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2. 发明公开

EP1179617A4 APPARATUS FOR PLATING SUBSTRATE, METHOD FOR PLATING SUBSTRATE, ELECTROLYTIC PROCESSING METHOD, AND APPARATUS THEREOF 审中-公开
标题翻译：装置和方法电镀的基材，电解处理方法及装置
公开(公告)号：EP1179617A4
公开(公告)日：2007-01-24
申请号：EP00985856
申请日：2000-12-25
申请人： EBARA CORP , TOSHIBA KK
发明人： KUNISAWA JUNJI , ODAGAKI MITSUKO , MAKINO NATSUKI , MISHIMA KOJI , NAKAMURA KENJI , INOUE HIROAKI , KIMURA NORIO , MATSUDA TETSUO , KANEKO HISASHI , HAYASAKA NOBUO , OKUMURA KATSUYA , TSUJIMURA MANABU , MORITA TOSHIYUKI
IPC分类号： C23C18/16 , C25D7/12 , C25D17/12 , C25D17/14 , H01L21/00 , H01L21/288 , H01L21/768 , H05K3/42
CPC分类号： H01L21/6719 , C25D7/123 , C25D17/001 , C25D17/12 , C25D17/14 , H01L21/2885 , H01L21/67046 , H01L21/67051 , H01L21/6708 , H01L21/6715 , H01L21/6723 , H01L21/76877 , H01L21/76879 , H01L2924/0002 , H05K3/423 , H01L2924/00
摘要： An apparatus for plating a substrate by filling a fine interconnection pattern (recess) formed in a semiconductor substrate with a metal such as copper (Cu) comprises a substrate holding section (36) for horizontally holding and rotating a substrate so oriented that the surface to be plate faces up, a sealer (90) that comes into contact with the periphery of the surface to be plated of the held substrate to seal the periphery water-tightly, and a cathode (88) that comes into contact with the substrate to supply current thereto, and further comprises a cathode section (38) rotatable with the substrate holding section (36), an electrode arm section (30) provided horizontally and vertically movably above the cathode section (38) and having an anode (98) oriented down, and plating solution injecting means for injecting a plating solution into the space between the surface to be plated of the held substrate and the anode of the electrode arm section (30) brought near to the surface to be plated. Therefore, the processings including the plating and its collateral processings are carried out by means of a single unit. A method for plating a substrate is also disclosed.

3. 发明专利

DE19544328B4 Poliervorrichtung 未知
公开(公告)号：DE19544328B4
公开(公告)日：2014-03-20
申请号：DE19544328
申请日：1995-11-28
申请人： EBARA CORP , TOSHIBA KK
发明人： NISHI TOYOMI , TOGAWA TETSUJI , SAITO HARUMITSU , TSUJIMURA MANABU , YAJIMA HIROMI , HIMUKAI KAZUAKI , KODAMA SHOICHI , IMOTO YUKIO , AOKI RIICHIRO , WATASE MASAKO , SHIGETA ATSUSHI , MISHIMA SHIRO , KOUNO GISUKE
IPC分类号： B24B29/02 , H01L21/304 , B08B1/04 , B24B7/22 , B24B27/00 , B24B37/34 , B24B41/00 , B24B51/00 , B24B55/12 , F24F3/16 , H01L21/00
摘要： Eine Vorrichtung zum Polieren und anschließenden Reinigen eines Halbleiterwafers (4) wobei die Vorrichtung Folgendes aufweist: eine umschlossene Struktur mit einer Außenwand und einer Unterteilung, die mindestens zwei Kammern in der umschlossenen Struktur bildet, wobei die Unterteilung eine Öffnung hat, um es dem Halbleiterwafer (4) zu gestatten, dahindurch zu gehen; einen Polierabschnitt (2) zum Polieren des Halbleiterwafers (4), wobei der Polierabschnitt (2) in einer ersten Kammer (48) der mindestens zwei Kammern angeordnet ist; eine Reinigungseinheit (74) zum Reinigen des Halbleiterwafers (4), der poliert wurde, wobei die Reinigungseinheit (74) in einer zweiten Kammer (49) der mindestens zwei Kammern angeordnet ist, wobei der Reinigungsabschnitt (30) eine Vielzahl von Reinigungseinrichtungen aufweist, die einen zunehmend höheren Grad an Reinheit des Halbleiterwafers (4) vorsehen; Transfermittel zum Transferieren des polierten Halbleiterwafers (4) von dem Polierabschnitt (2) durch die Öffnung zu der Reinigungseinheit; eine Trockeneinheit (75) zum Trocknen des Halbleiterwafers (4), der gereinigt wurde, wobei die Trockeneinheit (75) in einer anderen als der ersten Kammer (48) der mindestens zwei Kammern gelegen ist; und ...

