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1. 发明专利

JP2007126756A Electroless plating apparatus and electroless plating method 审中-公开
标题翻译：电沉积装置和电镀法
公开(公告)号：JP2007126756A
公开(公告)日：2007-05-24
申请号：JP2007028541
申请日：2007-02-07
申请人： Ebara Corp , 株式会社荏原製作所
发明人： O CHIKAAKI , TAKAGI DAISUKE , TASHIRO AKIHIKO , FUKUNAGA AKIRA , OWATARI AKIRA
IPC分类号： C23C18/31
摘要： PROBLEM TO BE SOLVED: To provide an electroless plating apparatus capable of reducing the initial cost and the running cost thereof, and efficiently forming a high-quality protective film on the surface of a metal region without needing a wide installation space.
SOLUTION: The electroless plating apparatus comprises: a pretreatment unit having a treatment unit; an electroless plating unit having a plating tank; and a postcleaning unit, and the pretreatment unit and the electroless plating unit have a common substrate holding head provided with an attraction head 234 and a substrate receiver 236 surrounding the attraction head. An attraction ring 250 with a recess 250a capable of evacuation extending along the circumferential direction is fitted to the attraction head. The substrate receiver has a seal ring 254a disposed on an inner circumferential end thereof and projecting inwardly, and the seal ring is pressed against the peripheral edge of the substrate by the attraction head to seal the peripheral edge of the substrate with the seal ring, so as to hold the substrate. Then, the recess of the attraction ring is evacuated, and, while sealing the peripheral edge of the substrate with the attraction ring, the substrate is attracted and held, so as to release the substrate from the substrate receiver.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：提供一种能够降低其初始成本和运行成本，并且在不需要较宽的安装空间的情况下有效地在金属区域的表面上形成高质量的保护膜的化学镀设备。解决方案：化学镀设备包括：具有处理单元的预处理单元; 具有镀槽的化学镀单元; 和后清洗单元，并且预处理单元和化学镀单元具有共同的基板保持头，该基板保持头设置有吸引头234和围绕吸引头的基板接收器236。具有能够沿圆周方向延伸的抽吸的凹部250a的吸引环250安装在吸引头上。衬底接收器具有设置在其内周端上并向内突出的密封环254a，并且通过吸引头将密封环压靠在衬底的周边边缘上，以用密封环密封衬底的周边边缘，因此以保持基板。然后，吸引环的凹部被抽真空，并且在用吸引环密封基板的周缘的同时，吸引并保持基板，以将基板从基板接收体释放。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2006093357A Semiconductor device and manufacturing method thereof, and processing solution 审中-公开
标题翻译：半导体器件及其制造方法及其处理方法
公开(公告)号：JP2006093357A
公开(公告)日：2006-04-06
申请号：JP2004276109
申请日：2004-09-22
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TAKAGI DAISUKE , O CHIKAAKI , OWATARI AKIRA , FUKUNAGA AKIRA , TASHIRO AKIHIKO
IPC分类号： H01L23/52 , C23C18/16 , C23C18/50 , H01L21/288 , H01L21/3205
CPC分类号： H01L23/53238 , C23C18/50 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To protect wiring by an alloy film by forming the alloy film with a necessary minimum thickness to have the diffusion preventing effect against e.g. oxygen or copper in more uniform thickness all over the substrate while alleviating the dependency on a wiring pattern. SOLUTION: The alloy film is formed containing 1-9 atomic% of tungsten or molybdenum and 3-12 atomic% of phosphorus or boron by electroless plating on at least a portion of the area surrounding the embedded wiring formed by embedding a wiring material in a recess for wiring formed in an insulator on the substrate. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：通过用必要的最小厚度形成合金膜以通过合金膜来保护布线，以具有防止例如扩散防止效果的扩散防止效果。氧或铜在整个衬底上均匀的厚度，同时减轻对布线图案的依赖性。解决方案：通过在围绕通过嵌入布线形成的嵌入式布线周围的区域的至少一部分上进行化学镀而形成含有1-9原子％的钨或钼和3-12原子％的磷或硼的合金膜在基板上的绝缘体中形成的用于布线的凹部中的材料。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2006009130A Method and apparatus for processing substrate 审中-公开
标题翻译：用于处理基板的方法和装置
公开(公告)号：JP2006009130A
公开(公告)日：2006-01-12
申请号：JP2004192060
申请日：2004-06-29
申请人： Ebara Corp , 株式会社荏原製作所
发明人： O CHIKAAKI , TAKAGI DAISUKE , TASHIRO AKIHIKO , FUKUNAGA YUKIO , FUKUNAGA AKIRA , OWATARI AKIRA
IPC分类号： C23C18/18 , H01L21/288 , H01L21/3205 , H01L23/52
