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1. 发明申请

WO2002081546A1 LOW DIELECTRIC CONSTANT MATERIALS AND METHODS OF PREPARATION THEREOF 审中-公开
标题翻译：低介电常数材料及其制备方法
公开(公告)号：WO2002081546A1
公开(公告)日：2002-10-17
申请号：PCT/US2001/032569
申请日：2001-10-18
申请人： HONEYWELL INTERNATIONAL INC. , APEN, Paul , LAU, Kreisler , LIU, Feng Quan , KOROLEV, Boris , BROUK, Emma , ZHEREBIN, Ruslan , NALEWAJEK, David , LEUNG, Roger
发明人： APEN, Paul , LAU, Kreisler , LIU, Feng Quan , KOROLEV, Boris , BROUK, Emma , ZHEREBIN, Ruslan , NALEWAJEK, David , LEUNG, Roger
IPC分类号： C08G63/78
CPC分类号： C08G61/12 , C07C13/615 , C07C13/64 , C07C15/54 , C07C17/10 , C07C17/269 , C07C2603/74 , C07C2603/90 , C07F7/0809 , C08F238/00 , C08G61/02 , H01L2924/0002 , C07C23/46 , C07C25/22 , H01L2924/00
摘要： The present invention is directed to low dielectric polymers and to methods of producing these low dielectric constant polymers, dielectric materials and layers, and electronic components. In one aspect of the present invention, an isomeric mixture of thermosetting monomers, wherein the monomers have a core structure and a plurality of arms, is provided, and the isomeric mixture of thermosetting monomers is polymerized, wherein polymerization comprises a reaction of an ethynyl group that is located in at least one arm of a monomer. In yet another aspect of the inventive subject matter, spin-on low dielectric constant materials are formed having a first backbone with an aromatic moiety and a first reactive group, and a second backbone with an aromatic moiety and a second reactive group, wherein the first and second backbone are crosslinked via the first and second reactive groups in a crosslinking reaction preferably without an additional crosslinker, and wherein a cage structure having at least eight (8) atoms is covalently bound to at least one of the first and second backbone.
摘要翻译：本发明涉及低介电聚合物以及生产这些低介电常数聚合物，介电材料和层以及电子元件的方法。在本发明的一个方面，提供其中单体具有核心结构和多个臂的热固性单体的异构体混合物，并且热固性单体的异构体混合物聚合，其中聚合包括乙炔基其位于单体的至少一个臂中。在本发明主题的另一方面，形成旋涂低介电常数材料，其具有具有芳族部分和第一反应性基团的第一主链和具有芳族部分和第二反应性基团的第二主链，其中第一并且第二主链在交联反应中通过第一和第二反应性基团交联，优选不含另外的交联剂，并且其中具有至少八个（8）原子的笼结构共价结合至第一和第二主链中的至少一个。

2. 发明申请

WO2003007337A2 LOW DIELECTRIC CONSTANT ORGANIC DIELECTRICS BASED ON CAGE-LIKE STRUCTURES 审中-公开
标题翻译：基于笼式结构的低介电常数有机电介质
公开(公告)号：WO2003007337A2
公开(公告)日：2003-01-23
申请号：PCT/US2002/021692
申请日：2002-07-08
申请人： HONEYWELL INTERNATIONAL INC. , LAU, Kreisler , LIU, Feng, Quan , KOROLEV, Boris , BROUK, Emma , ZHEREBIN, Ruslan , LEUNG, Roger
发明人： LAU, Kreisler , LIU, Feng, Quan , KOROLEV, Boris , BROUK, Emma , ZHEREBIN, Ruslan , LEUNG, Roger
IPC分类号： H01L
CPC分类号： C08F257/02 , C08F8/00 , C08G61/02 , C08G61/12 , C08G81/00 , C08L51/003 , H01B3/307 , H01B3/427 , C08L2666/02
摘要： A low dielectric constant material has a first backbone with an aromatic moiety and a first reactive group, and a second backbone with an aromatic moiety and a second reactive group, wherein the first and second backbones are crosslinked via the first and second reactive groups in a crosslinking reaction without an additional crosslinker, and wherein a cage structure having at least 10 atoms is covalently bound to at least one of the first and second backbone.
摘要翻译：低介电常数材料具有具有芳族部分和第一反应性基团的第一主链和具有芳族部分和第二反应性基团的第二主链，其中第一和第二主链经由第一和第二反应性基团在交联反应而没有额外的交联剂，并且其中具有至少10个原子的笼状结构与第一和第二主链中的至少一个共价结合。