4. 发明专利

DE69535054T2 未知
公开(公告)号：DE69535054T2
公开(公告)日：2007-01-04
申请号：DE69535054
申请日：1995-08-23
申请人： EBARA CORP , TOSHIBA KK
发明人： HARADA MINORU , SHINJO RYOICHI , TSUJIMURA MANABU , NAKATA REMPEI , MIYAZAKI KUNIHIRO , KAJI NARUHIKO , NAKANO YUTAKA
IPC分类号： C01B13/11 , C01B13/10 , C23C8/12 , C23C16/40 , C23C16/44 , C23C16/448
摘要： Ozonizer (10) which supplies a feed gas to ozone generating cell (11) under application of a high voltage and which delivers an ozone gas through an ozone gas transport path (consisting of pipes (14) and (15)) as it has been generated in said ozone generating cell (11) is characterized in that the ozone gas transport path is furnished with means for removing at least one of NOx, HF and SOx (in the drawings, the means is for removing NOx) and that the ozone gas from the ozone generating cell (11) is passed through said removing means, whereby at least one of NOx, HF and SOx in said ozone gas is removed before it is delivered to a subsequent stage. The product ozone is not contaminated with Cr compounds at all or insufficiently contaminated to cause any practical problems in the fabrication of highly integrated semiconductor devices. Alternatively, ozonizer (10) which comprises an ozone generating cell (11) having an inlet (8) for supplying a feed gas, high voltage applying means (35) and an outlet (29) for discharging the ozone generated, and ozone delivery paths (30) and (31) for delivering the generated ozone is characterized in that oxygen (1) supplemented with 10 - 20 vol% of carbon dioxide and/or carbon monoxide (2) is used as the feed gas. The thus produced ozone is significantly low in the level of Cr compounds and, hence, can suitably be used in the formation of metal oxides, in particular, silicon oxide.

5. 发明专利

DE69028796T2 未知
公开(公告)号：DE69028796T2
公开(公告)日：1997-05-07
申请号：DE69028796
申请日：1990-05-04
申请人： TOSHIBA KK , EBARA CORP
发明人： OKUMURA KATSUYA , KURIYAMA FUMIO , MURAI YUKIO , TSUJIMURA MANABU , SOBUKAWA HIROSHI
IPC分类号： F04B37/16 , B01J3/02 , F04B37/06 , F04D19/04 , H01L21/302 , H01L39/24 , B01D8/00
摘要： An evacuation apparatus and method using a turbomolecular pump (26) having a rotor provided with a plurality of rotor blades and a spacer provided with a plurality of stator blades so that gas molecules are sucked in from a suction port, compressed and discharged from an exhaust port of the turbomolecular pump (26) is disclosed. A heat exchanger (25) is provided at the suction port side (22) of the turbomolecular pump (26) to freeze-trap gas molecules by being cooled by a helium refrigerator (24). A gate valve (23) is disposed upstream of the heat exchanger (25) and is provided in a suction pipe (22) which extends between the vacuum vessel (21) and the turbomolecular pump (26). In the exhaust step, the gate valve (23) is opened and, in this state, the turbomolecular pump (26) and the helium refrigerator (24) are run, while in the regeneration step, the gate valve (23) is closed, the turbomolecular pump (26) is run, and the heat exchanger (25) is heated by means of a heater (32) or operation of the helium refrigerator (24) is suspended, thereby sublimating molecules freeze-trapped in the heat exchanger (25).

