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1. 发明专利

AU2003227414A1 POLISHING METHOD 未知
公开(公告)号：AU2003227414A1
公开(公告)日：2003-10-27
申请号：AU2003227414
申请日：2003-04-17
申请人： EBARA CORP
发明人： FUKUSHIMA MAKOTO , SAKURAI KUNIHIKO , YOSHIDA HIROSHI , NABEYA OSAMU , ICHIMURA TERUHIKO , TOGAWA TETSUJI
IPC分类号： B24B37/005 , B24B37/30 , H01L21/304 , H01L21/306 , B24B37/04
摘要： The present invention is relates to a polishing method for polishing a semiconductor wafer (W) by pressing the semiconductor wafer (W) against a polishing surface (10) with use of a top ring (23) for holding the semiconductor wafer (W). Apressure chamber (70) isdefinedinthetopring (23) byattachinganelasticmembrane (60) to a lower surface of a vertically movable member (62). The semiconductor wafer (W) is polished while a pressurized fluid is supplied to the pressure chamber (70) so that the semiconductor wafer (W) is pressed against the polishing surface (10) by a fluid pressure of the fluid. The semiconductor wafer (W) which has been polished is released from the top ring (23) by ejecting the pressurized fluid from an opening (62a) defined centrally in the vertically movable member (62).

2. 发明专利

DE60314505D1 未知
公开(公告)号：DE60314505D1
公开(公告)日：2007-08-02
申请号：DE60314505
申请日：2003-04-17
申请人： EBARA CORP
发明人： TOGAWA TETSUJI , FUKUSHIMA MAKOTO , SAKURAI KUNIHIKO , YOSHIDA HIROSHI , NABEYA OSAMU , ICHIMURA TERUHIKO
IPC分类号： B24B37/005 , B24B37/30 , H01L21/304 , H01L21/306
摘要： The present invention is relates to a polishing method for polishing a semiconductor wafer (W) by pressing the semiconductor wafer (W) against a polishing surface (10) with use of a top ring (23) for holding the semiconductor wafer (W). Apressure chamber (70) isdefinedinthetopring (23) byattachinganelasticmembrane (60) to a lower surface of a vertically movable member (62). The semiconductor wafer (W) is polished while a pressurized fluid is supplied to the pressure chamber (70) so that the semiconductor wafer (W) is pressed against the polishing surface (10) by a fluid pressure of the fluid. The semiconductor wafer (W) which has been polished is released from the top ring (23) by ejecting the pressurized fluid from an opening (62a) defined centrally in the vertically movable member (62).

3. 发明专利

DE60314505T2 未知
公开(公告)号：DE60314505T2
公开(公告)日：2008-02-28
申请号：DE60314505
申请日：2003-04-17
申请人： EBARA CORP
发明人： TOGAWA TETSUJI , FUKUSHIMA MAKOTO , SAKURAI KUNIHIKO , YOSHIDA HIROSHI , NABEYA OSAMU , ICHIMURA TERUHIKO
IPC分类号： B24B37/005 , B24B37/30 , H01L21/304 , H01L21/306
摘要： The present invention is relates to a polishing method for polishing a semiconductor wafer (W) by pressing the semiconductor wafer (W) against a polishing surface (10) with use of a top ring (23) for holding the semiconductor wafer (W). Apressure chamber (70) isdefinedinthetopring (23) byattachinganelasticmembrane (60) to a lower surface of a vertically movable member (62). The semiconductor wafer (W) is polished while a pressurized fluid is supplied to the pressure chamber (70) so that the semiconductor wafer (W) is pressed against the polishing surface (10) by a fluid pressure of the fluid. The semiconductor wafer (W) which has been polished is released from the top ring (23) by ejecting the pressurized fluid from an opening (62a) defined centrally in the vertically movable member (62).

4. 发明专利

AU2002354440A1 SUBSTRATE HOLDING DEVICE AND POLISHING DEVICE 未知
公开(公告)号：AU2002354440A1
公开(公告)日：2003-06-17
申请号：AU2002354440
申请日：2002-12-06
申请人： EBARA CORP
发明人： TOGAWA TETSUJI , NABEYA OSAMU , FUKUSHIMA MAKOTO , SAKURAI KUNIHIKO , YOSHIDA HIROSHI , ICHIMURA TERUHIKO
IPC分类号： B24B41/06 , H01L21/304
摘要： The present invention relates to a substrate holding apparatus for holding a substrate (W) such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. A substrate holding apparatus according to the present invention comprises a top ring body (2) having a receiving space therein, and a vertically movable member (206) which is vertically movable within the receiving space in the top ring body. An abutment member (209) having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane (291) of the abutment member comprises an abutment portion (291b), having a flange (291a) projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion (291c) extending upwardly from a base portion (291d) of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than the abutment portion.