3. 发明申请

WO2004084269A2 LOW DIELECTRIC MATERIALS AND METHODS OF PRODUCING SAME 审中-公开
标题翻译：低介电材料及其生产方法
公开(公告)号：WO2004084269A2
公开(公告)日：2004-09-30
申请号：PCT/US2004/007584
申请日：2004-03-11
申请人： HONEYWELL INTERNATIONAL INC. , MUKHERJEE, Shyama , LEUNG, Roger , LAU, Kreisler
发明人： MUKHERJEE, Shyama , LEUNG, Roger , LAU, Kreisler
IPC分类号： H01L
CPC分类号： H01L21/02118 , H01L21/02126 , H01L21/02203 , H01L21/02282 , H01L21/02343 , H01L21/31695 , H01L23/5329 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： In accordance with the present invention, compositions and methods are provided in which the mechanical strength and durability of a precursor material having a plurality of pores is increased by a) providing a precursor material; b) treating the precursor material to form a nanoporous aerogel, preferably by using a supercritical drying process; c) providing a blending material having a reinforcing component and a volatile component; d) combining the nanoporous aerogel and the blending material to form an amalgamation layer; and e) treating the amalgamation layer to increase the mechanical strength of the layer by a substantial amount, and to ultimately form a low dielectric material that can be utilized in various applications.
摘要翻译：根据本发明，提供了组合物和方法，其中具有多个孔的前体材料的机械强度和耐久性通过以下方式增加：a）提供前体材料; b）优选通过使用超临界干燥工艺处理前体材料以形成纳米多孔气凝胶; c）提供具有增强组分和挥发性组分的混合材料; d）将所述纳米多孔气凝胶和所述混合材料组合以形成混合层; 和e）处理该汞齐化层以增加该层的机械强度相当大的量，并最终形成可用于各种应用的低介电材料。

4. 发明申请

WO2004006297A3 LOW DIELECTRIC MATERIALS AND METHODS OF PRODUCING SAME 审中-公开
公开(公告)号：WO2004006297A3
公开(公告)日：2004-01-15
申请号：PCT/US2003/018543
申请日：2003-06-11
申请人： HONEYWELL INTERNATIONAL INC. , MUKHERJEE, Shyama , LEUNG, Roger , LAU, Kreisler
发明人： MUKHERJEE, Shyama , LEUNG, Roger , LAU, Kreisler
IPC分类号： C08J9/28
摘要： In accordance with the present invention, compositions and methods are provided in which the mechanical strength and durability of a precursor material having a plurality of pores is increased by a) providing a precursor material; b) treating the precursor material to form a nanoporous aerogel, preferably by using a supercritical drying process; c) providing a blending material having a reinforcing component and a volatile component; d) combining the nanoporous aerogel and the blending material to form an amalgamation layer; and e) treating the amalgamation layer to increase the mechanical strength of the layer by a substantial amount, and to ultimately form a low dielectric material that can be utilized in various applications.

5. 发明申请

WO2008147825A2 THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF 审中-公开
标题翻译：热互连和界面材料，生产方法及其用途
公开(公告)号：WO2008147825A2
公开(公告)日：2008-12-04
申请号：PCT/US2008/064422
申请日：2008-05-21
申请人： HONEYWELL INTERNATIONAL INC. , WEISER, Martin , BURNHAM, Kikue , ZHOU, De-Ling , LEUNG, Roger , NEDBAL, Jan , RASTOGI, Ravi
发明人： WEISER, Martin , BURNHAM, Kikue , ZHOU, De-Ling , LEUNG, Roger , NEDBAL, Jan , RASTOGI, Ravi
IPC分类号： H01L23/373 , C09K5/14
CPC分类号： C09K5/14 , H01L23/3737 , H01L23/42 , H01L2224/2929 , H01L2224/293 , H01L2224/32245 , H01L2924/09701 , H01L2924/12044 , H01L2924/3011 , H01L2924/0665 , H01L2924/00
摘要： Thermal interface materials are disclosed that include at least one matrix material component, at least one high conductivity filler component, at least one solder material; and at least one material modification agent, wherein the at least one material modification agent improves the thermal performance, compatibility, physical quality or a combination thereof of the thermal interface material. Methods of forming thermal interface materials are also disclosed that include providing each of the at least one matrix material component, at least one high conductivity filler, at least one solder material and at least one material modification agent, blending the components; and optionally curing the components pre- or post-application of the thermal interface material to the surface, substrate or component. Also, thermal interface materials are disclosed that include at least one matrix material component, at least one high conductivity filler component, at least one solder material; and at least one material modification agent, wherein the at least one material modification agent at least one modified thermal filler profile.
摘要翻译：公开了热界面材料，其包括至少一种基质材料组分，至少一种高电导率填料组分，至少一种焊料材料; 和至少一种材料改性剂，其中所述至少一种材料改性剂改善所述热界面材料的热性能，相容性，物理质量或其组合。还公开了形成热界面材料的方法，其包括提供至少一种基质材料组分，至少一种高电导率填料，至少一种焊料材料和至少一种材料改性剂中的每一种，混合组分; 并且可选地将热界面材料预施加或后施加到表面，基材或组分上固化。此外，公开了热界面材料，其包括至少一种基体材料组分，至少一种高电导率填料组分，至少一种焊料材料; 和至少一种材料改性剂，其中所述至少一种材料改性剂至少一种改性的热填料型材。