6. 发明专利

DE69535054D1 未知
公开(公告)号：DE69535054D1
公开(公告)日：2006-07-27
申请号：DE69535054
申请日：1995-08-23
申请人： EBARA CORP , TOSHIBA KK
发明人： HARADA MINORU , SHINJO RYOICHI , TSUJIMURA MANABU , NAKATA REMPEI , MIYAZAKI KUNIHIRO , KAJI NARUHIKO , NAKANO YUTAKA
IPC分类号： C01B13/11 , C01B13/10 , C23C8/12 , C23C16/40 , C23C16/44 , C23C16/448
摘要： Ozonizer (10) which supplies a feed gas to ozone generating cell (11) under application of a high voltage and which delivers an ozone gas through an ozone gas transport path (consisting of pipes (14) and (15)) as it has been generated in said ozone generating cell (11) is characterized in that the ozone gas transport path is furnished with means for removing at least one of NOx, HF and SOx (in the drawings, the means is for removing NOx) and that the ozone gas from the ozone generating cell (11) is passed through said removing means, whereby at least one of NOx, HF and SOx in said ozone gas is removed before it is delivered to a subsequent stage. The product ozone is not contaminated with Cr compounds at all or insufficiently contaminated to cause any practical problems in the fabrication of highly integrated semiconductor devices. Alternatively, ozonizer (10) which comprises an ozone generating cell (11) having an inlet (8) for supplying a feed gas, high voltage applying means (35) and an outlet (29) for discharging the ozone generated, and ozone delivery paths (30) and (31) for delivering the generated ozone is characterized in that oxygen (1) supplemented with 10 - 20 vol% of carbon dioxide and/or carbon monoxide (2) is used as the feed gas. The thus produced ozone is significantly low in the level of Cr compounds and, hence, can suitably be used in the formation of metal oxides, in particular, silicon oxide.

7. 发明专利

DE69028796D1 未知
公开(公告)号：DE69028796D1
公开(公告)日：1996-11-14
申请号：DE69028796
申请日：1990-05-04
申请人： TOSHIBA KK , EBARA CORP
发明人： OKUMURA KATSUYA , KURIYAMA FUMIO , MURAI YUKIO , TSUJIMURA MANABU , SOBUKAWA HIROSHI
IPC分类号： F04B37/16 , B01J3/02 , F04B37/06 , F04D19/04 , H01L21/302 , H01L39/24 , B01D8/00
摘要： An evacuation apparatus and method using a turbomolecular pump (26) having a rotor provided with a plurality of rotor blades and a spacer provided with a plurality of stator blades so that gas molecules are sucked in from a suction port, compressed and discharged from an exhaust port of the turbomolecular pump (26) is disclosed. A heat exchanger (25) is provided at the suction port side (22) of the turbomolecular pump (26) to freeze-trap gas molecules by being cooled by a helium refrigerator (24). A gate valve (23) is disposed upstream of the heat exchanger (25) and is provided in a suction pipe (22) which extends between the vacuum vessel (21) and the turbomolecular pump (26). In the exhaust step, the gate valve (23) is opened and, in this state, the turbomolecular pump (26) and the helium refrigerator (24) are run, while in the regeneration step, the gate valve (23) is closed, the turbomolecular pump (26) is run, and the heat exchanger (25) is heated by means of a heater (32) or operation of the helium refrigerator (24) is suspended, thereby sublimating molecules freeze-trapped in the heat exchanger (25).

8. 发明专利

DE19544328A1 Polishing device for upper surface of workpiece 未知
公开(公告)号：DE19544328A1
公开(公告)日：1996-05-30
申请号：DE19544328
申请日：1995-11-28
申请人： EBARA CORP , TOSHIBA KK
发明人： NISHI TOYOMI , TOGAWA TETSUJI , SAITO HARUMITSU , TSUJIMURA MANABU , YAJIMA HIROMI , HIMUKAI KAZUAKI , KODAMA SHOICHI , IMOTO YUKIO , AOKI RIICHIRO , WATASE MASAKO , SHIGETA ATSUSHI , MISHIMA SHIRO , KOUNO GISUKE
IPC分类号： H01L21/304 , B08B1/04 , B24B27/00 , B24B37/34 , B24B51/00 , B24B55/12 , F24F3/16 , H01L21/00 , B24B29/02 , B24B7/22 , B24B41/00
摘要： The polishing device has a casting unit (1), a dividing wall (22) dividing the interior of the casing unit into at least two chambers (48,49), a polishing sector (2) in the first chamber, a turntable (3) with polishing cloth (7) on its upper surface, and an upper ring (5) positioned above the turntable for the workpiece.The workpiece is pressed against the polishing cloth. There is also a cleaning sector (30) in the second chamber (49) to clean the polished workpiece. There is also a device to transfer the workpiece from the polishing sector to the cleaning sector. Air can be supplied independently to the polishing and cleaning sectors.

