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1. 发明专利

JP2011009600A Substrate processing method and substrate processing apparatus 审中-公开
标题翻译：基板加工方法和基板加工装置
公开(公告)号：JP2011009600A
公开(公告)日：2011-01-13
申请号：JP2009153290
申请日：2009-06-29
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TAIMA YASUSHI , SUZUKI TSUKURU , O CHIKAAKI , YAMAUCHI KAZUO , KODERA AKIRA , SAITO TAKAYUKI , HIYAMA HIROKUNI
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To suppress formation of a watermark on the surface of a substrate having been dried by reducing the used amount of isopropyl alcohol (IPA) or th like as much as possible, and minimizing production of droplets and mist.SOLUTION: A substrate processing method that dries the surface of the substrate W which is at least partially hydrophobic includes: arranging a proximate plate 16 at a position near the surface of the substrate W opposite in parallel with the surface of the substrate W; forming a continuous coating liquid film 28 which comes into contact with the surface of the substrate W and the proximate plate 16 between the surface of the substrate W and the proximate plate 16; and removing the coating liquid film 28, positioned in a region on the surface of the substrate W which is not covered with the proximate plate 16 any more, from the surface of the substrate W by changing the position of the coating liquid film 28 relative to the surface of the substrate W by relatively moving the substrate W and the proximate plate 16 in parallel and in one direction.
摘要翻译：要解决的问题：通过尽可能地减少异丙醇（IPA）或类似物的使用量来抑制已经干燥的基底的表面上的水印的形成，并且最小化液滴和雾的产生。解决方案：A 使至少部分疏水的衬底W的表面干燥的衬底处理方法包括：在邻近衬底W的表面平行于衬底W的表面附近的位置处布置邻近板16; 形成与衬底W的表面和衬底W的表面与邻近板16之间的接近板16接触的连续涂覆液膜28; 并且通过改变涂布液膜28相对于基板W的位置，从基板W的表面移除位于基板W的表面上未被邻近板16的表面的区域中的涂布液膜28 基板W的表面通过相对移动基板W和邻近板16而平行且沿一个方向。

