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1. 发明专利

DE60336386D1 POLIEREINRICHTUNG 未知
公开(公告)号：DE60336386D1
公开(公告)日：2011-04-28
申请号：DE60336386
申请日：2003-04-09
申请人： EBARA CORP
发明人： WAKABAYASHI SATOSHI , TOGAWA TETSUJI , KOSUGE RYUICHI , ATO KOJI , SOTOZAKI HIROSHI
IPC分类号： H01L21/304 , B24B37/04 , C23F1/00 , H01L21/00 , H01L21/677 , H01L21/68 , H01L21/687

2. 发明专利

AU2003236011A1 POLISHING DEVICE AND SUBSTRATE PROCESSING DEVICE 未知
公开(公告)号：AU2003236011A1
公开(公告)日：2003-10-27
申请号：AU2003236011
申请日：2003-04-09
申请人： EBARA CORP
发明人： ATO KOJI , SOTOZAKI HIROSHI , WAKABAYASHI SATOSHI , TOGAWA TETSUJI , KOSUGE RYUICHI
IPC分类号： B24B37/04 , C23F1/00 , H01L21/00 , H01L21/304 , H01L21/677 , H01L21/68 , H01L21/687
摘要： The present invention relates to a polishing apparatus having a plurality of polishing units (30A-30D). Moving mechanisms for moving top rings (301A SIMILAR 301D) between polishing positions on the polishing surfaces and wafer receiving/delivering positions are provided in each of the polishing units. Linear transporters (5, 6) are provided for transferring the wafer between a plurality of transferring positions (TP1-TP7) including the wafer receiving/delivering positions. Pushers (33, 34, 37, 38) for receiving and delivering the wafer between the linear transporters (5, 6) and the top rings (301A-301D) are provided at the transferring positions (TP2, TP3, TP6, TP7) as the wafer receiving/delivering positions.

3. 发明专利

DE69927111T2 未知
公开(公告)号：DE69927111T2
公开(公告)日：2006-06-29
申请号：DE69927111
申请日：1999-11-08
申请人： EBARA CORP
发明人： SOTOZAKI HIROSHI , ATO KOJI
IPC分类号： B24B37/00 , B24B37/34 , B24B51/00 , H01L21/00 , H01L21/02 , H01L21/304 , H01L21/306
摘要： The present invention relates to a method and apparatus for polishing a substrate such as a semiconductor wafer, a glass substrate, or a liquid crystal display to a flat mirror finish, and then cleaning a polished substrate that requires a high degree of cleanliness. The apparatus comprises a polishing section having at least one polishing unit for performing a primary polishing and a secondary polishing of the substrate by pressing the substrate against a polishing surface, a cleaning section for cleaning said substrate which has been polished to remove particles attached to said substrate by a scrubbing cleaning, and removing metal ion from said substrate by supplying an etching liquid.

4. 发明公开

EP1496543A4 POLISHING DEVICE AND SUBSTRATE PROCESSING DEVICE 有权
标题翻译：抛光装置及基板处理装置
公开(公告)号：EP1496543A4
公开(公告)日：2010-01-13
申请号：EP03746438
申请日：2003-04-09
申请人： EBARA CORP
发明人： WAKABAYASHI SATOSHI , TOGAWA TETSUJI , KOSUGE RYUICHI , ATO KOJI , SOTOZAKI HIROSHI
IPC分类号： H01L21/304 , B24B37/04 , C23F1/00 , H01L21/00 , H01L21/677 , H01L21/68 , H01L21/687
CPC分类号： B24B37/345 , H01L21/67219 , H01L21/67745 , H01L21/67751 , H01L21/67766 , H01L21/68707

5. 发明公开

EP1988568A4 SUBSTRATE TREATING DEVICE, SUBSTRATE CONVEY DEVICE, SUBSTRATE GRASPING DEVICE, AND CHEMICAL SOLUTION TREATING DEVICE 审中-公开
标题翻译：基板处理装置，基板运送装置，对于具有化学溶液处理基板器件扣押和设备
公开(公告)号：EP1988568A4
公开(公告)日：2011-10-26
申请号：EP07715034
申请日：2007-02-21
申请人： EBARA CORP
发明人： TAKAHASHI NOBUYUKI , NISHIDA HIROAKI , TORII HIROOMI , ISOBE SOICHI , SONE TADAKAZU , KOSUGE RYUICHI , KANEKO HIROYUKI , SOTOZAKI HIROSHI , MITSUKURA TAKAO , OGAWA TAKAHIRO , SUGITA KENICHI
IPC分类号： H01L21/687 , B24B37/34 , H01L21/677
CPC分类号： H01L21/67219 , B24B37/345 , H01L21/6719 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/67751 , H01L21/67766 , H01L21/68707

6. 发明专利

SG10201502285YA POLISHING APPARATUS 未知
公开(公告)号：SG10201502285YA
公开(公告)日：2015-10-29
申请号：SG10201502285Y
申请日：2015-03-24
申请人： EBARA CORP
发明人： KOSUGE RYUICHI , SOTOZAKI HIROSHI , KAWANO TAKAHIRO , MOCHIDA AKIHIRO

