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1. 发明申请

WO2004060610A3 SUBSTRATE HOLDING MECHANISM, SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD 审中-公开
标题翻译：基板保持机构，基板抛光装置和基板抛光方法
公开(公告)号：WO2004060610A3
公开(公告)日：2004-11-25
申请号：PCT/JP0317032
申请日：2003-12-26
申请人： EBARA CORP , TOSHIBA KK , TOGAWA TETSUJI , WATANABE TOSHIO , YANO HIROYUKI , TOYOTA GEN , IWADE KENJI , TATEYAMA YOSHIKUNI
发明人： TOGAWA TETSUJI , WATANABE TOSHIO , YANO HIROYUKI , TOYOTA GEN , IWADE KENJI , TATEYAMA YOSHIKUNI
IPC分类号： B24B37/04 , B24B37/30 , B24B37/32 , B24B41/06 , B24B49/14 , B24B55/02 , H01L21/304
CPC分类号： B24B37/015 , B24B41/061 , B24B55/02
摘要： A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing the amount of heat generated during polishing of a substrate to be polished and of effectively cooling the substrate holding part of the substrate holding mechanism and also capable of effectively preventing the polishing solution and polishing dust from adhering to the outer peripheral portion of the substrate holding part and drying out thereon. The substrate holding mechanism (top ring 1) has a mounting flange 2, a support member 6, and a retainer ring 3. A substrate W to be polished is held on the lower side of the support member 6 surrounded by the retainer ring 3, and the substrate W is pressed against a polishing surface. The mounting flange 2 is provided with a flow passage 26 contiguous with at least the retainer ring 3. A temperature-controlled gas is supplied through the flow passage 26 to cool the mounting flange 2, the support member 6 and the retainer ring 3. The retainer ring 3 is provided with a plurality of through-holes 3a communicating with the flow passage 26 to spray the gas flowing through the flow passage 26 onto the polishing surface of a polishing table.
摘要翻译：基板保持机构，基板研磨装置和基板研磨方法具有能够使待研磨基板的抛光时产生的热量最小化的功能，并有效地冷却基板保持机构的基板保持部，并且还能够有效地防止研磨液和研磨粉尘附着在基板保持部的外周部并在其上干燥。基板保持机构（顶环1）具有安装凸缘2，支撑构件6和保持环3.待被抛光的基板W被保持在由保持环3包围的支撑构件6的下侧，将基板W压在研磨面上。安装凸缘2设置有与至少保持环3相邻的流动通道26.通过流动通道26供应温度控制的气体以冷却安装凸缘2，支撑构件6和保持环3。保持环3设置有与流路26连通的多个通孔3a，以将流过流路26的气体喷射到研磨台的研磨面上。

2. 发明专利

DE19544328B4 Poliervorrichtung 未知
公开(公告)号：DE19544328B4
公开(公告)日：2014-03-20
申请号：DE19544328
申请日：1995-11-28
申请人： EBARA CORP , TOSHIBA KK
发明人： NISHI TOYOMI , TOGAWA TETSUJI , SAITO HARUMITSU , TSUJIMURA MANABU , YAJIMA HIROMI , HIMUKAI KAZUAKI , KODAMA SHOICHI , IMOTO YUKIO , AOKI RIICHIRO , WATASE MASAKO , SHIGETA ATSUSHI , MISHIMA SHIRO , KOUNO GISUKE
IPC分类号： B24B29/02 , H01L21/304 , B08B1/04 , B24B7/22 , B24B27/00 , B24B37/34 , B24B41/00 , B24B51/00 , B24B55/12 , F24F3/16 , H01L21/00
摘要： Eine Vorrichtung zum Polieren und anschließenden Reinigen eines Halbleiterwafers (4) wobei die Vorrichtung Folgendes aufweist: eine umschlossene Struktur mit einer Außenwand und einer Unterteilung, die mindestens zwei Kammern in der umschlossenen Struktur bildet, wobei die Unterteilung eine Öffnung hat, um es dem Halbleiterwafer (4) zu gestatten, dahindurch zu gehen; einen Polierabschnitt (2) zum Polieren des Halbleiterwafers (4), wobei der Polierabschnitt (2) in einer ersten Kammer (48) der mindestens zwei Kammern angeordnet ist; eine Reinigungseinheit (74) zum Reinigen des Halbleiterwafers (4), der poliert wurde, wobei die Reinigungseinheit (74) in einer zweiten Kammer (49) der mindestens zwei Kammern angeordnet ist, wobei der Reinigungsabschnitt (30) eine Vielzahl von Reinigungseinrichtungen aufweist, die einen zunehmend höheren Grad an Reinheit des Halbleiterwafers (4) vorsehen; Transfermittel zum Transferieren des polierten Halbleiterwafers (4) von dem Polierabschnitt (2) durch die Öffnung zu der Reinigungseinheit; eine Trockeneinheit (75) zum Trocknen des Halbleiterwafers (4), der gereinigt wurde, wobei die Trockeneinheit (75) in einer anderen als der ersten Kammer (48) der mindestens zwei Kammern gelegen ist; und ...

