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1. 发明公开

EP1717344A4 METHOD FOR PROCESSING SUBSTRATE, CATALYST PROCESS LIQUID, AND SUBSTRATE PROCESSING APPARATUS 审中-公开
标题翻译：方法处理基板，液体催化剂方法和基材处理装置
公开(公告)号：EP1717344A4
公开(公告)日：2008-08-20
申请号：EP05704220
申请日：2005-01-21
申请人： EBARA CORP
发明人： WANG XINMING , TAKAGI DAISUKE , TASHIRO AKIHIKO , FUKUNAGA YUKIO , FUKUNAGA AKIRA , OWATARI AKIRA , NISHIOKA YUKIKO , SAHODA TSUYOSHI
IPC分类号： C23C18/18 , C23C18/16 , H01L21/00 , H01L21/02 , H01L21/28 , H01L21/288 , H01L21/306 , H01L21/3205 , H01L21/321 , H01L21/768
CPC分类号： H01L21/02068 , C23C18/1632 , C23C18/1689 , C23C18/1844 , H01L21/02074 , H01L21/288 , H01L21/67028 , H01L21/76849 , H01L21/76874 , H01L21/76883
摘要： Disclosed is a method for processing a substrate with improved throughput which enables to surely form a metal film on an exposed surface of an underlying metal such as wiring by nonelectrolytic plating without causing a void inside the underlying metal. In this method, the surface of a substrate on which an underlying metal is formed is cleaned with a cleaning liquid which is obtained by adding a surfactant into an organic acid having a carboxyl group or an aqueous solution of its salt; the cleaned surface of the substrate is brought into contact with a process liquid which is obtained by mixing the cleaning liquid with a solution containing metal catalyst ions, thereby applying the catalyst onto the substrate surface; and a metal film is formed over the substrate surface, to which the catalyst has been applied, through nonelectrolytic plating.

2. 发明专利

AU2003243015A1 ELECTROLESS PLATING APPARATUS AND POST-ELECTROLESS PLATING CLEANING METHOD 未知
公开(公告)号：AU2003243015A1
公开(公告)日：2004-01-23
申请号：AU2003243015
申请日：2003-07-07
申请人： EBARA CORP
发明人： WANG XINMING , TAKAGI DAISUKE , KATAKABE ICHIRO , INOUE YUKI
IPC分类号： B08B1/04 , C23C18/16 , C23C18/32 , H01L21/00 , H01L21/288 , H01L21/304
摘要： There are provided an electroless plating apparatus and a post-electroless plating cleaning method which can remove Co or Ni particles, produced upon electroless plating onto Cu interconnects of an electronic circuit substrate and remaining on a silicon oxide film as an interlevel dielectric, without exerting an adverse influence on the Cu interconnects. The electroless plating apparatus for carrying out electroless plating of the surface of interconnects formed in a surface of an electronic circuit substrate having fine circuit patterns of conductive metal interconnects, includes: a substrate transfer device (62, 76, 86); a loading station (58) disposed in association with the substrate transfer device; at least one electroless plating cell (82) disposed in association with the substrate transfer device; and a scrub cleaning device (66a) and/or a solution cleaning device (66c) disposed in association with the substrate transfer device.

