专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

DE19544328B4 Poliervorrichtung 未知
公开(公告)号：DE19544328B4
公开(公告)日：2014-03-20
申请号：DE19544328
申请日：1995-11-28
申请人： EBARA CORP , TOSHIBA KK
发明人： NISHI TOYOMI , TOGAWA TETSUJI , SAITO HARUMITSU , TSUJIMURA MANABU , YAJIMA HIROMI , HIMUKAI KAZUAKI , KODAMA SHOICHI , IMOTO YUKIO , AOKI RIICHIRO , WATASE MASAKO , SHIGETA ATSUSHI , MISHIMA SHIRO , KOUNO GISUKE
IPC分类号： B24B29/02 , H01L21/304 , B08B1/04 , B24B7/22 , B24B27/00 , B24B37/34 , B24B41/00 , B24B51/00 , B24B55/12 , F24F3/16 , H01L21/00
摘要： Eine Vorrichtung zum Polieren und anschließenden Reinigen eines Halbleiterwafers (4) wobei die Vorrichtung Folgendes aufweist: eine umschlossene Struktur mit einer Außenwand und einer Unterteilung, die mindestens zwei Kammern in der umschlossenen Struktur bildet, wobei die Unterteilung eine Öffnung hat, um es dem Halbleiterwafer (4) zu gestatten, dahindurch zu gehen; einen Polierabschnitt (2) zum Polieren des Halbleiterwafers (4), wobei der Polierabschnitt (2) in einer ersten Kammer (48) der mindestens zwei Kammern angeordnet ist; eine Reinigungseinheit (74) zum Reinigen des Halbleiterwafers (4), der poliert wurde, wobei die Reinigungseinheit (74) in einer zweiten Kammer (49) der mindestens zwei Kammern angeordnet ist, wobei der Reinigungsabschnitt (30) eine Vielzahl von Reinigungseinrichtungen aufweist, die einen zunehmend höheren Grad an Reinheit des Halbleiterwafers (4) vorsehen; Transfermittel zum Transferieren des polierten Halbleiterwafers (4) von dem Polierabschnitt (2) durch die Öffnung zu der Reinigungseinheit; eine Trockeneinheit (75) zum Trocknen des Halbleiterwafers (4), der gereinigt wurde, wobei die Trockeneinheit (75) in einer anderen als der ersten Kammer (48) der mindestens zwei Kammern gelegen ist; und ...

2. 发明专利

DE19544328A1 Polishing device for upper surface of workpiece 未知
公开(公告)号：DE19544328A1
公开(公告)日：1996-05-30
申请号：DE19544328
申请日：1995-11-28
申请人： EBARA CORP , TOSHIBA KK
发明人： NISHI TOYOMI , TOGAWA TETSUJI , SAITO HARUMITSU , TSUJIMURA MANABU , YAJIMA HIROMI , HIMUKAI KAZUAKI , KODAMA SHOICHI , IMOTO YUKIO , AOKI RIICHIRO , WATASE MASAKO , SHIGETA ATSUSHI , MISHIMA SHIRO , KOUNO GISUKE
IPC分类号： H01L21/304 , B08B1/04 , B24B27/00 , B24B37/34 , B24B51/00 , B24B55/12 , F24F3/16 , H01L21/00 , B24B29/02 , B24B7/22 , B24B41/00
摘要： The polishing device has a casting unit (1), a dividing wall (22) dividing the interior of the casing unit into at least two chambers (48,49), a polishing sector (2) in the first chamber, a turntable (3) with polishing cloth (7) on its upper surface, and an upper ring (5) positioned above the turntable for the workpiece.The workpiece is pressed against the polishing cloth. There is also a cleaning sector (30) in the second chamber (49) to clean the polished workpiece. There is also a device to transfer the workpiece from the polishing sector to the cleaning sector. Air can be supplied independently to the polishing and cleaning sectors.

