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    • 1. 发明申请
    • SUBSTRATE HOLDING MECHANISM, SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD
    • 基板保持机构,基板抛光装置和基板抛光方法
    • WO2004060610A3
    • 2004-11-25
    • PCT/JP0317032
    • 2003-12-26
    • EBARA CORPTOSHIBA KKTOGAWA TETSUJIWATANABE TOSHIOYANO HIROYUKITOYOTA GENIWADE KENJITATEYAMA YOSHIKUNI
    • TOGAWA TETSUJIWATANABE TOSHIOYANO HIROYUKITOYOTA GENIWADE KENJITATEYAMA YOSHIKUNI
    • B24B37/04B24B37/30B24B37/32B24B41/06B24B49/14B24B55/02H01L21/304
    • B24B37/015B24B41/061B24B55/02
    • A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing the amount of heat generated during polishing of a substrate to be polished and of effectively cooling the substrate holding part of the substrate holding mechanism and also capable of effectively preventing the polishing solution and polishing dust from adhering to the outer peripheral portion of the substrate holding part and drying out thereon. The substrate holding mechanism (top ring 1) has a mounting flange 2, a support member 6, and a retainer ring 3. A substrate W to be polished is held on the lower side of the support member 6 surrounded by the retainer ring 3, and the substrate W is pressed against a polishing surface. The mounting flange 2 is provided with a flow passage 26 contiguous with at least the retainer ring 3. A temperature-controlled gas is supplied through the flow passage 26 to cool the mounting flange 2, the support member 6 and the retainer ring 3. The retainer ring 3 is provided with a plurality of through-holes 3a communicating with the flow passage 26 to spray the gas flowing through the flow passage 26 onto the polishing surface of a polishing table.
    • 基板保持机构,基板研磨装置和基板研磨方法具有能够使待研磨基板的抛光时产生的热量最小化的功能,并有效地冷却基板保持机构的基板保持部,并且还能够有效地 防止研磨液和研磨粉尘附着在基板保持部的外周部并在其上干燥。 基板保持机构(顶环1)具有安装凸缘2,支撑构件6和保持环3.待被抛光的基板W被保持在由保持环3包围的支撑构件6的下侧, 将基板W压在研磨面上。 安装凸缘2设置有与至少保持环3相邻的流动通道26.通过流动通道26供应温度控制的气体以冷却安装凸缘2,支撑构件6和保持环3。 保持环3设置有与流路26连通的多个通孔3a,以将流过流路26的气体喷射到研磨台的研磨面上。