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1. 发明申请

WO2017011221A1 ANTI-REFLECTIVE COATING FOR SAPPHIRE 审中-公开
标题翻译：锑酸盐防反射涂料
公开(公告)号：WO2017011221A1
公开(公告)日：2017-01-19
申请号：PCT/US2016/040958
申请日：2016-07-05
申请人： HONEYWELL INTERNATIONAL INC.
发明人： DUAN, Huifeng , SHEN, Yanming , LIU, Ya Qun , HUANG, Hong Min
IPC分类号： C09D5/00 , C09D4/00 , C09D7/00
CPC分类号： B05D3/0272 , B05D1/005 , C09D183/04 , C23C18/122 , C23C18/1245 , G02B1/111 , G02B1/14
摘要： A coated substrate includes a sapphire substrate and an anti-reflective coating comprising a silicon-based material, wherein the anti-reflective coating has refractive index of 1.23 to 1.45 and a Mohs hardness of at least 4. A method of coating a sapphire substrate with an anti-reflective coating includes applying a liquid formulation to a sapphire substrate to form a coated substrate, and curing the coated substrate at a temperature of at least 500°C to form an anti-reflective layer on the sapphire substrate.
摘要翻译：涂覆的基材包括蓝宝石基底和包含硅基材料的抗反射涂层，其中抗反射涂层的折射率为1.23至1.45，莫氏硬度至少为4.一种用蓝宝石基底涂覆蓝宝石基底的方法抗反射涂层包括将液体制剂施加到蓝宝石衬底以形成涂覆的衬底，并且在至少500℃的温度下固化涂覆的衬底，以在蓝宝石衬底上形成抗反射层。

2. 发明申请

WO2015038454A1 POLY FLUORINE-CONTAINING SILOXANE COATINGS 审中-公开
标题翻译：含氟聚硅氧烷涂料
公开(公告)号：WO2015038454A1
公开(公告)日：2015-03-19
申请号：PCT/US2014/054481
申请日：2014-09-08
申请人： HONEYWELL INTERNATIONAL INC.
发明人： LIU, Ya Qun , ZHANG, Bright , DUAN, Huifeng , JIANG, Wanchao , JIANG, Yunzi , DING, Zhe , CHEN, David K. , SHEN, Yanming , WANG, Wei Jun
IPC分类号： C09D183/04 , C08L83/04
CPC分类号： C09D183/08 , C08G77/24
摘要： Poly fluorine-containing siloxane coatings having improved hydrophobic and oleophobic properties and solutions for creating such coatings are provided. In some embodiments, the coating includes a polymer having a plurality of Si-O-Si linkages; and at least two fluorine-containing moieties, each attached to at least one of the Si-O-Si linkages. Each fluorine-containing moiety independently includes a linking portion attached to a silicon of one of the Si-O-Si linkages, wherein the linking portion is of a formula selected from the group consisting of: -[CH 2 ] a - where a is an integer from 1 to 10 and -[CH 2 ] b CONH[CH 2 ] c - where b and c are independently an integer from 0 to 10. Each fluorine-containing moiety also independently includes a fluorinated portion attached to the linking portion, wherein the fluorinated portion is selected from a fluorinated-alkyl group having 1-10 carbon atoms and a perfluoro-ether containing organic group.
摘要翻译：提供了具有改进的疏水性和疏油性的聚氟硅氧烷涂料和用于产生这种涂层的溶液。在一些实施方案中，涂层包括具有多个Si-O-Si键的聚合物; 和至少两个含氟部分，各自连接至至少一个Si-O-Si键。每个含氟部分独立地包括连接到Si-O-Si键之一的硅的连接部分，其中连接部分具有选自： - [CH 2] a - 的化合物，其中a是 1〜10的整数， - [CH 2] bCONH [CH 2] c - ，其中b和c独立地为0〜10的整数。各含氟部分也独立地包含与连接部分连接的氟化部分，选自具有1-10个碳原子的氟化烷基和含全氟醚的有机基团。

