be spun-on to the layered component and subsequently cured before additional layers are added or all layers can be spun-on to the layered component and then the entire stack is cured at once.
摘要翻译：低介电常数层状材料和制造所述层状材料的方法包括以下步骤：a）提供表面; b）将介电材料旋转到表面上; c）固化电介质材料以形成电介质层; d）将低介电常数材料旋转到介电层上; 以及e）固化所述低介电常数材料以形成低介电常数层。每个层可以旋涂到层状部件上，随后在添加另外的层之前固化，或者所有层可以旋涂到层状部件上，然后整个堆叠立即固化。

6. 发明申请

WO2014035468A1 HIGHLY DURABLE ANTI-REFLECTIVE COATINGS 审中-公开
标题翻译：高耐用抗反射涂层
公开(公告)号：WO2014035468A1
公开(公告)日：2014-03-06
申请号：PCT/US2013/029001
申请日：2013-03-05
申请人： HONEYWELL INTERNATIONAL INC.
发明人： MUKHOPADHYAY, Sudip , GEBREBRHAN, Amanuel , KOROLEV, Boris , VARAPRASAD, Desaraju , LIU, Ya Qun , JIANG, Yunzi
IPC分类号： C09D183/00 , C09D183/06 , G02B1/10
CPC分类号： C09D5/006 , C08G77/30 , C08G77/395 , C08G77/398 , C08K3/32 , C08K2003/329 , C09D183/04 , C09D183/08 , G02B1/11 , G02B1/111
摘要： A chemically modified anti-reflective (AR) coating is provided having improved durability. The AR coating may be a polymerized alkoxy siloxane-based material that includes a densifier in the form of an organic or inorganic phosphorus (P)-based compound, boron (B)-based compound, antimony (Sb)-based compound, bismuth (Bi)-based compound, lead (Pb)-based compound, arsenic (As)-based compound, or combinations thereof. At least one residue of the densifier may be chemically and/or physically incorporated into the polymerized alkoxy siloxane-based material.
摘要翻译：提供具有改进的耐久性的化学改性的抗反射（AR）涂层。 AR涂层可以是聚合的烷氧基硅氧烷基材料，其包括有机或无机磷（P）基化合物，基于硼（B）的化合物，锑（Sb）基化合物，铋（ Bi）基化合物，铅（Pb）基化合物，砷（As）基化合物或其组合。致密剂的至少一个残余物可以化学和/或物理地掺入聚合的烷氧基硅氧烷基材料中。

7. 发明申请

WO2003060979A2 ORGANIC COMPOSITIONS 审中-公开
标题翻译：有机成分
公开(公告)号：WO2003060979A2
公开(公告)日：2003-07-24
申请号：PCT/US2003/000948
申请日：2003-01-14
申请人： HONEYWELL INTERNATIONAL INC.
发明人： LI, Chan-En , ZHEREBIN, Ruslan , Sleiman Nassrin , GEBREBRHAN, Amauel , NAMAN, Annath , SIKONIA, John, G. , LAU, Kreisler , APEN, Paul, G. , KOROLEV, Boris , IWAMOTO, Nancy
IPC分类号： H01L21/316
CPC分类号： H01L21/02126 , C08G61/02 , C08L65/00 , H01L21/02118 , H01L21/02203 , H01L21/02282 , H01L21/31695
摘要： The present invention provides a composition comprising: (a) dielectric material; and (b) porogen comprising at least two fused aromatic rings wherein each of the fused aromatic rings has at least one alkyl substituent thereon and a bond exists between at least two of the alkyl substituents on adjacent aromatic rings. Preferably, the dielectric material is a composition comprising (a) thermosetting component comprising (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula 11 as set forth below where Q, G, h, I, I, and w are as set forth below and (b) porogen. Preferably, the porogen is selected from the group consisting of unfunctionalized polyacenaphthylene homopolymer, functionalized polyacenaphthylene homopolymer, polyacenaphthylene copolymer, polynorbornene, polycaprolactone, poly (2-vinyl naphthalene), vinyl anthracene, 1s polystyrene, polystyrene derivatives, polysiloxane, polyester, polyether, polyacrylate, aliphatic polycarbonate, polysulfone, polylactide, and blends thereof. The present compositions are particularly useful as dielectric substrate material in microchips, multichip modules, laminated circuit boards, and printed wiring boards.
摘要翻译：本发明提供一种组合物，其包含：介电材料和b致孔剂，其包含至少两个稠合芳环，其中每个稠合芳环在其上具有至少一个烷基取代基，并且在相邻芳族的至少两个烷基取代基之间存在键戒指。优选地，电介质材料是包含热固性组分的组合物，其包含如下所述的1个任选的式I的单体和2个至少一种如下所述的式11的低聚物或聚合物，其中Q，G，h，I，I和 w如下所述和b致孔剂。优选地，造孔剂选自非官能化聚苊烯均聚物，官能化聚苊烯均聚物，聚苊烯共聚物，聚降冰片烯，聚己内酯，聚2-乙烯基萘，乙烯基蒽，1聚苯乙烯，聚苯乙烯衍生物，聚硅氧烷，聚酯，聚醚，聚丙烯酸酯，脂族聚碳酸酯，聚砜，聚丙交酯及其共混物。本发明的组合物特别可用作微芯片，多芯片模块，层压电路板和印刷线路板中的介电基板材料。