摘要： PROBLEM TO BE SOLVED: To provide a method and an apparatus for processing a substrate capable of reliably depositing a metal film by electroless plating on an exposed surface of a base metal such as interconnects, with increased throughput and without the formation of voids in the base metal. SOLUTION: When depositing a metal film by the electroless plating on a surface of a substrate having a base metal, the surface of the substrate is cleaned with a cleaning solution comprising an aqueous solution of a carboxyl group-containing organic acid or its salt and a surfactant as an additive; the surface of the substrate after the cleaning is brought into contact with a processing solution comprising a mixture of the cleaning solution and a solution containing a catalyst metal ion, thereby applying the catalyst to the surface of the substrate. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于处理基板的方法和装置，该基板能够通过无电解电镀在基底金属（例如互连）的暴露表面上可靠地沉积金属膜，具有增加的生产量并且不形成空隙在贱金属。解决方案：当通过化学镀在具有贱金属的基材的表面上沉积金属膜时，用含有羧基的有机酸的水溶液或其含有有机酸的水溶液的清洗溶液清洗基板的表面盐和表面活性剂作为添加剂; 使清洗后的基板的表面与包含清洗液和含有催化剂金属离子的溶液的混合物的处理溶液接触，从而将催化剂施加到基板的表面。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2005044910A Method and device for forming wiring 审中-公开
标题翻译：用于形成接线的方法和装置
公开(公告)号：JP2005044910A
公开(公告)日：2005-02-17
申请号：JP2003201363
申请日：2003-07-24
申请人： Ebara Corp , 株式会社荏原製作所
发明人： O CHIKAAKI , TAKAGI DAISUKE , TASHIRO AKIHIKO , FUKUNAGA YUKIO , FUKUNAGA AKIRA
IPC分类号： H01L21/3205 , H01L21/768
CPC分类号： H01L21/76849 , H01L21/76819 , H01L21/7685 , Y10S438/976 , Y10T29/41
摘要： PROBLEM TO BE SOLVED: To provide a method and a device for forming wiring by which the drop of the machining accuracy due to etching, an exposing step, etc., performed for forming recessed sections for wiring can be prevented to the utmost and, at the same time, the electron migration resistance of the wiring can be improved at the time of forming multilayered wiring and, in addition, the reliability of a device can be improved. SOLUTION: After recessed sections for the wiring are formed in an insulating film formed on the surface of a substrate, metallic films composed of a wiring material are formed on the surface of the insulating film by embedding the wiring material in the recessed sections. Then wiring is formed by removing the excessive metallic materials other than those in the recessed sections and flattening the surface of the substrate, and a first protective film composed of a conductive material is selectively formed on the exposed surface of the wiring. Moreover, a second protective film is formed on the surface of the substrate on which the first protective film is formed and an interlayer insulating layer is formed on the surface of the substrate on which the second protective film is formed. Finally, the surface of the interlayer insulating film is flattened. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于形成布线的方法和装置，通过该方法和装置可以最大限度地防止用于形成用于布线的凹部的蚀刻，曝光步骤等的加工精度的下降并且同时，在形成多层布线时可以提高布线的电子迁移电阻，并且还可以提高器件的可靠性。解决方案：在形成在基板表面上的绝缘膜中形成用于布线的凹陷部分之后，通过将布线材料嵌入到凹部中而在绝缘膜的表面上形成由布线材料构成的金属膜。然后通过去除凹陷部分以外的过量金属材料并使基板的表面平坦化而形成布线，并且在布线的暴露表面上选择性地形成由导电材料构成的第一保护膜。此外，在其上形成有第一保护膜的基板的表面上形成第二保护膜，并且在其上形成有第二保护膜的基板的表面上形成层间绝缘层。最后，层间绝缘膜的表面变平。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2004183061A Treatment liquid management system 有权
公开(公告)号：JP2004183061A
公开(公告)日：2004-07-02
申请号：JP2002352813
申请日：2002-12-04
申请人： Ebara Corp , 株式会社荏原製作所
发明人： O CHIKAAKI , TAKAGI DAISUKE , TASHIRO AKIHIKO , OHASHI TAKESHI
IPC分类号： C23C18/31 , C23C18/16 , C23C18/18 , H01L21/288
摘要： PROBLEM TO BE SOLVED: To quantitatively manage particles contained in a treatment liquid which is continuously used while being circulated such as an electroless plating liquid and a chemical liquid (treatment liquid prior to plating).