3. 发明申请

WO2014035468A1 HIGHLY DURABLE ANTI-REFLECTIVE COATINGS 审中-公开
标题翻译：高耐用抗反射涂层
公开(公告)号：WO2014035468A1
公开(公告)日：2014-03-06
申请号：PCT/US2013/029001
申请日：2013-03-05
申请人： HONEYWELL INTERNATIONAL INC.
发明人： MUKHOPADHYAY, Sudip , GEBREBRHAN, Amanuel , KOROLEV, Boris , VARAPRASAD, Desaraju , LIU, Ya Qun , JIANG, Yunzi
IPC分类号： C09D183/00 , C09D183/06 , G02B1/10
CPC分类号： C09D5/006 , C08G77/30 , C08G77/395 , C08G77/398 , C08K3/32 , C08K2003/329 , C09D183/04 , C09D183/08 , G02B1/11 , G02B1/111
摘要： A chemically modified anti-reflective (AR) coating is provided having improved durability. The AR coating may be a polymerized alkoxy siloxane-based material that includes a densifier in the form of an organic or inorganic phosphorus (P)-based compound, boron (B)-based compound, antimony (Sb)-based compound, bismuth (Bi)-based compound, lead (Pb)-based compound, arsenic (As)-based compound, or combinations thereof. At least one residue of the densifier may be chemically and/or physically incorporated into the polymerized alkoxy siloxane-based material.
摘要翻译：提供具有改进的耐久性的化学改性的抗反射（AR）涂层。 AR涂层可以是聚合的烷氧基硅氧烷基材料，其包括有机或无机磷（P）基化合物，基于硼（B）的化合物，锑（Sb）基化合物，铋（ Bi）基化合物，铅（Pb）基化合物，砷（As）基化合物或其组合。致密剂的至少一个残余物可以化学和/或物理地掺入聚合的烷氧基硅氧烷基材料中。

4. 发明申请

WO2013026177A1 PHOSPHOROUS-COMPRISING DOPANTS, METHODS FOR FORMING PHOSPHOROUS-DOPED REGIONS IN SEMICONDUCTOR SUBSTRATES USING SUCH PHOSPHOROUS-COMPRISING DOPANTS, AND METHODS FOR FORMING SUCH PHOSPHOROUS-COMPRISING DOPANTS 审中-公开
标题翻译：磷光体包裹体，使用这种含磷光体聚合物形成在半导体衬底中的磷光体区域的方法，以及形成这种含磷光体的方法
公开(公告)号：WO2013026177A1
公开(公告)日：2013-02-28
申请号：PCT/CN2011/001392
申请日：2011-08-22
申请人： HONEYWELL INTERNATIONAL INC. , HUANG, Hongmin , GAO, Carol , DING, Zhe , PENG, Albert , LIU, Ya Qun , ZHANG, Bright
发明人： HUANG, Hongmin , GAO, Carol , DING, Zhe , PENG, Albert , LIU, Ya Qun , ZHANG, Bright
IPC分类号： H01L21/24 , H01L21/228
CPC分类号： H01L21/2225 , H01L21/2254
摘要： Substantially silane-free phosphorous-comprising dopants, methods for forming phosphorous-doped regions in a semiconductor material using substantially silane-free phosphorous-comprising dopants, and a method for fabricating substantially silane-free phosphorous-comprising dopants are provided. A phosphorous-comprising dopant comprises a phosphorous source comprising a phosphorous-comprising salt, a phosphorous-comprising acid, phosphorous-comprising anions, or combinations thereof, an alkaline material, cations from an alkaline material, or combinations thereof, and a liquid medium. The phosphorous-comprising dopant comprises less than 0.1wt.% silanes, oligomers and/or polymers derived from silanes, or a combination thereof.
摘要翻译：基本上不含硅烷的含磷掺杂剂，使用基本上不含硅烷的含磷掺杂剂在半导体材料中形成磷掺杂区域的方法以及基本上不含硅烷的含磷掺杂剂的制造方法。含磷掺杂剂包括磷源，其包含含磷的盐，含磷的酸，含磷的阴离子或其组合，碱性材料，来自碱性材料的阳离子或其组合，以及液体介质。含磷掺杂剂包含小于0.1重量％的硅烷，衍生自硅烷的低聚物和/或聚合物，或其组合。