3. 发明专利

DE19538991A1 Mirror polishing device for semiconductor wafer surface 未知
公开(公告)号：DE19538991A1
公开(公告)日：1996-05-02
申请号：DE19538991
申请日：1995-10-19
申请人： EBARA CORP
发明人： NISHI TOYOMI , TSUJIMURA MANABU , TAKAHASHI TAMAMI , YAJIMA HIROMI , AOKI RIICHIRO , IMOTO YUKIO , KODAMA SHOICHI , HIMUKAI KAZUAKI , KOUNO GISUKE , NISHIMURA TAKANOBU
IPC分类号： B24B37/20 , B24B37/24 , H01L21/304 , B24B29/02
摘要： The polishing device is used to provide the polished object with a flat mirror surface using a turntable (4) with an attached polishing cloth cassette (1). A supply device (14) is used to deliver a polishing soln. to the surface of the polishing cloth, against which the surface of the polished object is pressed via a pressure device (11). The polishing cloth cassette is in the form of a disc releasably attached to the turntable, with a ratio between its dia., and thickness of between 0.0005 and 0.05. The cassette may be fitted with a removable cover for protecting the polishing cloth.

4. 发明专利

JP2004235664A Polishing apparatus 有权
公开(公告)号：JP2004235664A
公开(公告)日：2004-08-19
申请号：JP2004116866
申请日：2004-04-12
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： NISHI TOYOMI , TOGAWA TETSUJI , YAJIMA HIROMI , IMOTO YUKIO , KODAMA SHOICHI , AOKI RIICHIRO
IPC分类号： B24B37/04 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a polishing apparatus, which complies with the blocking of the apparatus, and is excellent in productivity, expandability, maintenance property, and adaptability to users. SOLUTION: The polishing apparatus, which polishes a wafer, wherein the polishing apparatus comprises a load/unload block 5, which loads a cassette housing the wafer 1, a polishing block 7, which polishes the wafer 1, a cleaning block 8, which cleans the wafer 1, a robot 15, which transfers the wafer 1 and a control block 9, which stores a relative position between the cassette of the load/unload block 5 and the robot 15 and a relative position between the cleaning block 8 and the robot 15 by teaching, each block is independently disposed and the layouts can be changed. COPYRIGHT: (C)2004,JPO&NCIPI

5. 发明专利

JP2003254682A HEAT EXCHANGER AND ABSORPTION REFRIGERATING MACHINE USING IT 审中-公开
公开(公告)号：JP2003254682A
公开(公告)日：2003-09-10
申请号：JP2002052709
申请日：2002-02-28
申请人： EBARA CORP
发明人： SUZUKI AKIYOSHI , MURATA JUN , ISHIYAMA TAKESHI , MATSUBARA TOSHIO , ITO OSAMU , MORI KIKUICHI , KUNIMASA KOICHI , ISHII HIROSHI , IMOTO YUKIO
IPC分类号： F28F9/00 , F25B33/00 , F25B37/00 , F25B39/02 , F25B39/04 , F28D5/02 , F28F9/16 , F28F13/18
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive and strong heat exchanger by forming a constant falling liquid film, and also to provide a compact and high performance absorption refrigerating machine using it. SOLUTION: In this heat exchanger, a plurality of heat exchanger pipes 3 having a shape to be bent at an intermediate part of the pipe for reversing a flow direction are stacked in an upward and downward direction with the bent shapes at the intermediate parts sequentially changed in a manner that an inner face and an outer face of the pipes 3 are almost brought into close contact with each other, so as to form a heat exchanger pipe unit 4. The units 4 are arranged in a horizontal direction at predetermined intervals, so that heats are exchanged between in-pipe fluid flowing inside the pipe 3 and out-pipe fluid flowing outside the pipe 3. Both ends of the pipe 3 are jointed with a pipe plate or a header for in-pipe fluid. Outside dimension at both ends of the pipe 3 is smaller than outside dimension of a center of the pipe 3. The outer surface of the pipe 3 had better to be applied with a hydrophilic treatment for improving wettability. In this absorption refrigerating machine, the heat exchanger is used for at least one of facilities constituting the absorption refrigerating machine. COPYRIGHT: (C)2003,JPO