6. 发明申请

WO2004037877A2 ORGANOSILOXANES 审中-公开
标题翻译：有机硅氧烷
公开(公告)号：WO2004037877A2
公开(公告)日：2004-05-06
申请号：PCT/US2003/017658
申请日：2003-06-03
申请人： HONEYWELL INTERNATIONAL INC. , BEDWELL, William , HACKER, Nigel , LEUNG, Roger , IWAMOTO, Nancy , NEDBAL, Jan , XIE, Songyuan , MORO, Lorenzo , MUKHERJEE, Shyama
发明人： BEDWELL, William , HACKER, Nigel , LEUNG, Roger , IWAMOTO, Nancy , NEDBAL, Jan , XIE, Songyuan , MORO, Lorenzo , MUKHERJEE, Shyama
IPC分类号： C08G
CPC分类号： C08G77/12 , C09D183/04 , G03F7/0751 , H01L21/02126 , H01L21/02211 , H01L21/02282 , H01L21/3122 , H01L21/76807 , H01L21/76829 , H01L2924/12044
摘要： The present invention provides an organosiloxane comprising at least 80 weight percent of Formula I: [Y 0.01-1.0 SiO 1.5-2 ] a [Z 0.01-1.0 SiO 1.5-2 ]b[H 0.01-1.0 SiO 1.5-2 ] c where Y is aryl; Z is alkenyl; a is from 15 percent to 70 percent of Formula I; b is from 2 percent to 50 percent of Formula I; and c is from 20 percent to 80 percent of Formula I.The present organosiloxane may be used as ceramic binder, high temperature encapsulant, and fiber matrix binder. The present composition is also useful as an adhesion promoter in that it exhibits good adhesive properties when coupled with other materials in non-microelectronic or microelectronic applications. Preferably, the present compositions are used in microelectronic applications as etch stops, hardmasks, and dielectrics.
摘要翻译：本发明提供了包含至少80重量％的式I的有机硅氧烷：[Y0.01-1.0SiO1.5-2] a [Z 0.01-1.0SiO1.5-2] b [H0.01-1.0SiO1.5 -2] c其中Y是芳基; Z是烯基; a是一级方程式的15％至70％; b是式I的2％至50％; c为式I的20％至80％。本发明的有机硅氧烷可用作陶瓷粘合剂，高温密封剂和纤维基质粘合剂。本发明的组合物也可用作粘合促进剂，因为当与非微电子或微电子应用中的其它材料结合时，其具有良好的粘合性能。优选地，本发明的组合物用作微电子应用中的蚀刻停止，硬掩模和电介质。