3. 发明专利

AU2003295242A8 Substrate holding mechanism, substrate polishing apparatus and substrate polishing method 未知
公开(公告)号：AU2003295242A8
公开(公告)日：2004-07-29
申请号：AU2003295242
申请日：2003-12-26
申请人： EBARA CORP , TOSHIBA KK
发明人： TATEYAMA YOSHIKUNI , TOGAWA TETSUJI , WATANABE TOSHIO , YANO HIROYUKI , TOYOTA GEN , IWADE KENJI
IPC分类号： B24B37/04 , B24B37/30 , B24B37/32 , B24B41/06 , B24B49/14 , B24B55/02 , H01L21/304
摘要： A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing an amount of heat generated during polishing of a substrate to be polished and of effectively cooling a substrate holding part of the substrate holding mechanism, and also capable of effectively preventing a polishing solution and polishing dust from adhering to an outer peripheral portion of the substrate holding part and drying thereon. The substrate holding mechanism has a mounting flange, a support member 6 and a retainer ring. A substrate to be polished is held on a lower side of the support member surrounded by the retainer ring, and the substrate is pressed against a polishing surface of a polishing table. The mounting flange is provided with a flow passage contiguous with at least the retainer ring. A temperature-controlled gas is supplied through the flow passage to cool the mounting flange, the support member and the retainer ring. The retainer ring is provided with a plurality of through-holes communicating with the flow passage to spray the gas flowing through the flow passage onto the polishing surface of the polishing table.

4. 发明专利

DE19544328A1 Polishing device for upper surface of workpiece 未知
公开(公告)号：DE19544328A1
公开(公告)日：1996-05-30
申请号：DE19544328
申请日：1995-11-28
申请人： EBARA CORP , TOSHIBA KK
发明人： NISHI TOYOMI , TOGAWA TETSUJI , SAITO HARUMITSU , TSUJIMURA MANABU , YAJIMA HIROMI , HIMUKAI KAZUAKI , KODAMA SHOICHI , IMOTO YUKIO , AOKI RIICHIRO , WATASE MASAKO , SHIGETA ATSUSHI , MISHIMA SHIRO , KOUNO GISUKE
IPC分类号： H01L21/304 , B08B1/04 , B24B27/00 , B24B37/34 , B24B51/00 , B24B55/12 , F24F3/16 , H01L21/00 , B24B29/02 , B24B7/22 , B24B41/00
摘要： The polishing device has a casting unit (1), a dividing wall (22) dividing the interior of the casing unit into at least two chambers (48,49), a polishing sector (2) in the first chamber, a turntable (3) with polishing cloth (7) on its upper surface, and an upper ring (5) positioned above the turntable for the workpiece.The workpiece is pressed against the polishing cloth. There is also a cleaning sector (30) in the second chamber (49) to clean the polished workpiece. There is also a device to transfer the workpiece from the polishing sector to the cleaning sector. Air can be supplied independently to the polishing and cleaning sectors.

