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    • 8. 发明申请
    • ORGANIC COMPOSITIONS
    • 有机成分
    • WO2003057749A1
    • 2003-07-17
    • PCT/US2001/050182
    • 2001-12-31
    • HONEYWELL INTERNATIONAL INC.APEN, Paul, G.BEDWELL, BrianIWAMOTO, NancyKOROLEV, Boris, A.LAU, KreislerLI, Bo
    • APEN, Paul, G.BEDWELL, BrianIWAMOTO, NancyKOROLEV, Boris, A.LAU, KreislerLI, Bo
    • C08G8/10
    • C08G61/02C08L65/00C08L83/16C08L83/00
    • The present composition provides a composition comprising: (a) thermosetting component wherein the thermosetting component comprises monomer having the structure dimer having the structure or a mixture of the monomer and the dimer wherein Y is selected from cage compound and silicon atom; R 1 , R 2 , R 3 , R 4 , R 5 , and R 6 are independently selected from aryl, branched aryl, and arylene ether; at least one of the aryl, the branched aryl, and the arylene ether has an ethynyl group; R 7 is aryl or substituted aryl; and at least one of the R 1 , R 2 , R 3 , R 4 , R 5 , and R 6 comprises at least two isomers; and (b) adhesion promoter comprising compound having at least bifunctionality wherein the bifunctionality may be the same or different and the first functionality is capable of interacting with the thermosetting component (a) and the second functionality is capable of interacting with a substrate when the composition is applied to a substrate. The present composition is particularly useful as a dielectric material in microelectronic applications.
    • 本发明组合物提供了一种组合物,其包含:(a)热固性组分,其中所述热固性组分包含具有结构二聚体的单体或具有单体和二聚体的混合物的单体,其中Y选自笼形化合物和硅原子; R 1,R 2,R 3,R 4,R 5和R 6独立地选自芳基,支链芳基和亚芳基醚; 芳基,支链芳基和亚芳基醚中的至少一个具有乙炔基; R7是芳基或取代的芳基; 并且R 1,R 2,R 3,R 4,R 5和R 6中的至少一个包含至少两种异构体; 和(b)包含至少具有双官能度的化合物的粘合促进剂,其中双官能度可以相同或不同,并且第一官能团能够与热固性组分(a)相互作用,并且当组合物 施加到基板。 本发明的组合物特别可用作微电子应用中的介电材料。