7. 发明申请

WO2005049681A2 ANTIREFLECTIVE COATINGS FOR VIA FILL AND PHOTOLITHOGRAPHY APPLICATIONS AND METHODS OF PREPARATION THEREOF 审中-公开
标题翻译：用于通过薄膜和光刻机应用的抗反射涂层及其制备方法
公开(公告)号：WO2005049681A2
公开(公告)日：2005-06-02
申请号：PCT/US2004/038517
申请日：2004-11-17
申请人： HONEYWELL INTERNATIONAL INC. , LI, Bo , KENNEDY, Joseph , IWAMOTO, Nancy , LU, Victor , LEUNG, Roger , FRADKIN, Mark, A. , HUSSEIN, Makarem, A. , GOODNER, Michael, D.
发明人： LI, Bo , KENNEDY, Joseph , IWAMOTO, Nancy , LU, Victor , LEUNG, Roger , FRADKIN, Mark, A. , HUSSEIN, Makarem, A. , GOODNER, Michael, D.
IPC分类号： C08G
CPC分类号： C09D183/04 , C09D183/08 , G03F7/0751 , G03F7/0752 , G03F7/091
摘要： An absorbing composition is described herein that includes at least one inorganicbased compound, at least one absorbing compound, and at least one material modification agent. In addition, methods of making an absorbing composition are also described that includes: a) combining at least one inorganic-based compound, at least one absorbing compound, at least one material modification agent, an acid/water mixture, and one or more solvents to form a reaction mixture; and b) allowing the reaction mixture to form the absorbing composition at room temperature. Another method of making an absorbing composition includes: a) combining at least one inorganic-based compound, at least one absorbing compound, at least one material modification agent, an acid/water mixture, and one or more solvents to form a reaction mixture; and b) heating the reaction mixture to form the absorbing composition. Yet another method of making an absorbing composition is described that includes: a) combining at least one inorganic-based compound, at least one absorbing compound, at least one material modification agent, and one or more solvents to form a reaction mixture, wherein the at least one material modification agent comprises at least one acid and water; and b) heating the reaction mixture to form an absorbing material, a coating or a film. In other methods of making an absorbing composition described herein, those methods include: a) combining at least one inorganic-based compound, at least one absorbing compound, at least one material modification agent, and one or more solvents to form a reaction mixture, wherein the at least one material modification agent comprises at least one acid and water; and b) allowing the reaction mixture to form an absorbing material, a coating or a film.
摘要翻译：本文描述的吸收组合物包括至少一种无机基化合物，至少一种吸收化合物和至少一种材料改性剂。此外，还描述了制备吸收组合物的方法，其包括：a）将至少一种无机基化合物，至少一种吸收化合物，至少一种材料改性剂，酸/水混合物和一种或多种溶剂形成反应混合物; 和b）使反应混合物在室温下形成吸收组合物。制备吸收组合物的另一种方法包括：a）将至少一种无机基化合物，至少一种吸收化合物，至少一种材料改性剂，酸/水混合物和一种或多种溶剂组合以形成反应混合物; 和b）加热反应混合物以形成吸收组合物。描述了制备吸收组合物的另一种方法，其包括：a）将至少一种无机基化合物，至少一种吸收化合物，至少一种材料改性剂和一种或多种溶剂组合以形成反应混合物，其中至少一种材料改性剂包含至少一种酸和水; 和b）加热反应混合物以形成吸收材料，涂层或膜。在制备本文所述的吸收组合物的其它方法中，这些方法包括：a）将至少一种无机基化合物，至少一种吸收化合物，至少一种材料改性剂和一种或多种溶剂组合以形成反应混合物，其中所述至少一种材料改性剂包含至少一种酸和水; 和b）使反应混合物形成吸收材料，涂层或膜。

8. 发明申请

WO2005052989A2 DIELECTRIC FILMS FOR NARROW GAP-FILL APPLICATIONS 审中-公开
标题翻译：用于窄间隙填充应用的介电膜
公开(公告)号：WO2005052989A2
公开(公告)日：2005-06-09
申请号：PCT/US2004/033035
申请日：2004-10-06
申请人： HONEYWELL INTERNATIONAL INC. , ENDISCH, Denis , LEUNG, Roger , XIE, Songyuan , HACKER, Nigel , DENG, Yanpei
发明人： ENDISCH, Denis , LEUNG, Roger , XIE, Songyuan , HACKER, Nigel , DENG, Yanpei
IPC分类号： H01L
CPC分类号： H01L21/02282 , H01L21/02203 , H01L21/316 , H01L21/76837
摘要： A colloidal suspension of nanoparticles composed of a dense material dispersed in a solvent is used in forming a gap-filling dielectric material with low thermal shrinkage. The dielectric material is particularly useful for pre-metal dielectric and shallow trench isolation applications. According to the methods of forming a dielectric material, the colloidal suspension is deposited on a substrate and dried to form a porous intermediate layer. The intermediate layer is modified by infiltration with a liquid phase matrix material, such as a spin-on polymer, followed by curing, by infiltration with a gas phase matrix material, followed by curing, or by curing alone, to provide a gap-filling, thermally stable, etch resistant dielectric material.
摘要翻译：使用由分散在溶剂中的致密材料组成的纳米颗粒的胶体悬浮液来形成具有低热收缩率的间隙填充介电材料。介电材料对于金属前介电和浅沟槽隔离应用特别有用。根据形成电介质材料的方法，将胶体悬浮液沉积在基底上并干燥以形成多孔中间层。中间层通过用液相基体材料例如旋涂聚合物渗透而改性，然后通过用气相基体材料渗透固化，然后固化或单独固化以提供间隙填充，热稳定的抗蚀刻介电材料。