5. 发明申请

WO2019160886A1 GEL-TYPE THERMAL INTERFACE MATERIAL 审中-公开
公开(公告)号：WO2019160886A1
公开(公告)日：2019-08-22
申请号：PCT/US2019/017743
申请日：2019-02-13
申请人： HONEYWELL INTERNATIONAL INC.
发明人： SHEN, Ling , ZHANG, Kai , ZHANG, Liqiang , LIU, Ya Qun , ZHANG, Xin
IPC分类号： C09K5/12 , C08L83/04 , H05K7/20
摘要： A thermal interface material that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material comprises at least one silicone oil, at least one catalyst, at least one thermally conductive filler having a larger surface area, a solvent, at least one inhibitor, and at least one crosslinker. The at least one thermally conductive filler reduces the oil leakage of the TIM, and the solvent increases the flow rate of the TIM without negating the reduction of oil leakage realized by the thermally conductive fillers

6. 发明申请

WO2019050806A1 SILICONE-FREE THERMAL GEL 审中-公开
公开(公告)号：WO2019050806A1
公开(公告)日：2019-03-14
申请号：PCT/US2018/049218
申请日：2018-08-31
申请人： HONEYWELL INTERNATIONAL INC.
发明人： ZHANG, Liqiang , DUAN, Huifeng , PAN, Rongwei , ZHANG, Qi , LIU, Ya Qun , KANG, Haigang
IPC分类号： C08J3/075 , C08L71/02 , C08L61/28 , C08G65/48 , C08K5/00
摘要： The present disclosure provides a silicone free gel that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes a polyether polyol, a cross-linker, a coupling agent, an antioxidant, a catalyst, and at least one thermally conductive filler.

7. 发明申请

WO2015120773A1 COMPRESSIBLE THERMAL INTERFACE MATERIALS 审中-公开
标题翻译：可接受的热界面材料
公开(公告)号：WO2015120773A1
公开(公告)日：2015-08-20
申请号：PCT/CN2015/072202
申请日：2015-02-04
申请人： HONEYWELL INTERNATIONAL INC. , ZENG, Liang , LIU, Ya Qun , CHANG, Jerry , ZHANG, Bright , DING, Zhe , WANG, Wei Jun , HUANG, Hong Min
发明人： ZENG, Liang , LIU, Ya Qun , CHANG, Jerry , ZHANG, Bright , DING, Zhe , WANG, Wei Jun , HUANG, Hong Min
IPC分类号： C09K5/06 , H01L23/373
CPC分类号： H01L23/3737 , C09K5/063 , H01L23/367 , H01L23/42 , H01L2924/0002 , H01L2924/00
摘要： Provided is a compressible thermal interface material including a polymer, a thermally conductive filler, and a phase change material. A formulation for forming a compressible thermal interface material and an electronic component including a compressible thermal interface material are also provided.
摘要翻译：提供了包括聚合物，导热填料和相变材料的可压缩热界面材料。还提供了用于形成可压缩热界面材料的配方和包括可压缩热界面材料的电子部件。

8. 发明申请

WO2017192725A1 LIGHT EMITTER DEVICES AND COMPONENTS WITH IMPROVED CHEMICAL RESISTANCE AND RELATED METHODS 审中-公开
标题翻译：具有改进的耐化学性的发光器件和组件以及相关方法
公开(公告)号：WO2017192725A1
公开(公告)日：2017-11-09
申请号：PCT/US2017/030843
申请日：2017-05-03
申请人： HONEYWELL INTERNATIONAL INC.
发明人： LIU, Ya Qun , JIANG, Wanchao , XU, Gang , DUAN, Linlin , ZHANG, Siyuan , DING, Zhe
IPC分类号： H01L33/56 , H01L33/44
摘要： Disclosed are LEDs and LED packages, and methods of making them, having improved resistance to infiltration by chemical entities comprising providing a coating on at least a portion of the LED chip or an LED chip package formed by co-polymerization of: (a) one or more hydrofluoroolefin monomer(s) selected from the group consisting of tetrafluoroethylene, hydrofluoroethylenes, hydrofluoropropenes, hydrofluorobutenes, hydrofluoropentenes and combinations of these; (b) optionally one or more chlorofluoroethylene monomers; (c) optionally one or more vinyl ester monomer(s); and (d) optionally one or more vinyl ether monomer(s), wherein at least a portion of said vinyl ether monomer is preferably a hydroxyl group-containing vinyl ether monomer and preferably at least one of (b) and (d) is present.
摘要翻译：公开了LED和LED封装及其制造方法，其具有改进的耐化学实体渗透性，包括在LED芯片的至少一部分上提供涂层或由co （a）一种或多种选自四氟乙烯，氢氟乙烯，氢氟丙烯，氢氟丁烯，氢氟戊烯及其组合的一种或多种氢氟烯烃单体; （b）任选的一种或多种氯氟乙烯单体; （c）任选的一种或多种乙烯基酯单体; 和（d）任选的一种或多种乙烯基醚单体，其中所述乙烯基醚单体的至少一部分优选为含羟基的乙烯基醚单体，并且优选存在（b）和（d）中的至少一种