7. 发明专利

DE69927111D1 未知
公开(公告)号：DE69927111D1
公开(公告)日：2005-10-13
申请号：DE69927111
申请日：1999-11-08
申请人： EBARA CORP
发明人： SOTOZAKI HIROSHI , ATO KOJI
IPC分类号： B24B37/00 , B24B37/34 , B24B51/00 , H01L21/00 , H01L21/02 , H01L21/304 , H01L21/306 , B24B37/04
摘要： The present invention relates to a method and apparatus for polishing a substrate such as a semiconductor wafer, a glass substrate, or a liquid crystal display to a flat mirror finish, and then cleaning a polished substrate that requires a high degree of cleanliness. The apparatus comprises a polishing section having at least one polishing unit for performing a primary polishing and a secondary polishing of the substrate by pressing the substrate against a polishing surface, a cleaning section for cleaning said substrate which has been polished to remove particles attached to said substrate by a scrubbing cleaning, and removing metal ion from said substrate by supplying an etching liquid.

8. 发明专利

JP2012209589A Substrate processing apparatus 审中-公开
标题翻译：基板加工设备
公开(公告)号：JP2012209589A
公开(公告)日：2012-10-25
申请号：JP2012158786
申请日：2012-07-17
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TAKAHASHI NOBUYUKI , NISHIDA HIROAKI , TORII HIROOMI , ISOBE SOICHI , SONE CHUICHI , KOSUGE RYUICHI , KANEKO HIROYUKI , SOTOZAKI HIROSHI , MITSUKURA TAKAO , OGAWA TAKAHIRO , SUGITA KENICHI
IPC分类号： H01L21/677 , B24B37/005 , B24B37/34 , H01L21/304
CPC分类号： H01L21/67219 , B24B37/345 , H01L21/6719 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/67751 , H01L21/67766 , H01L21/68707
摘要： PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which enables easy maintenance work.SOLUTION: A substrate processing apparatus has multiple processing parts performing predetermined processing on substrates. At least one of the multiple processing parts has a frame body 710, a fixed leg 712 fixing the frame body 710, a main roller 718 rolling in the drawing direction, and a length adjustable caster leg 714. The caster leg 714 is formed so as to be longer than the fixed leg 712, and the structure allows the caster leg 714 to support the frame body 710 when the frame body 710 is drawn.
摘要翻译：要解决的问题：提供一种能够容易地进行维护工作的基板处理装置。解决方案：基板处理装置具有对基板进行预定处理的多个处理部。多个处理部件中的至少一个具有框体710，固定框架体710的固定脚部712，沿着拉拔方向滚动的主辊718和长度可调节脚轮714.脚轮脚714形成为比固定腿部712长，并且当框架体710被拉动时，结构允许脚轮腿714支撑框架体710。版权所有（C）2013，JPO＆INPIT

9. 发明专利

JP2002057137A WAFER WASHING DEVICE AND WATER TREATMENT DEVICE 失效
公开(公告)号：JP2002057137A
公开(公告)日：2002-02-22
申请号：JP2000242905
申请日：2000-08-10
申请人： EBARA CORP
发明人： SOTOZAKI HIROSHI
IPC分类号： B08B1/04 , B08B3/02 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a wafer washing device with which sufficient clean air can be supplied by a downflow, diffusion of a chemical agent atmosphere can be prevented in an appropriately closed structure and reattachment of mist upon drying can be prevented when chemical agent washing and spin drying are performed in a bath. SOLUTION: A downflow is formed in a washing bath 11 by providing a suction port 12 on top thereof and an exhaust port 17 at the bottom thereof. A wafer to be washed Wf is rotated in the washing bath 11 so that the wafer to be washed Wf can be washed and dried in the same washing bath 11. This wafer washing device is equipped with water jetting nozzles 14, 14 for forming a water curtain covering the suction port 12 with a curtain made of water.

10. 发明专利

JP2002043272A SUBSTRATE CLEANING APPARATUS AND SUBSTRATE PROCESSING APPARATUS 失效
公开(公告)号：JP2002043272A
公开(公告)日：2002-02-08
申请号：JP2000229104
申请日：2000-07-28
申请人： EBARA CORP
发明人： SOTOZAKI HIROSHI
IPC分类号： B08B3/02 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a safe substrate cleaning apparatus which can supply sufficiently the clean air owing to down-flow even when cleaning by chemicals and spin-drying are conducted within a tank, prevent diffusion of atmosphere of chemicals and re-deposition of mist during the drying process in an adequate closed construction, and also maintain the closed construction for a certain period even if an exhaust system is failed and thereby prevent diffusion of the chemicals. SOLUTION: The substrate cleaning apparatus is provided with a suction port 12 at an upper part of a cleaning tank 11, and a exhaust port 17 at the bottom portion to form down-flow within the cleaning tank 11. The apparatus rotates a substrate Wf to be cleaned within the cleaning tank 11 to realize cleaning and drying processes of the substrate to be cleaned within the same cleaning tank 11. Moreover, a door 14 is also provided to close and open the suction port 12. When the pressure in the cleaning tank 11 is defined as PIN, while an outside pressure of the cleaning tank is defined as POUT, the suction port 12 is opened for the condition of PIN =POUT.

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