2. 发明专利

JP2009295914A Polishing pad, electrolytic compound polishing device, and electrolytic compound polishing method 审中-公开
标题翻译：抛光垫，电解复合抛光装置和电解复合抛光方法
公开(公告)号：JP2009295914A
公开(公告)日：2009-12-17
申请号：JP2008150539
申请日：2008-06-09
申请人： Ebara Corp , 株式会社荏原製作所
发明人： FUKUDA AKIRA , O CHIKAAKI , SUZUKI TSUKURU , KODERA AKIRA , TAIMA YASUSHI , HIYAMA HIROKUNI
IPC分类号： H01L21/304 , B24B37/00 , B24B37/22 , B24B37/26
摘要： PROBLEM TO BE SOLVED: To provide a polishing pad with which variation of processing speed becomes smaller than permitted variation ratio if rotation speed of the polishing pad is set within a range of 25-150 rpm which is the normally used rotation speed, to provide an electrolytic compound polishing device, and to provide an electrolytic compound polishing method. SOLUTION: The polishing pad 101 has a through-hole to be installed on the opposite electrode of the electrolytic compound polishing device used for electrolytic compound polishing of a metal film on the substrate surface, and is characterized in that a hole diameter D of the through-hole 101a is within a range of 0.1-5 mm, a thickness h is within a range of 0.5-5 mm, and square of the hole diameter/thickness (D 2 /h) is within a range of 0.002-50 mm. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种抛光垫，如果研磨垫的旋转速度设定在通常使用的旋转速度的25-150rpm的范围内，则处理速度的变化变得小于允许的变化率，提供一种电解复合抛光装置，并提供一种电解化合物研磨方法。解决方案：抛光垫101具有安装在用于基板表面上的金属膜的电解复合抛光的电解化合物研磨装置的相对电极上的通孔，其特征在于，孔径D 通孔101a的厚度在0.1-5mm的范围内，厚度h在0.5-5mm的范围内，孔直径/厚度的平方（D 2 / h）在0.002-50mm的范围内。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2007332445A Electroless plating method and electroless plating apparatus 审中-公开
标题翻译：电镀方法和电镀镀膜装置
公开(公告)号：JP2007332445A
公开(公告)日：2007-12-27
申请号：JP2006167867
申请日：2006-06-16
申请人： Ebara Corp , 株式会社荏原製作所
发明人： O CHIKAAKI , OWATARI AKIRA , ONO HARUKO , TAKAGI DAISUKE , ISHIBASHI TOMOATSU
IPC分类号： C23C18/18 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide an electroless plating method which can form a protective film with a uniform thickness on the surface of wires by completely removing an anticorrosive agent and/or a metal complex from the surface of a substrate, prior to catalyst-imparting treatment and/or an electroless plating step. SOLUTION: The electroless plating method comprises the steps of: preparing a substrate having embedded wiring formed in the inner part; making a washing member contact with the surface or both sides of the substrate in a wet state; making the washing member supply cleaning fluid onto the surface or both sides of the substrate while relatively moving them to pre-wash the substrate; making the catalyst-imparting liquid contact with the surface of the pre-washed substrate to impart a catalyst onto the surface of the wiring; and then making an electroless plating solution contact with the surface of the substrate to form the protective film selectively on the surface of the wiring. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种化学镀方法，其可以通过从基材表面完全除去防腐剂和/或金属络合物，从而在基材的表面上形成具有均匀厚度的保护膜，催化剂赋予处理和/或化学镀步骤。解决方案：化学镀方法包括以下步骤：制备在内部形成嵌入布线的基板; 使洗涤部件处于湿状态与基板的表面或两侧接触; 使洗涤构件在将衬底相对移动以预清洗衬底的同时将清洁流体供应到衬底的表面或两侧; 使催化剂赋予液体与预洗涤基板的表面接触，以在催化剂表面上施加催化剂; 然后使化学镀溶液与基板的表面接触，以在布线的表面上选择性地形成保护膜。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2007126756A Electroless plating apparatus and electroless plating method 审中-公开
标题翻译：电沉积装置和电镀法
公开(公告)号：JP2007126756A
公开(公告)日：2007-05-24
申请号：JP2007028541
申请日：2007-02-07
申请人： Ebara Corp , 株式会社荏原製作所
发明人： O CHIKAAKI , TAKAGI DAISUKE , TASHIRO AKIHIKO , FUKUNAGA AKIRA , OWATARI AKIRA
IPC分类号： C23C18/31
摘要： PROBLEM TO BE SOLVED: To provide an electroless plating apparatus capable of reducing the initial cost and the running cost thereof, and efficiently forming a high-quality protective film on the surface of a metal region without needing a wide installation space.
SOLUTION: The electroless plating apparatus comprises: a pretreatment unit having a treatment unit; an electroless plating unit having a plating tank; and a postcleaning unit, and the pretreatment unit and the electroless plating unit have a common substrate holding head provided with an attraction head 234 and a substrate receiver 236 surrounding the attraction head. An attraction ring 250 with a recess 250a capable of evacuation extending along the circumferential direction is fitted to the attraction head. The substrate receiver has a seal ring 254a disposed on an inner circumferential end thereof and projecting inwardly, and the seal ring is pressed against the peripheral edge of the substrate by the attraction head to seal the peripheral edge of the substrate with the seal ring, so as to hold the substrate. Then, the recess of the attraction ring is evacuated, and, while sealing the peripheral edge of the substrate with the attraction ring, the substrate is attracted and held, so as to release the substrate from the substrate receiver.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：提供一种能够降低其初始成本和运行成本，并且在不需要较宽的安装空间的情况下有效地在金属区域的表面上形成高质量的保护膜的化学镀设备。解决方案：化学镀设备包括：具有处理单元的预处理单元; 具有镀槽的化学镀单元; 和后清洗单元，并且预处理单元和化学镀单元具有共同的基板保持头，该基板保持头设置有吸引头234和围绕吸引头的基板接收器236。具有能够沿圆周方向延伸的抽吸的凹部250a的吸引环250安装在吸引头上。衬底接收器具有设置在其内周端上并向内突出的密封环254a，并且通过吸引头将密封环压靠在衬底的周边边缘上，以用密封环密封衬底的周边边缘，因此以保持基板。然后，吸引环的凹部被抽真空，并且在用吸引环密封基板的周缘的同时，吸引并保持基板，以将基板从基板接收体释放。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2006104581A Electroless plating apparatus and electroless plating method 审中-公开
标题翻译：电沉积装置和电镀法
公开(公告)号：JP2006104581A
公开(公告)日：2006-04-20
申请号：JP2005365630
申请日：2005-12-19
申请人： Ebara Corp , 株式会社荏原製作所
发明人： HONGO AKIHISA , MISHIMA KOJI , KIMURA NORIO , ABE KENICHI , O CHIKAAKI
IPC分类号： C23C18/31 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide an electroless plating apparatus which can easily form a plated film having more uniform thickness on a surface, to be plated, of a material to be plated, and an electroless plating method. SOLUTION: In the plating apparatus comprising a holding portion 10 for holding a material W to be plated, and a plating bath 24 for holding a plating liquid 22, wherein the material W to be plated is brought into contact with the plating liquid 22 in the plating bath 24 to be plated, the holding portion 10 has a heating portion 14. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种化学镀设备，其可以容易地形成具有更均匀厚度的镀膜，待镀覆的材料的被镀层和无电镀方法。解决方案：在包括用于保持待镀材料W的保持部分10和用于保持电镀液22的镀浴24的电镀装置中，其中待镀材料W与镀液接触在电镀槽24中，保持部分10具有加热部分14.版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2004084056A Electroless plating apparatus and post-electroless plating cleaning method 有权
公开(公告)号：JP2004084056A
公开(公告)日：2004-03-18
申请号：JP2003024944
申请日：2003-01-31
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KATAKABE ICHIRO , INOUE KATSUTAKA , O CHIKAAKI , TAKAGI DAISUKE
IPC分类号： B08B1/04 , C23C18/16 , C23C18/32 , H01L21/00 , H01L21/288 , H01L21/304
CPC分类号： H01L21/67051 , B08B1/04 , C23C18/1632 , C23C18/1689 , C23C18/1893 , C23C18/32 , C23C18/50 , H01L21/67046
摘要： PROBLEM TO BE SOLVED: To provide a technique for removing particles of Co and Ni produced by electroless plating and present on a silicon thermal oxidation film after formation of Cu wiring without affecting the wiring. SOLUTION: An electroless plating apparatus where electroless plating is applied to the surface of wiring in an electronic circuit substrate formed with fine circuit patterns by electroconductive metal wiring is provided with: a substrate transfer means; a loading station arranged in association with the substrate transfer means; one or more electroless plating cells 5 arranged in association with the substrate transfer apparatuses 3a, 3b and 3c; and cleaning devices 6 and 7 arranged in association with the substrate transfer apparatuses and performing cleaning in which cleaning members move to the same direction to scrub substrate surfaces, or cleaning in which the cleaning members rotationally move to a horizontal direction to scrub the substrate surfaces and/or solution cleaning. The particles of Co and Ni produced by electroless plating are removed without affecting the wiring. COPYRIGHT: (C)2004,JPO