3. 发明专利

JP2007250915A Substrate treatment method and substrate treatment apparatus 审中-公开
标题翻译：基板处理方法和基板处理装置
公开(公告)号：JP2007250915A
公开(公告)日：2007-09-27
申请号：JP2006073572
申请日：2006-03-16
申请人： Ebara Corp , 株式会社荏原製作所
发明人： O CHIKAAKI , OWATARI AKIRA , ONO HARUKO , ISHIBASHI TOMOATSU , TAKAGI DAISUKE
IPC分类号： H01L21/304 , H01L21/3205 , H01L23/52
摘要： PROBLEM TO BE SOLVED: To effectively remove residual metal in a film state remaining on an insulating film after forming a protective film for protecting wiring.
SOLUTION: A substrate is prepared with metal traces formed in the insulating film. The protective film is selectively formed on the exposed surface of the metal traces by electroless plating. The post-cleaning of the substrate is performed by misting almost all the surface of the substrate on which the protective film is selectively formed with a post-cleaning liquid. The surface of the substrate after post-cleaning is rinsed in purified water and is dried.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：在形成用于保护布线的保护膜之后，有效地去除残留在绝缘膜上的膜状态的残留金属。解决方案：用绝缘膜中形成的金属迹线制备衬底。通过无电解电镀在金属迹线的暴露表面上选择性地形成保护膜。通过将几乎所有选择形成保护膜的基板的所有表面与后清洗液体一起进行基片的后清洗。后清洗后的基材表面在纯化水中漂洗并干燥。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2006093357A Semiconductor device and manufacturing method thereof, and processing solution 审中-公开
标题翻译：半导体器件及其制造方法及其处理方法
公开(公告)号：JP2006093357A
公开(公告)日：2006-04-06
申请号：JP2004276109
申请日：2004-09-22
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TAKAGI DAISUKE , O CHIKAAKI , OWATARI AKIRA , FUKUNAGA AKIRA , TASHIRO AKIHIKO
IPC分类号： H01L23/52 , C23C18/16 , C23C18/50 , H01L21/288 , H01L21/3205
CPC分类号： H01L23/53238 , C23C18/50 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To protect wiring by an alloy film by forming the alloy film with a necessary minimum thickness to have the diffusion preventing effect against e.g. oxygen or copper in more uniform thickness all over the substrate while alleviating the dependency on a wiring pattern. SOLUTION: The alloy film is formed containing 1-9 atomic% of tungsten or molybdenum and 3-12 atomic% of phosphorus or boron by electroless plating on at least a portion of the area surrounding the embedded wiring formed by embedding a wiring material in a recess for wiring formed in an insulator on the substrate. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：通过用必要的最小厚度形成合金膜以通过合金膜来保护布线，以具有防止例如扩散防止效果的扩散防止效果。氧或铜在整个衬底上均匀的厚度，同时减轻对布线图案的依赖性。解决方案：通过在围绕通过嵌入布线形成的嵌入式布线周围的区域的至少一部分上进行化学镀而形成含有1-9原子％的钨或钼和3-12原子％的磷或硼的合金膜在基板上的绝缘体中形成的用于布线的凹部中的材料。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2006009130A Method and apparatus for processing substrate 审中-公开
标题翻译：用于处理基板的方法和装置
公开(公告)号：JP2006009130A
公开(公告)日：2006-01-12
申请号：JP2004192060
申请日：2004-06-29
申请人： Ebara Corp , 株式会社荏原製作所
发明人： O CHIKAAKI , TAKAGI DAISUKE , TASHIRO AKIHIKO , FUKUNAGA YUKIO , FUKUNAGA AKIRA , OWATARI AKIRA
IPC分类号： C23C18/18 , H01L21/288 , H01L21/3205 , H01L23/52
摘要： PROBLEM TO BE SOLVED: To provide a method and an apparatus for processing a substrate capable of reliably depositing a metal film by electroless plating on an exposed surface of a base metal such as interconnects, with increased throughput and without the formation of voids in the base metal. SOLUTION: When depositing a metal film by the electroless plating on a surface of a substrate having a base metal, the surface of the substrate is cleaned with a cleaning solution comprising an aqueous solution of a carboxyl group-containing organic acid or its salt and a surfactant as an additive; the surface of the substrate after the cleaning is brought into contact with a processing solution comprising a mixture of the cleaning solution and a solution containing a catalyst metal ion, thereby applying the catalyst to the surface of the substrate. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于处理基板的方法和装置，该基板能够通过无电解电镀在基底金属（例如互连）的暴露表面上可靠地沉积金属膜，具有增加的生产量并且不形成空隙在贱金属。解决方案：当通过化学镀在具有贱金属的基材的表面上沉积金属膜时，用含有羧基的有机酸的水溶液或其含有有机酸的水溶液的清洗溶液清洗基板的表面盐和表面活性剂作为添加剂; 使清洗后的基板的表面与包含清洗液和含有催化剂金属离子的溶液的混合物的处理溶液接触，从而将催化剂施加到基板的表面。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2005044910A Method and device for forming wiring 审中-公开