9. 发明申请

WO2006022452A3 POLISHING APPARATUS AND POLISHING METHOD 审中-公开
标题翻译：抛光设备和抛光方法
公开(公告)号：WO2006022452A3
公开(公告)日：2006-06-08
申请号：PCT/JP2005016063
申请日：2005-08-26
申请人： EBARA CORP , KODERA MASAKO , MOCHIZUKI YOSHIHIRO , FUKUDA AKIRA , KODERA AKIRA , HIYAMA HIROKUNI , TSUJIMURA MANABU , HIROKAWA KAZUTO , FUKUNAGA AKIRA
发明人： KODERA MASAKO , MOCHIZUKI YOSHIHIRO , FUKUDA AKIRA , KODERA AKIRA , HIYAMA HIROKUNI , TSUJIMURA MANABU , HIROKAWA KAZUTO , FUKUNAGA AKIRA
IPC分类号： B24B37/04 , B24B49/00 , H01L21/00
CPC分类号： H01L21/6708 , B24B37/005 , B24B37/042 , B24B37/046 , B24B49/006 , B24B57/02
摘要： A polishing apparatus (30) has a polishing surface (32), a top ring (36) for holding a wafer (W), motors (46, 56) to move the polishing surface (32) and the wafer (W) relative to each other at a relative speed, and a vertical movement mechanism (54) to press the wafer (W) against the polishing surface (32) under a pressing pressure. The polishing apparatus (30) also has a controller (44) to adjust a polishing condition in a non-Preston range in which a polishing rate is not proportional to a product of the pressing pressure and the relative speed. The polishing apparatus (30) can simultaneously achieve uniform supply of a chemical liquid to a surface of the wafer (W) and a uniform polishing rate within the surface of the wafer (W).
摘要翻译：研磨装置（30）具有研磨面（32），保持晶片（W）的顶圈（36），使研磨面（32）和晶片（W）相对移动的马达（46,56）以相对速度彼此相对移动;以及垂直移动机构（54），用于在压力下将晶片（W）压靠在抛光表面（32）上。抛光装置（30）还具有控制器（44），用于在抛光速率不与压制压力和相对速度的乘积成比例的非普雷斯顿范围内调节抛光条件。抛光装置（30）可以同时实现向晶片（W）的表面均匀供应化学液并且在晶片（W）的表面内实现均匀的抛光速率。

10. 发明申请

WO9926763A2 POLISHING APPARATUS 审中-公开
标题翻译：抛光装置
公开(公告)号：WO9926763A2
公开(公告)日：1999-06-03
申请号：PCT/JP9805252
申请日：1998-11-20
申请人： EBARA CORP , KATSUOKA SEIJI , TSUJIMURA MANABU , SAKURAI KUNIHIKO , OSAWA HIROYUKI
发明人： KATSUOKA SEIJI , TSUJIMURA MANABU , SAKURAI KUNIHIKO , OSAWA HIROYUKI
IPC分类号： B24B37/04 , B24B1/00 , B24B27/00 , B24B37/10 , B24B37/11 , B24B37/27 , B24B37/34 , B24B49/12 , B24B53/007 , B24B53/017 , B24B37/0413
CPC分类号： B24B37/345 , B24B27/0023 , B24B37/10 , B24B37/11 , B24B49/12 , B24B53/017 , Y10T29/53961
摘要： A polishing apparatus has two parallel processing lines that enables to carry out efficient parallel processing by minimizing the idle time for the turntable and maximizing the through-put. The polishing apparatus comprises at least two processing lines extending in parallel from a storage section. Each line is provided with a cleaning unit (18a, 18b) and a polishing unit (10a, 10b), a temporary storage station (20) disposed between the cleaning unit (18a, 18b) and the polishing unit (10a, 10b) and shared by the processing lines. At least two robotic devices (22, 24) are disposed on each of the processing lines for transferring workpieces among the temporary storage station (20), the polishing unit (10a, 10b) and the cleaning unit (18a, 18b).
摘要翻译：抛光装置具有两个平行的处理线，其能够通过最小化转台的空闲时间并使通过最大化来执行有效的并行处理。抛光装置包括从存储部分平行延伸的至少两条处理线。每条线设置有清洁单元（18a，18b）和抛光单元（10a，10b），设置在清洁单元（18a，18b）和抛光单元（10a，10b）之间的临时存储站（20）和由处理线共享。在临时存储站（20），抛光单元（10a，10b）和清洁单元（18a，18b）之间的每个处理线上设置至少两个机器人装置（22,24），用于传送工件。

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