7. 发明专利

JP2003260301A METHOD FOR CONCENTRATING CHEMICAL TREATING LIQUID AND DEVICE TO BE USED THEREFOR 审中-公开
公开(公告)号：JP2003260301A
公开(公告)日：2003-09-16
申请号：JP2002065502
申请日：2002-03-11
申请人： EBARA CORP
发明人： O CHIKAAKI , TAKAGI DAISUKE , MISHIMA KOJI , SEKIMOTO MASAHIKO , OWATARI AKIRA
IPC分类号： C02F1/04 , B01D1/14 , B01D1/22 , C23C18/16
摘要： PROBLEM TO BE SOLVED: To provide a means to effectively remove water mixed in a chemical treating liquid while suppressing changes in the component of the chemical treating liquid as much as possible. SOLUTION: The method for concentrating a chemical treating liquid features that the chemical treating liquid is brought into contact with inert gas or reduced pressure gas to vaporize the water component in the chemical treating liquid into the inert gas. The concentration device for a chemical treating liquid is equipped with a reservoir tank of the chemical treating liquid communicating with the chemical treating tank by feed and return pipes, a vaporizer communicating with the reservoir tank of the chemical treating liquid by a circulating means so as to enable the inert gas or reduced pressure gas pass, and a gas/ liquid separating means to enable the inert gas or reduced pressure gas from the vaporizer pass. COPYRIGHT: (C)2003,JPO