9. 发明申请

WO2016086410A1 HIGH PERFORMANCE THERMAL INTERFACE MATERIALS WITH LOW THERMAL IMPEDANCE 审中-公开
标题翻译：具有低耐热性能的高性能热界面材料
公开(公告)号：WO2016086410A1
公开(公告)日：2016-06-09
申请号：PCT/CN2014/093138
申请日：2014-12-05
申请人： HONEYWELL INTERNATIONAL INC. , ZHANG, Bright , SHEN, Ling , WANG, Hui , LIU, Ya Qun , WANG, Wei Jun , HUANG, Hong Min
发明人： ZHANG, Bright , SHEN, Ling , WANG, Hui , LIU, Ya Qun , WANG, Wei Jun , HUANG, Hong Min
IPC分类号： C09K5/14
CPC分类号： C09K5/066 , C09K5/063 , C09K5/14 , H01L23/3737 , H01L2224/16225 , H01L2224/73204 , H01L2224/73253
摘要： A thermal interface material includes, in one exemplary embodiment, a polymer, a phase change material, a first thermally conductive filler having a first particle size, and a second thermally conductive filler having a second particle size. The first particle size is larger than the second particle size. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.
摘要翻译：在一个示例性实施例中，热界面材料包括聚合物，相变材料，具有第一粒度的第一导热填料和具有第二粒径的第二导热填料。第一粒径大于第二粒径。还提供了一种用于形成热界面材料的配方和包括热界面材料的电子部件。

10. 发明申请

WO2016004565A1 THERMAL INTERFACE MATERIAL WITH ION SCAVENGER 审中-公开
标题翻译：热接口材料与离子扫描仪
公开(公告)号：WO2016004565A1
公开(公告)日：2016-01-14
申请号：PCT/CN2014/081724
申请日：2014-07-07
申请人： HONEYWELL INTERNATIONAL INC. , LIU, Ya Qun , ZENG, Liang , WANG, Hui , ZHANG, Bright , HUANG, Hong Min
发明人： LIU, Ya Qun , ZENG, Liang , WANG, Hui , ZHANG, Bright , HUANG, Hong Min
IPC分类号： C08K5/29 , C08K5/25 , C08K3/22 , B32B27/18
CPC分类号： C09K5/14 , C08K13/02 , C08K2201/001 , C08L23/0815 , C08L2201/08 , C08L2203/20 , C09K5/063 , C09K15/06 , C09K15/22 , C09K15/24 , C09K15/30 , G06F1/20 , H01L23/3675 , H01L23/3737 , H01L23/42 , H01L24/32 , H01L2224/2929 , H01L2224/29309 , H01L2224/29311 , H01L2224/29316 , H01L2224/29318 , H01L2224/29324 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/29387 , H01L2224/2939 , H01L2224/29393 , H01L2224/32245 , H01L2924/0002 , H01L2924/0503 , H01L2924/05032 , H01L2924/05042 , H01L2924/0542 , H01L2924/05432 , H01L2924/0544 , H01L2924/12041 , H01L2924/1432 , H05K7/2039 , H01L2924/00
摘要： A thermal interface material includes at least one polymer,at least one thermally conductive filler; and at least one ion scavenger. In some embodiments, the ion scavenger is a complexing agent selected from the group consisting of : nitrogen containing complexing agents,phosphorus containing complexing agents, and hydroxyl carboxylic acid based complexing agents.
摘要翻译：热界面材料包括至少一种聚合物，至少一种导热填料; 和至少一种离子清除剂。在一些实施方案中，离子清除剂是选自以下的络合剂：含氮络合剂，含磷络合剂和基于羟基羧酸的络合剂。

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