标题翻译：用于形成接线的方法和装置
公开(公告)号：JP2005044910A
公开(公告)日：2005-02-17
申请号：JP2003201363
申请日：2003-07-24
申请人： Ebara Corp , 株式会社荏原製作所
发明人： O CHIKAAKI , TAKAGI DAISUKE , TASHIRO AKIHIKO , FUKUNAGA YUKIO , FUKUNAGA AKIRA
IPC分类号： H01L21/3205 , H01L21/768
CPC分类号： H01L21/76849 , H01L21/76819 , H01L21/7685 , Y10S438/976 , Y10T29/41
摘要： PROBLEM TO BE SOLVED: To provide a method and a device for forming wiring by which the drop of the machining accuracy due to etching, an exposing step, etc., performed for forming recessed sections for wiring can be prevented to the utmost and, at the same time, the electron migration resistance of the wiring can be improved at the time of forming multilayered wiring and, in addition, the reliability of a device can be improved. SOLUTION: After recessed sections for the wiring are formed in an insulating film formed on the surface of a substrate, metallic films composed of a wiring material are formed on the surface of the insulating film by embedding the wiring material in the recessed sections. Then wiring is formed by removing the excessive metallic materials other than those in the recessed sections and flattening the surface of the substrate, and a first protective film composed of a conductive material is selectively formed on the exposed surface of the wiring. Moreover, a second protective film is formed on the surface of the substrate on which the first protective film is formed and an interlayer insulating layer is formed on the surface of the substrate on which the second protective film is formed. Finally, the surface of the interlayer insulating film is flattened. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于形成布线的方法和装置，通过该方法和装置可以最大限度地防止用于形成用于布线的凹部的蚀刻，曝光步骤等的加工精度的下降并且同时，在形成多层布线时可以提高布线的电子迁移电阻，并且还可以提高器件的可靠性。解决方案：在形成在基板表面上的绝缘膜中形成用于布线的凹陷部分之后，通过将布线材料嵌入到凹部中而在绝缘膜的表面上形成由布线材料构成的金属膜。然后通过去除凹陷部分以外的过量金属材料并使基板的表面平坦化而形成布线，并且在布线的暴露表面上选择性地形成由导电材料构成的第一保护膜。此外，在其上形成有第一保护膜的基板的表面上形成第二保护膜，并且在其上形成有第二保护膜的基板的表面上形成层间绝缘层。最后，层间绝缘膜的表面变平。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2004183061A Treatment liquid management system 有权
公开(公告)号：JP2004183061A
公开(公告)日：2004-07-02
申请号：JP2002352813
申请日：2002-12-04
申请人： Ebara Corp , 株式会社荏原製作所
发明人： O CHIKAAKI , TAKAGI DAISUKE , TASHIRO AKIHIKO , OHASHI TAKESHI
IPC分类号： C23C18/31 , C23C18/16 , C23C18/18 , H01L21/288
摘要： PROBLEM TO BE SOLVED: To quantitatively manage particles contained in a treatment liquid which is continuously used while being circulated such as an electroless plating liquid and a chemical liquid (treatment liquid prior to plating).
SOLUTION: The treatment liquid management system is provided with: a sampling tank 82 for sampling a treatment liquid 52 from at least either a treatment tank 50 in which a member to be treated is brought into contact with the treatment liquid 52 for performing treatment or a treatment liquid feed tank 54 which feeds the treatment liquid 52 to the treatment tank 50, and temporarily storing the treatment liquid 52; and a particle measuring instrument 94 for measuring the number of particles precipitated into a sampling liquid 86 inside the sampling tank 82.
COPYRIGHT: (C)2004,JPO&NCIPI