SOLUTION: The treatment liquid management system is provided with: a sampling tank 82 for sampling a treatment liquid 52 from at least either a treatment tank 50 in which a member to be treated is brought into contact with the treatment liquid 52 for performing treatment or a treatment liquid feed tank 54 which feeds the treatment liquid 52 to the treatment tank 50, and temporarily storing the treatment liquid 52; and a particle measuring instrument 94 for measuring the number of particles precipitated into a sampling liquid 86 inside the sampling tank 82.
COPYRIGHT: (C)2004,JPO&NCIPI

6. 发明专利

JP2006077275A Method and device for depositing metal film 有权
标题翻译：用于沉积金属膜的方法和装置
公开(公告)号：JP2006077275A
公开(公告)日：2006-03-23
申请号：JP2004260527
申请日：2004-09-08
申请人： Ebara Corp , 株式会社荏原製作所
发明人： O CHIKAAKI , TAKAGI DAISUKE , TASHIRO AKIHIKO , FUKUNAGA YUKIO , FUKUNAGA AKIRA , OWATARI AKIRA
IPC分类号： C23C18/16 , H01L21/288
CPC分类号： H01L21/288 , C23C18/1619 , C23C18/1669 , C23C18/32 , H01L21/76846 , H01L21/76849 , H01L21/76874
摘要： PROBLEM TO BE SOLVED: To continuously deposit metal films with different film quality in a film thickness direction using the same treatment liquid.
SOLUTION: A substrate in which buried wiring is formed in a recessed part for wiring at the surface is prepared. As a treatment liquid is contacted with the surface of the substrate, the relative fluidization state of the treatment liquid to the surface of the substrate is changed, so as to continuously deposit metal films with different film quality in a film thickness direction on the surface of the wiring.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：使用相同的处理液体在膜厚度方向上连续沉积具有不同膜质量的金属膜。＆lt; P＆gt;解决方案：准备在表面的布线的凹部形成埋入布线的基板。当处理液与基材表面接触时，改变处理液相对于基材表面的相对流化状态，从而在膜厚度方向上连续沉积具有不同膜质量的金属膜接线。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2006016684A Wiring method and wiring device 审中-公开
标题翻译：接线方法和接线装置
公开(公告)号：JP2006016684A
公开(公告)日：2006-01-19
申请号：JP2004198590
申请日：2004-07-05
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TAKAGI DAISUKE , O CHIKAAKI , TASHIRO AKIHIKO , INOUE HIROAKI , SUZAKI AKIRA , SHIMOYAMA TADASHI , YOKOTA HIROSHI
IPC分类号： C23C18/16 , H01L21/288 , H01L21/3205 , H01L23/52
摘要： PROBLEM TO BE SOLVED: To provide a wiring method and a wiring device capable of continuously and consistently performing a series of wiring treatments after forming small recesses for wiring in a surface of a substrate without through the treatment where the dry treatment and the wet treatment are mixed.