9. 发明申请

WO2004101651A1 MINIMIZATION OF COATING DEFECTS FOR COMPOSITIONS COMPRISING SILICON-BASED COMPOUNDS AND METHODS OF PRODUCING AND PROCESSING 审中-公开
标题翻译：包含硅基化合物的组合物的涂层缺陷的最小化以及生产和加工方法
公开(公告)号：WO2004101651A1
公开(公告)日：2004-11-25
申请号：PCT/US2004/014317
申请日：2004-05-07
申请人： HONEYWELL INTERNATIONAL INC. , BEDWELL, William , XIE, Songyuan , SEPA, Jelena , DUONG, Anh , IWAMOTO, Nancy , APEN, Paul , LEUNG, Roger
发明人： BEDWELL, William , XIE, Songyuan , SEPA, Jelena , DUONG, Anh , IWAMOTO, Nancy , APEN, Paul , LEUNG, Roger
IPC分类号： C08G77/06
CPC分类号： C08J3/091 , C08J2383/04
摘要： Polymer solutions are described herein that comprise: a) at least one silicon-based polymer having high molecular weight species and low molecular weight species after solvation with a compatible primary solvent, wherein the low molecular weight species crystallize in or precipitate out of the polymer solution; b) a primary solvent that solvates the high molecular weight species in the solution; and c) at least one additional solvent that solvates the low molecular weight species in the solution. Methods of producing a polymer solution are also described herein that comprise: a) providing at least one silicon-based polymer having high molecular weight species and low molecular weight species after solvation with a compatible primary solvent, wherein the low molecular weight species crystallize in or precipitate out of the polymer solution; b) providing a primary solvent that solvates the high molecular weight species in the solution; c) providing at least one additional solvent that solvates the low molecular weight species in the solution; and d) blending the at least one silicon-based polymer, the primary solvent and the at least one additional solvent to form the polymer solution. Methods of processing a polymer solution include: a) providing a filtration method or device, b) providing a polymer solution comprising high molecular weight species and low molecular weight species, wherein the low molecular weight species are in the form of crystals or precipitates, and c) utilizing the filtration method or device to filter the low molecular weight species out from the polymer solution.
摘要翻译：本文描述了聚合物溶液，其包含：a）至少一种具有高分子量物质和低分子量物质的硅基聚合物，在用相容的主要溶剂溶剂化之后，其中低分子量物质在聚合物溶液中结晶或沉淀出聚合物溶液 ; b）溶解溶液中高分子量物质的主要溶剂; 和c）溶解溶液中低分子量物质的至少一种另外的溶剂。本文还描述了生产聚合物溶液的方法，其包括：a）在用相容的主要溶剂溶剂化后，提供至少一种具有高分子量物质和低分子量物质的硅基聚合物，其中低分子量物质在从聚合物溶液中沉淀出来; b）提供溶解溶液中的高分子量物质的主要溶剂; c）提供溶解溶液中低分子量物质的至少一种另外的溶剂; 和d）共混所述至少一种硅基聚合物，所述主要溶剂和所述至少一种另外的溶剂以形成所述聚合物溶液。处理聚合物溶液的方法包括：a）提供过滤方法或装置，b）提供包含高分子量物质和低分子量物质的聚合物溶液，其中低分子量物质是晶体或沉淀物的形式，以及 c）利用过滤方法或装置从聚合物溶液中过滤低分子量物质。

10. 发明申请

WO2003063225A3 DIELECTRIC FILMS FOR NARROW GAP-FILL APPLICATIONS 审中-公开
公开(公告)号：WO2003063225A3
公开(公告)日：2003-07-31
申请号：PCT/US2002/001628
申请日：2002-01-18
申请人： HONEYWELL INTERNATIONAL INC.
发明人： LEUNG, Roger , HACKER, Nigel , XIE, Songyuan , DENG, Yanpei , ENDISCH, Denis
IPC分类号： H01L21/316
摘要： A colloidal suspension of nanoparticles composed of a dense material dispersed in a solent is used in forming a gap-filling dielectric material with low thermal shrinkage. The dielectric material is particularly useful for pre-metal dielectric and shallow trench isolaiton applications. According to the mehtods of forming a dielectric material, the colloidal suspension is deposited on a substrate and dried to form a porous intermediate layer. The intermediate layer is modified bz infiltration with a liquid phase matrix material, such as a spin-on polymer, followed by curing, by infiltration with a gas phase matrix material, followd by curing, or by curing alone, to provide a gap-filling, thermally stable, etch resistant dielectric material.

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