8. 发明申请

WO2003060979A3 ORGANIC COMPOSITIONS FOR LOW DIELECTRIC CONSTANT MATERIALS 审中-公开
公开(公告)号：WO2003060979A3
公开(公告)日：2003-07-24
申请号：PCT/US2003/000948
申请日：2003-01-14
申请人： HONEYWELL INTERNATIONAL INC.
发明人： LI, Chan-En , ZHEREBIN, Ruslan , Sleiman Nassrin , GEBREBRHAN, Amauel , NAMAN, Annath , SIKONIA, John, G. , LAU, Kreisler , APEN, Paul, G. , KOROLEV, Boris , IWAMOTO, Nancy
IPC分类号： H01L21/316
摘要： The present invention provides a composition comprising: (a) dielectric material; and (b) porogen comprising at least two fused aromatic rings wherein each of the fused aromatic rings has at least one alkyl substituent thereon and a bond exists between at least two of the alkyl substituents on adjacent aromatic rings. Preferably, the dielectric material is a composition comprising (a) thermosetting component comprising (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula 11 as set forth below where Q, G, h, I, I, and w are as set forth below and (b) porogen. Preferably, the porogen is selected from the group consisting of unfunctionalized polyacenaphthylene homopolymer, functionalized polyacenaphthylene homopolymer, polyacenaphthylene copolymer, polynorbornene, polycaprolactone, poly (2-vinyl naphthalene), vinyl anthracene, 1s polystyrene, polystyrene derivatives, polysiloxane, polyester, polyether, polyacrylate, aliphatic polycarbonate, polysulfone, polylactide, and blends thereof. The present compositions are particularly useful as dielectric substrate material in microchips, multichip modules, laminated circuit boards, and printed wiring boards.

9. 发明公开

EP2890750A1 HIGHLY DURABLE ANTI-REFLECTIVE COATINGS 审中-公开
标题翻译：高抗防REFLEX涂料
公开(公告)号：EP2890750A1
公开(公告)日：2015-07-08
申请号：EP13834149.0
申请日：2013-03-05
申请人： Honeywell International Inc.
发明人： MUKHOPADHYAY, Sudip , GEBREBRHAN, Amanuel , KOROLEV, Boris , VARAPRASAD, Desaraju , LIU, Ya Qun , JIANG, Yunzi
IPC分类号： C09D183/00 , C09D183/06 , G02B1/10
CPC分类号： C09D5/006 , C08G77/30 , C08G77/395 , C08G77/398 , C08K3/32 , C08K2003/329 , C09D183/04 , C09D183/08 , G02B1/11 , G02B1/111
摘要： A chemically modified anti-reflective (AR) coating is provided having improved durability. The AR coating may be a polymerized alkoxy siloxane-based material that includes a densifier in the form of an organic or inorganic phosphorus (P)-based compound, boron (B)-based compound, antimony (Sb)-based compound, bismuth (Bi)-based compound, lead (Pb)-based compound, arsenic (As)-based compound, or combinations thereof. At least one residue of the densifier may be chemically and/or physically incorporated into the polymerized alkoxy siloxane-based material.

10. 发明公开

EP1466356A2 ORGANIC COMPOSITIONS 审中-公开
标题翻译：有机组合物
公开(公告)号：EP1466356A2
公开(公告)日：2004-10-13
申请号：EP03729654.8
申请日：2003-01-14
申请人： Honeywell International Inc.
发明人： LI, Chan-En , ZHEREBIN, Ruslan , Sleiman Nassrin , GEBREBRHAN, Amauel , NAMAN, Annath , SIKONIA, John, G. , LAU, Kreisler , APEN, Paul, G. , KOROLEV, Boris , IWAMOTO, Nancy
IPC分类号： H01L21/316 , H01L21/312 , C08J9/26
CPC分类号： H01L21/02126 , C08G61/02 , C08L65/00 , H01L21/02118 , H01L21/02203 , H01L21/02282 , H01L21/31695
摘要： The present invention provides a composition comprising: (a) dielectric material; and (b) porogen comprising at least two fused aromatic rings wherein each of the fused aromatic rings has at least one alkyl substituent thereon and a bond exists between at least two of the alkyl substituents on adjacent aromatic rings. Preferably, the dielectric material is a composition comprising (a) thermosetting component comprising (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula 11 as set forth below where Q, G, h, I, I, and w are as set forth below and (b) porogen. Preferably, the porogen is selected from the group consisting of unfunctionalized polyacenaphthylene homopolymer, functionalized polyacenaphthylene homopolymer, polyacenaphthylene copolymer, polynorbornene, polycaprolactone, poly (2-vinyl naphthalene), vinyl anthracene, 1s polystyrene, polystyrene derivatives, polysiloxane, polyester, polyether, polyacrylate, aliphatic polycarbonate, polysulfone, polylactide, and blends thereof. The present compositions are particularly useful as dielectric substrate material in microchips, multichip modules, laminated circuit boards, and printed wiring boards.
摘要翻译：本发明提供了一种组合物，其包含：（a）介电材料; 和（b）包含至少两个稠合芳环的致孔剂，其中每个稠合芳环在其上具有至少一个烷基取代基并且在相邻芳环上的至少两个烷基取代基之间存在键。优选地，介电材料为包含（a）热固性组分和（2）至少一种如下所示的式11的低聚物或聚合物的组合物，所述组分包含（1）任选的如下所示的式I的单体，其中Q，G，h ，I，I和W如下所述和（b）致孔剂。优选地，成孔剂选自未官能化的聚ace烯均聚物，官能化的聚ace烯均聚物，聚ace烯共聚物，聚降冰片烯，聚己内酯，聚（2-乙烯基萘），乙烯基蒽，1s聚苯乙烯，聚苯乙烯衍生物，聚硅氧烷，聚酯，聚醚，，脂族聚碳酸酯，聚砜，聚丙交酯及其共混物。本发明组合物特别适用于微芯片，多芯片模块，叠层电路板和印刷线路板中的介电基片材料。

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