6. 发明专利

JP2009272655A Polishing apparatus 有权
标题翻译：抛光装置
公开(公告)号：JP2009272655A
公开(公告)日：2009-11-19
申请号：JP2009190599
申请日：2009-08-20
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： NISHI TOYOMI , TOGAWA TETSUJI , YAJIMA HIROMI , HIUGA KAZUAKI , KODAMA SHOICHI , IMOTO YUKIO , AOKI RIICHIRO , WATASE MASAKO , SHIGETA ATSUSHI , MISHIMA SHIRO , KONO YOSHISUKE
IPC分类号： H01L21/304 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To provide a polishing apparatus which can be installed in a clean room capable of efficiently preventing contaminations. SOLUTION: The polishing apparatus is provided with a polishing block 6 for polishing a target to be polished, a cleaning block 9 for cleaning and drying the target after polishing, a transporter 8 for transporting the polished target from the polishing block 6 to the cleaning block 9, a first chamber 27 wherein the polishing block 6 is disposed, and a second chamber 26 wherein the transporter 8 and the cleaning block 9 are disposed. The polishing block 6 has a cleaner which includes a turnable 23 and a top ring 22 for supporting the target on the turnable 23 and roughly cleans the polished target on the top ring 22. After being roughly cleaned, the target is removed from the top ring 22 and then is transported to the cleaning block 9 by the transporter 8 and is cleaned and dried in the cleaning block 9. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种可以安装在能够有效防止污染的洁净室中的抛光装置。解决方案：抛光装置设置有用于抛光抛光对象物的抛光块6，抛光后清理和干燥靶材的清洁块9，用于将抛光对象从抛光块6传送到清洁块9，其中设置有抛光块6的第一室27和其中设置有运送器8和清洁块9的第二室26。抛光块6具有清洁器，其包括可转动23和用于将目标物支撑在可转动件23上的顶环22，并大致清洁顶环22上的抛光目标。在粗略清洁之后，将靶从顶环 22，然后通过运送器8运送到清洁块9，并在清洁块9中进行清洁和干燥。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2002184735A SEMICONDUCTOR WAFER-POLISHING DEVICE AND METHOD THEREFOR 审中-公开
公开(公告)号：JP2002184735A
公开(公告)日：2002-06-28
申请号：JP2001363793
申请日：2001-11-29
申请人： EBARA CORP , TOSHIBA CORP
发明人： SAITO HARUMITSU , TSUJIMURA MANABU , YAJIMA HIROMI , HIUGA KAZUAKI , KODAMA SHOICHI , IMOTO YUKIO , AOKI RIICHIRO , KODERA MASAKO , SHIGETA ATSUSHI , MISHIMA SHIRO , KONO YOSHISUKE
IPC分类号： B24B37/04 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor wafer-polishing device that can be installed in a clean room, and can be unloaded to a next process by a wafer carrier that is used in a normal clean room after cleaning and drying the semiconductor wafer after polishing without causing the clean room to be contaminated, and to provide a method for polishing the semiconductor wafer. SOLUTION: A polishing section 2 for polishing the semiconductor wafer 4 by retaining the semiconductor wafer in an enclosure 1 having a sidewall by top ring 5 and at the same time pressing the semiconductor wafer to a turntable 3, and a washing section 30 for washing the semiconductor wafer 4 are housed. A partition wall 22 for separating the polishing section 2 from the cleaning section 30 is provided, and at the same time a transport mechanism 24 is provided to carry the semiconductor wafer 4 after polishing from the polishing section 2 to the cleaning section 30 via an opening 22a of the partition wall 22, and exhaust systems 46 and 47 are provided to evacuate air independently from the polishing section 2 and the cleaning section 30.

8. 发明专利

JPH08243916A POLISHING DEVICE 失效
公开(公告)号：JPH08243916A
公开(公告)日：1996-09-24
申请号：JP34479795
申请日：1995-12-06
申请人： EBARA CORP , TOSHIBA CORP
发明人： NISHI TOYOMI , TOGAWA TETSUJI , YAJIMA HIROMI , HIUGA KAZUAKI , KODAMA SHOICHI , IMOTO YUKIO , AOKI RIICHIRO , WATASE MASAKO , SHIGETA ATSUSHI , MISHIMA SHIRO , KONO YOSHISUKE
IPC分类号： B23Q11/00 , B24B37/00 , B24B37/04 , B24B55/06 , H01L21/304
摘要： PURPOSE: To provide a polishing device which can effectively prevent pollution and can be installed in a clean room. CONSTITUTION: A polishing device is provided with a loading and unloading block 7 to deliver a cassette housing a wafer, a carrying block 8 to move the wafer from the cassette, a polishing block 6 to polish the wafer, a cleaning block 9 to clean and dry the wafer after it is polished and a control block 10 to control operation of the device, and has a wall plate on the periphery and the ceiling so as to cover the whole of these, and is constituted in a box shape. According to this polishing device, a semiconductor wafer is polished by the polishing block 6, and the polished semiconductor wafer is transferred to the cleaning block 9 from the polishing block. The semiconductor wafer is cleaned and dried. Therefore, the semiconductor wafer is taken out of the polishing device in a cleaned and dried condition.