5. 发明申请

WO0247139A3 METHODE OF FORMING A COPPER FILM ON A SUBSTRATE 审中-公开
标题翻译：在基材上形成铜膜的方法
公开(公告)号：WO0247139A3
公开(公告)日：2004-01-15
申请号：PCT/JP0110590
申请日：2001-12-04
申请人： EBARA CORP , KONDO FUMIO , MISHIMA KOJI , TANAKA AKIRA , SUZUKI YOKO , TOGAWA TETSUJI , INOUE HIROAKI
发明人： KONDO FUMIO , MISHIMA KOJI , TANAKA AKIRA , SUZUKI YOKO , TOGAWA TETSUJI , INOUE HIROAKI
IPC分类号： B65G49/07 , B24B37/04 , B24B49/16 , C23C18/16 , C25D5/00 , C25D5/50 , C25D7/12 , H01L21/00 , H01L21/02 , H01L21/288 , H01L21/304 , H01L21/3205 , H01L21/321 , H01L21/673 , H01L21/677 , H01L21/768 , H01L23/52 , B24B7/22
CPC分类号： H01L21/67161 , B24B37/005 , B24B37/042 , B24B37/245 , B24B37/345 , B24B41/061 , B24B49/16 , C23C18/1632 , C23C18/1653 , C25D7/123 , H01L21/02074 , H01L21/02087 , H01L21/0209 , H01L21/288 , H01L21/2885 , H01L21/3212 , H01L21/67167 , H01L21/67173 , H01L21/67184 , H01L21/67219 , H01L21/6723 , H01L21/67393 , H01L21/67396 , H01L21/67772 , H01L21/7684 , H01L21/76843 , H01L21/76849 , H01L21/76864 , H01L21/76873 , H01L21/76874 , H01L21/76877
摘要： A substrate processing method comprising steps for forming a copper film on a surface of a substrate. These steps includes the step of filling a first metal in the trenches so as to form a plated film of the first metal on an entire surface of the substrate by electroplating, wherein the electromagnetic field is adjusted by the virtual anode so that differences of thickness of the plated film between the central portion and the peripheral portion of the substrate being minimized, and polishing and removing the plated film by pressing the substrate to the polishing surface, wherein the pressures pressing the substrate to the polishing surface at a central portion and a peripheral portion are adjusted.
摘要翻译：一种基板处理方法，包括在基板的表面上形成铜膜的步骤。这些步骤包括在沟槽中填充第一金属以便通过电镀在基板的整个表面上形成第一金属的镀膜的步骤，其中电磁场由虚拟阳极调节，使得厚度差异基板的中心部分和周边部分之间的镀膜最小化，并且通过将基板压在研磨表面上来研磨和去除镀膜，其中将基板压在抛光表面的压力在中心部分和周边部分进行调整。

6. 发明公开

EP1625613A4 SUBSTRATE HOLDING APPARATUS AND POLISHING APPARATUS 有权
标题翻译：基板保持装置和抛光设备
公开(公告)号：EP1625613A4
公开(公告)日：2008-07-16
申请号：EP04714500
申请日：2004-02-25
申请人： EBARA CORP
发明人： TOGAWA TETSUJI , NABEYA OSAMU
IPC分类号： H01L21/304 , B24B37/04 , B24B37/30 , B24B37/32 , B24B49/16 , H01L21/00 , H01L21/68
CPC分类号： H01L21/6838 , B24B37/30 , B24B49/16 , H01L21/67092
摘要： A substrate holding apparatus holds a substrate such as a semiconductor and presses the substrate against a polishing surface. The substrate holding apparatus includes a top ring body (2) for holding the substrate, a plurality of fluid passages (33, 34, 35, 36) for supplying a fluid to a plurality of pressure chambers (22, 23, 24, 25) defined in the top ring body, and a plurality of sensors (S1, S2, S3, S4) disposed in the fluid passages, respectively, for detecting flowing states of the fluid which flows through the fluid passages.

7. 发明公开

EP1496543A4 POLISHING DEVICE AND SUBSTRATE PROCESSING DEVICE 有权
标题翻译：抛光装置及基板处理装置
公开(公告)号：EP1496543A4
公开(公告)日：2010-01-13
申请号：EP03746438
申请日：2003-04-09
申请人： EBARA CORP
发明人： WAKABAYASHI SATOSHI , TOGAWA TETSUJI , KOSUGE RYUICHI , ATO KOJI , SOTOZAKI HIROSHI
IPC分类号： H01L21/304 , B24B37/04 , C23F1/00 , H01L21/00 , H01L21/677 , H01L21/68 , H01L21/687
CPC分类号： B24B37/345 , H01L21/67219 , H01L21/67745 , H01L21/67751 , H01L21/67766 , H01L21/68707