5. 发明公开

EP1453081A4 SUBSTRATE HOLDING DEVICE AND POLISHING DEVICE 审中-公开
标题翻译：基板保持装置和抛光设备
公开(公告)号：EP1453081A4
公开(公告)日：2008-07-09
申请号：EP02788744
申请日：2002-12-06
申请人： EBARA CORP
发明人： TOGAWA TETSUJI , NABEYA OSAMU , FUKUSHIMA MAKOTO , SAKURAI KUNIHIKO , YOSHIDA HIROSHI , ICHIMURA TERUHIKO
IPC分类号： B24B41/06 , H01L21/304
CPC分类号： B24B37/30 , B24B41/061 , B24B49/105
摘要： A substrate holding device for holdingly pressing a substrate (W) such as a semiconductor wafer against a polishing surface in a polishing device for flattening the substrate by polishing, comprising a top ring body (2) having a storage space therein and a vertical moving member (206) vertically movable in the storage space of the top ring body, wherein contact members (209) with elastic films are installed on the lower surface of the vertical moving member, the elastic films (291) of the contact members are formed of contact parts (291b) having outwardly extended flanges (291a) and allowed to come into direct or indirect contact with the substrate and connection parts (291c) extended upward from the base parts (291d) of the flanges of the contact parts and connected to the vertical moving member, and the contact parts are formed of a material more extendable than that of the contact parts.

6. 发明公开

EP1495837A4 POLISHING METHOD 有权
标题翻译： POLIERVERFAHREN
公开(公告)号：EP1495837A4
公开(公告)日：2005-11-02
申请号：EP03717630
申请日：2003-04-17
申请人： EBARA CORP
发明人： TOGAWA TETSUJI , FUKUSHIMA MAKOTO , SAKURAI KUNIHIKO , YOSHIDA HIROSHI , NABEYA OSAMU , ICHIMURA TERUHIKO
IPC分类号： B24B37/005 , B24B37/30 , H01L21/304 , H01L21/306 , B24B37/04
CPC分类号： B24B37/30 , B24B37/013 , B24B37/042 , H01L21/30625 , Y10S438/977
摘要： A polishing method where a semiconductor wafer (W) is held by a top ring (23), pressed against a polishing surface (10) and polished. An elastic diaphragm (60) is installed on the lower face of an vertical moving member (62) so as to define a pressure chamber (70) in the top ring (23). A pressurized fluid is supplied to the pressure chamber (70) in order that the semiconductor wafer (W) is pressed against the polishing surface (10) by the fluid pressure of the fluid and polished. The pressurized fluid is jetted from an opening (62a) formed at the center of the vertical moving member (62) in order to separate the polished semiconductor wafer (W) from the top ring (23).
摘要翻译：一种抛光方法，其中半导体晶片（W）由顶环（23）固定，压在抛光表面（10）上并抛光。在垂直移动件（62）的下表面上安装一个弹性隔膜（60），以便在顶环（23）中形成一个压力室（70）。为了通过流体的流体压力将半导体晶片（W）压靠在抛光表面（10）上并抛光，将加压流体供应到压力室（70）。加压流体从形成在垂直移动部件（62）的中心处的开口（62a）喷出，以便将抛光的半导体晶片（W）从顶环（23）分离。

7. 发明专利

JP2003266301A POLISHING DEVICE 审中-公开
公开(公告)号：JP2003266301A
公开(公告)日：2003-09-24
申请号：JP2002071695
申请日：2002-03-15
申请人： EBARA CORP
发明人： NABEYA OSAMU , TOGAWA TETSUJI , FUKUSHIMA MAKOTO , SAKURAI KUNIHIKO , YOSHIDA HIROSHI , ICHIMURA TERUHIKO
IPC分类号： B24B37/04 , B24B37/30 , B24B37/32 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a polishing device which can provide polishing with high accuracy by preventing or reducing partial abrasion of a retainer ring at polishing. SOLUTION: In this polishing device provided with a top ring 1 having the retainer ring 3 for holding an outer circumferential edge of a semiconductor wafer W and a top-ring driving shaft 11 for pressing the top ring 1 onto a polishing face 101, the top ring 1 is provided with a flange part 2 in the almost disk shape connected to the top-ring driving shaft 11, and sliding connection parts 4, 5, 6, and 2b for connecting the retainer ring 3 to the flange part 2 in the state where the retainer ring 3 is in sliding contact with the flange part 2. COPYRIGHT: (C)2003,JPO