SOLUTION: A substrate W is prepared, in which small recesses 64 for wiring are formed inside an insulating film 62 deposited on the surface. A barrier layer 68 is formed on the surface of the substrate W by the wet treatment. A seed layer 70 is formed on the surface of the barrier layer 68 by the wet treatment, and a wiring layer 72 is formed on the surface of the substrate after forming the seed layer by the wet treatment.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种布线方法和布线装置，其能够在形成用于基板表面的布线的小凹槽之后连续且一致地执行一系列布线处理，而不需要通过干法处理和湿法处理混合。解决方案：制备衬底W，其中用于布线的小凹槽64形成在沉积在表面上的绝缘膜62内部。通过湿处理在衬底W的表面上形成阻挡层68。通过湿式处理在阻挡层68的表面上形成种子层70，并且通过湿法处理形成种子层之后，在基板的表面上形成布线层72。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2005243845A Substrate treatment method and substrate treatment device 审中-公开
标题翻译：基板处理方法和基板处理装置
公开(公告)号：JP2005243845A
公开(公告)日：2005-09-08
申请号：JP2004050407
申请日：2004-02-25
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TAKAGI DAISUKE , O CHIKAAKI , TASHIRO AKIHIKO , FUKUNAGA YUKIO , FUKUNAGA AKIRA , SHIMOYAMA TADASHI
IPC分类号： C23C18/16 , C23C8/36 , C23C18/31 , H01L21/288 , H01L21/3205 , H01L21/677 , H01L21/68 , H01L23/52
摘要： PROBLEM TO BE SOLVED: To protect wiring by selectively covering the exposed surface of the wiring with a wiring protective film improved in a barrier property to the wiring. SOLUTION: At the time of protecting the wiring formed on the surface of a substrate by selectively forming the protective film on the exposed surface of the wiring, pre-treatment is performed on the base surface to be plated of the substrate, and the protective film is selectively formed on the pre-treated base surface to be plated of the substrate by performing electroless plating. Then the electroless-plated substrate is cleaned and dried and plasma treatment is performed on the surface of the dried substrate. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：通过用布线保护膜选择性地覆盖布线的暴露表面来保护布线，从而提高了布线的阻挡性能。解决方案：在通过在布线的暴露表面上选择性地形成保护膜来保护形成在基板表面上的布线时，对要被镀的基底进行预处理，以及通过进行无电解电镀，在预处理的基板表面上选择性地形成保护膜。然后对无电镀基板进行清洗和干燥，并对干燥的基板的表面进行等离子体处理。版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JP2005206905A Substrate treatment method and device, and treatment liquid 审中-公开
标题翻译：基板处理方法和设备，以及处理液体
公开(公告)号：JP2005206905A
公开(公告)日：2005-08-04
申请号：JP2004016379
申请日：2004-01-23
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TAKAGI DAISUKE , SAHODA TAKESHI , O CHIKAAKI , TASHIRO AKIHIKO , FUKUNAGA AKIRA
IPC分类号： C23C18/18 , C23C18/16 , H01L21/28 , H01L21/288 , H01L21/3205 , H01L23/52
摘要： PROBLEM TO BE SOLVED: To efficiently form a wiring protective film of high quality particularly without deteriorating the electrical properties of wiring by performing pretreatment such as the application of a catalyst and pre-rinsing to a substrate with an optimized treatment liquid. SOLUTION: In the substrate treatment method, at the time of selectively forming a metal film on the exposed surface of a base metal formed on the surface of a substrate by electroless plating, pretreatment to the surface of the base metal is performed with a treatment liquid comprising components forming a complex with the base metal and catalyst metal ions. COPYRIGHT: (C)2005,JPO&NCIPI

10. 发明专利

JP2004190109A Plating method and plating apparatus 有权
公开(公告)号：JP2004190109A
公开(公告)日：2004-07-08
申请号：JP2002360974
申请日：2002-12-12
申请人： Ebara Corp , 株式会社荏原製作所
发明人： O CHIKAAKI , TAKAGI DAISUKE , TASHIRO AKIHIKO , SHIMOYAMA TADASHI
IPC分类号： C23C18/18 , C23C18/32 , C23C18/50 , H01L21/288 , H01L21/3205 , H01L23/52
摘要： PROBLEM TO BE SOLVED: To provide a plating method for adequately selectively and economically forming a plating film such as a wire-protecting film, on the surface of wires without corroding the metal wires and others, and to provide a plating apparatus therefor.
SOLUTION: This plating method comprises making superfine particles 50 of a metal oxide having photo-electrochemical reactivity carried on the surface to be treated of a substrate W, and while making the surface contact with a plating solution 34, irradiating the surface with light. The superfine particles of the metal oxide having photo-electrochemical reactivity includes, for instance, the ultra-fine particles of TiO
2 .
COPYRIGHT: (C)2004,JPO&NCIPI

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