8. 发明公开

EP1495837A4 POLISHING METHOD 有权
标题翻译： POLIERVERFAHREN
公开(公告)号：EP1495837A4
公开(公告)日：2005-11-02
申请号：EP03717630
申请日：2003-04-17
申请人： EBARA CORP
发明人： TOGAWA TETSUJI , FUKUSHIMA MAKOTO , SAKURAI KUNIHIKO , YOSHIDA HIROSHI , NABEYA OSAMU , ICHIMURA TERUHIKO
IPC分类号： B24B37/005 , B24B37/30 , H01L21/304 , H01L21/306 , B24B37/04
CPC分类号： B24B37/30 , B24B37/013 , B24B37/042 , H01L21/30625 , Y10S438/977
摘要： A polishing method where a semiconductor wafer (W) is held by a top ring (23), pressed against a polishing surface (10) and polished. An elastic diaphragm (60) is installed on the lower face of an vertical moving member (62) so as to define a pressure chamber (70) in the top ring (23). A pressurized fluid is supplied to the pressure chamber (70) in order that the semiconductor wafer (W) is pressed against the polishing surface (10) by the fluid pressure of the fluid and polished. The pressurized fluid is jetted from an opening (62a) formed at the center of the vertical moving member (62) in order to separate the polished semiconductor wafer (W) from the top ring (23).
摘要翻译：一种抛光方法，其中半导体晶片（W）由顶环（23）固定，压在抛光表面（10）上并抛光。在垂直移动件（62）的下表面上安装一个弹性隔膜（60），以便在顶环（23）中形成一个压力室（70）。为了通过流体的流体压力将半导体晶片（W）压靠在抛光表面（10）上并抛光，将加压流体供应到压力室（70）。加压流体从形成在垂直移动部件（62）的中心处的开口（62a）喷出，以便将抛光的半导体晶片（W）从顶环（23）分离。

9. 发明公开

EP1412130A4 POLISHING APPARATUS AND POLISHING METHOD 有权
标题翻译：抛光设备及研磨方法
公开(公告)号：EP1412130A4
公开(公告)日：2008-07-23
申请号：EP02730744
申请日：2002-05-29
申请人： EBARA CORP
发明人： TOGAWA TETSUJI
IPC分类号： B24B37/04 , B24B37/30 , B24B37/32 , H01L21/304 , H01L21/321
CPC分类号： B24B37/30 , H01L21/3212
摘要： A polishing apparatus comprises a first polishing table having a first polishing surface, a substrate carrier for holding a substrate and positioning the substrate so as to bring a surface of the substrate into contact with the first polishing surface, a pressing mechanism for pressing, against the first polishing surface, the surface of the substrate which has been brought into contact with the first polishing surface by the substrate carrier, a retainer ring mounted on the substrate carrier so as to surround the substrate which has been pressed against the first polishing surface by the pressing mechanism, and a retainer-ring-position-adjustment mechanism for adjustably positioning the retainer ring relative to the substrate, which has been pressed against the first polishing surface, in directions toward and away from the first polishing surface.

10. 发明公开

EP1833640A4 SUBSTRATE HOLDING DEVICE AND POLISHING APPARATUS 有权
标题翻译：基板保持装置和抛光设备
公开(公告)号：EP1833640A4
公开(公告)日：2008-02-06
申请号：EP05814728
申请日：2005-12-06
申请人： EBARA CORP
发明人： TOGAWA TETSUJI , YOSHIDA HIROSHI , NABEYA OSAMU , FUKUSHIMA MAKOTO , FUKAYA KOICHI
IPC分类号： B24B37/005 , B24B37/04 , B24B37/30 , H01L21/304
CPC分类号： B24B37/30
摘要： A substrate holding device according to the present invention includes an elastic membrane to be brought into contact with a rear surface of a substrate, an attachment member for securing at least a portion of the elastic membrane, and a retainer ring for holding a peripheral portion of the substrate while in contact with the elastic membrane. The elastic membrane comprises at least one projecting portion, and the attachment member comprises at least one engagement portion engaging side surfaces of the at least one projecting portion of the elastic membrane. The elastic membrane further comprises bellows portions expandable in a pressing direction so as to allow the elastic membrane to press the substrate, and contractible along the pressing direction.

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