9. 发明专利

JP2003254681A HEAT EXCHANGER AND ABSORPTION REFRIGERATING MACHINE USING IT 审中-公开
公开(公告)号：JP2003254681A
公开(公告)日：2003-09-10
申请号：JP2002051118
申请日：2002-02-27
申请人： EBARA CORP
发明人： SUZUKI AKIYOSHI , MURATA JUN , ISHIYAMA TAKESHI , MATSUBARA TOSHIO , ITO OSAMU , MORI KIKUICHI , KUNIMASA KOICHI , ISHII HIROSHI , IMOTO YUKIO
IPC分类号： F28F1/22 , F25B15/00 , F25B33/00 , F25B37/00 , F25B39/02 , F25B39/04 , F28D5/02 , F28F13/18
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive and strong heat exchanger by forming a constant falling liquid film, and also to provide a compact and high performance absorption refrigerating machine using it. SOLUTION: In this heat exchanger, heats are exchanged between in-pipe fluid flowing inside a heat exchanger pipe 3 and out-pipe fluid flowing outside the pipe. A plurality of the heat exchanger pipes 3 are arranged in a horizontal direction, and stacked in an upward and downward direction, so as to form a heat exchanger pipe unit 4. A plurality of the units 4 are arranged in a horizontal direction at predetermined intervals, and both ends of the pipe 3 are jointed with a pipe plate 2 or a header for in-pipe fluid. A plate-like fin 12 is installed at the bottom of the pipes 3 in a manner that it is almost brought into close contact with the top face of the pipe 3 arranged at a lower stage of the pipes 3. The outer surface of the pipe 3 had better to be applied with a hydrophilic treatment for improving wettability. In this absorption refrigerating machine, the heat exchanger is used for at least one facility of an evaporator, an absorber, a regenerator and condenser constituting the absorption refrigerating machine. COPYRIGHT: (C)2003,JPO

10. 发明专利

JP2003222437A ABSORPTION REFRIGERATING MACHINE 审中-公开
公开(公告)号：JP2003222437A
公开(公告)日：2003-08-08
申请号：JP2002023085
申请日：2002-01-31
申请人： EBARA CORP
发明人： SUZUKI AKIYOSHI , MURATA JUN , ISHIYAMA TAKESHI , MATSUBARA TOSHIO , ITO OSAMU , MORI KIKUICHI , KUNIMASA KOICHI , ISHII HIROSHI , IMOTO YUKIO
IPC分类号： F25B15/00 , F25B33/00 , F25B37/00 , F25B39/02 , F28D7/16
摘要： PROBLEM TO BE SOLVED: To provide a compact and high performance absorption refrigerating machine by improving a falling liquid film type heat exchanger. SOLUTION: This absorption refrigerating machine is so formed that a plurality of heat transfer pipes 3 having shapes bent in their intermediate parts are vertically stacked with the bent shapes of the mutual transfer pipes 3 vertically changed in order so as to be formed as a unit and the unit is used as an evaporator E and an absorber A. This machine is so constituted that the unit used as the evaporator E feeds cold water to the inside of the heat transfer pipes 3 and drips refrigerant liquid from a spray device 5 to the outside, while the unit used as the absorber A feeds cooling water to the heat transfer pipes 3 and drips absorptive solution from the outside 5. The E unit and the A unit are alternately disposed horizontally in prescribed intervals apart in two tube plates with the heat transfer pipes 3 disposed in the both ends and the E unit and the A unit are joined with one-side tube plate 2 and the other-side tube plate 2 respectively. In this absorption type refrigerating machine, the unit can be used as a regenerator G and a capacitor C. COPYRIGHT: (C)2003,JPO

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式