8. 发明专利

JP2000233360A POLISHING DEVICE 失效
公开(公告)号：JP2000233360A
公开(公告)日：2000-08-29
申请号：JP3564099
申请日：1999-02-15
申请人： EBARA CORP
发明人： ICHIMURA TERUHIKO
IPC分类号： B24B37/005 , B24B37/20 , B24B37/24 , B24B37/26 , B24B37/30 , B24B37/32 , H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To provide a polishing device capable of uniformly polishing the whole polishing face of a substrate to be polished and realizing highly precise flatness. SOLUTION: In a polishing device, an outer peripheral stepped part protruding in at least outer peripheral part by a predetermined amount is formed directly or through a predetermined packing member 4 on a hold face of a substrate to be polished of a top ring 1, a space part 9b is formed between the hold face of the substrate to be polished and the substrate to be polished while the substrate to be polished (semiconductor wafer 6) is held on the hold face of the substrate to be polished, pressurizing fluid is supplied into 8 space part 9a while the top ring 1 is pressed against a face of a polishing cloth 11 of a turn table 10, a pressurizing means pressurizing the inside of the space part 9a is provided, and a groove is provided on a top face of the polishing cloth 11 affixed on a top face of the turn table 10.

9. 发明专利

JP2008066761A Substrate holding device 审中-公开
标题翻译：基板保持装置
公开(公告)号：JP2008066761A
公开(公告)日：2008-03-21
申请号：JP2007308285
申请日：2007-11-29
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TOGAWA TETSUJI , FUKUSHIMA MAKOTO , SAKURAI KUNIHIKO , YOSHIDA HIROSHI , NABEYA OSAMU , ICHIMURA TERUHIKO
IPC分类号： H01L21/304 , B24B37/04 , B24B37/30
摘要： PROBLEM TO BE SOLVED: To provide a substrate holding device which can polish according to a film thickness distribution of a thin film formed on the surface of an object to be polished such as semiconductor wafers and can obtain uniformity in film thickness after polishing. SOLUTION: The substrate holding device which holds a substrate W serving as an object to be polished and presses it to a polishing surface includes a top ring body 2 internally having an accommodating space; a vertically moving member 6 vertically movable in an accommodating space of the top ring body 2, and a seal ring 4 coming into contact with the upper surface of the outer periphery of the substrate W. The vertically moving member 6 has a supporting portion 6c whose radial length for supporting the seal ring 4 is 1 mm to 7 mm. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种可以根据形成在待抛光对象表面上的诸如半导体晶片的薄膜的膜厚分布来抛光的衬底保持装置，并且可以在抛光后获得膜厚度的均匀性。解决方案：将用作被抛光物体的基板W保持在抛光表面上的基板保持装置包括内部具有容纳空间的顶环体2; 可在顶环体2的容置空间中垂直移动的垂直移动构件6和与基板W的外周的上表面接触的密封环4.垂直移动构件6具有支撑部6c，用于支撑密封环4的径向长度为1mm至7mm。版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP2003311609A Polishing method 有权
标题翻译：抛光方法
公开(公告)号：JP2003311609A
公开(公告)日：2003-11-05
申请号：JP2002116721
申请日：2002-04-18
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TOGAWA TETSUJI , FUKUSHIMA MAKOTO , SAKURAI KUNIHIKO , YOSHIDA HIROSHI , NABEYA OSAMU , ICHIMURA TERUHIKO
IPC分类号： B24B37/005 , B24B37/30 , H01L21/304 , H01L21/306 , B24B37/04 , B24B37/00
CPC分类号： B24B37/30 , B24B37/013 , B24B37/042 , H01L21/30625 , Y10S438/977
摘要： PROBLEM TO BE SOLVED: To provide a polishing method capable of certainly sucking and separating a polished object even when the polished object is held via an elastic film for polishing. SOLUTION: In this polishing method, a top ring 23 holds a semiconductor wafer W and the semiconductor wafer W is pressed onto a polished surface 10 and polished. The elastic film 60 is mounted to the lower surface of a vertically movable member 62 to form a pressure chamber 70 in the top ring 23, and pressurized fluid is supplied to the pressure chamber 70 to press the semiconductor wafer W onto the polished surface 10 with the fluid pressure of the fluid to polish it. Then, the pressurized fluid is injected from an opening 62a formed in the central part of the vertically movable member 62 to separate the semiconductor wafer W after the polishing from the top ring 23. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种即使当抛光物体经由用于抛光的弹性膜保持时也能够可靠地吸取和分离抛光物体的抛光方法。解决方案：在该抛光方法中，顶环23保持半导体晶片W，并将半导体晶片W压在抛光表面10上并进行抛光。弹性膜60安装在可垂直移动的构件62的下表面上，以在顶环23中形成压力室70，并且将压力流体供应到压力室70，以将半导体晶片W挤压到抛光表面10上，流体的流体压力来对其进行抛光。然后，从形成在可垂直移动部件62的中心部分的开口62a注入加压流体，以从抛光后将半导体晶片W从顶环23分离。（C）2004，JPO

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