8. 发明专利

JP2003147538A SUBSTRATE PROCESSING DEVICE AND METHOD 审中-公开
公开(公告)号：JP2003147538A
公开(公告)日：2003-05-21
申请号：JP2001341889
申请日：2001-11-07
申请人： EBARA CORP
发明人： O CHIKAAKI , ABE KENICHI , MISHIMA KOJI
IPC分类号： C23C18/31 , C23C18/16 , H01L21/288 , H01L21/3205 , H01L21/768 , H01L23/52
摘要： PROBLEM TO BE SOLVED: To improve throughput by employing what is called a batch processing system that processes a plurality of substrates simultaneously, to make the device comparatively simple, and to stably and surely carry out a process such as electroless plating. SOLUTION: The device is equipped with a treating tank 14 that holds a processing solution 12 and that is open upward and a base board holder 16 that is freely vertically movable relative to the treating tank 14 and that has a plurality of substrate retainers 40 for holding more than one substrate W in parallel. The base board retainers 40 are provided with a ring-shaped base board stage 48 that freely moves in relatively attaching/detaching directions, that clamps the peripheral edge of the substrate W, and that holds the substrate with its back face hermetically sealed, and are also provided with a disk-like piece 54 for pressing the substrate. In addition, the substrate retainers 40 have a built-in heating-medium flow passage 62 for controlling the temperature of the retainers 40 by introducing a heating medium inside.

9. 发明专利

JP2002042041A DESIGN METHOD OF ADSORBENT 失效
公开(公告)号：JP2002042041A
公开(公告)日：2002-02-08
申请号：JP2000231659
申请日：2000-07-31
申请人： EBARA CORP
发明人： O CHIKAAKI , KA AKIHIRO , HIYAMA HIROKUNI , SUZUKI YOKO
IPC分类号： B01J20/20 , G06F19/00
摘要： PROBLEM TO BE SOLVED: To provide a method of designing an adsorbent having excellent adsorption performance to a specific contaminant by obtaining the adsorption characteristic of an organic molecule in a adsorbent micro pores of the adsorbent via a molecular dynamics analysis method in order to manufacture a high- performance adsorbent filter aiming at removing of a gaseous organic contaminant in a clean room or in a substrate transfer container with an environment purifying function. SOLUTION: The method of analyzing the adsorption characteristic of a specific adsorbate to an adsorbent on a molecular dynamics basis includes processes of (1) preparing an analytic model of an organic molecule of the target adsorbate, (2) a micro pore model of the adsorbent, (3) simulating the adsorption process of the organic molecule adsorbate to the adsorbent via a molecular dynamics analysis method, (4) visually expressing the behavior of the adsorbent in the adsorbent pore, and (5) obtaining the adsorption energy of the adsorption system to estimate the adsorption performance of the adsorbent to the selected specific adsorbate.

10. 发明专利

JP2011009601A Substrate drying method, and substrate drying apparatus 审中-公开
标题翻译：基板干燥方法和基板干燥装置
公开(公告)号：JP2011009601A
公开(公告)日：2011-01-13
申请号：JP2009153291
申请日：2009-06-29
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KODERA AKIRA , TAIMA YASUSHI , O CHIKAAKI , YAMAUCHI KAZUO , SUZUKI TSUKURU , HIYAMA HIROKUNI , SAITO TAKAYUKI
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To achieve drying using HFE (hydrofluoroether) as a solvent for drying adaptively to spin drying which is widely employed for existent CMP apparatuses etc.SOLUTION: In a substrate drying method of drying a surface of a substrate W on which liquid sticks, the liquid on the surface of the substrate W is removed by blowing to the surface of the substrate W mixed vapor 22 of hydrofluoroether and water-soluble alcohol which is warmed at 120 to 160°C and pressurized to 0.5 to 1.0 MPa while the substrate W is rotated.
摘要翻译：要解决的问题：使用HFE（氢氟醚）作为自适应干燥的溶剂进行干燥，适用于现有CMP设备等广泛使用的旋转干燥。溶解性：在将基材W的表面干燥的基材干燥方法中，将基板W的表面上的液体吹入基板W的表面，并将其加热到120〜160℃并加压至0.5〜1.0MPa的氢氟醚和水溶性醇的混合蒸气22，同时衬底W旋转。

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