8. 发明专利

JP2003253453A METHOD AND SYSTEM OF CONTROLLING CONCENTRATION OF CHEMICAL TREATMENT LIQUID AND PLATING APPARATUS 审中-公开
公开(公告)号：JP2003253453A
公开(公告)日：2003-09-10
申请号：JP2002060474
申请日：2002-03-06
申请人： EBARA CORP
发明人： O CHIKAAKI , TAKAGI DAISUKE , MISHIMA KOJI , SEKIMOTO MASAHIKO , OWATARI AKIRA
IPC分类号： G01N31/00 , C23C18/16 , G01N21/59 , G01N31/10 , G01N31/16
摘要： PROBLEM TO BE SOLVED: To provide a concentration control method applied to a chemical treatment liquid which requires severe component addition conditions. SOLUTION: In the concentration control method, the quantity of the chemical treatment liquid is measured and after the volume is adjusted into a control range if it is out of a control range, the concentration of an acid or an alkali in the chemical treatment liquid is measured by an automatic titration method and is adjusted into a control range if it is out of the control range, and further the concentration of metal ions or metal complex ions in the chemical treatment liquid is measured by an optical method and is adjusted into a control range if it is out of the control range. A concentration control system is composed of a chemical treatment liquid storage tank, a water evaporation accelerating means, a solution addition means, an analytic means and a management controller which are used for the concentration control method. The water evaporation means and the solution addition means operate to keep the quantity of the chemical treatment liquid, the concentration of the acid or alkali of the chemical treatment liquid and the concentration of the metal ions or metal complex ions in the chemical treatment liquid within a control range. COPYRIGHT: (C)2003,JPO

9. 发明专利

JP2004300576A Method and apparatus for substrate treatment 审中-公开
公开(公告)号：JP2004300576A
公开(公告)日：2004-10-28
申请号：JP2004075363
申请日：2004-03-16
申请人： Ebara Corp , 株式会社荏原製作所
发明人： O CHIKAAKI , TAKAGI DAISUKE , TASHIRO AKIHIKO , FUKUNAGA AKIRA , OWATARI AKIRA
IPC分类号： C23C18/31 , C23C18/50 , H01L21/28 , H01L21/288 , H01L21/3205 , H01L23/52
摘要： PROBLEM TO BE SOLVED: To provide an apparatus for substrate treatment in which initial cost and running cost can be reduced, an extensive installation space is not required, the electric characteristic of wires is not degraded, and a protective film of high quality is efficiently deposited on the surface of a metal part.
SOLUTION: A substrate having a metal part on the surface thereof is prepared. The surface of the substrate is brought into contact with pre-treatment solution to perform plating pre-treatment to decorate the entire surface. The pre-treatment solution remained on the surface of the substrate is removed by rinsing. The surface of the substrate is subjected to electroless plating to selectively deposit an alloy film on the surface of the metal part, and the substrate after the electroless plating is post-cleaned and dried.
COPYRIGHT: (C)2005,JPO&NCIPI

10. 发明专利

JP2004204265A Plating method and plating apparatus 有权
公开(公告)号：JP2004204265A
公开(公告)日：2004-07-22
申请号：JP2002372706
申请日：2002-12-24
申请人： Ebara Corp , 株式会社荏原製作所
发明人： O CHIKAAKI , TAKAGI DAISUKE , TASHIRO AKIHIKO , INOUE HIROAKI , SUZAKI AKIRA , SHIMOYAMA TADASHI , YOKOTA HIROSHI
IPC分类号： C23C18/18 , C23C18/32 , H01L21/288 , H01L21/3205 , H01L23/52
摘要： PROBLEM TO BE SOLVED: To selectively and economically form a plating film such as a wiring protection film on the surface of metallic wires, without eroding the wires.
SOLUTION: This plating method is characterized by forming an oxidized-metal thin film 50 having a photo-electrochemical reactivity on the exposed surface of the wires 8 of a substrate W that has embedded wires 8 formed on the surface, and while contacting a plating solution 34 with the surface of the substrate W, irradiating the surface of the substrate W with light.The oxidized-metal thin film having the photo-electrochemical reactivity includes, for instance, a crystalline copper oxide film (a Cu
2 O film).
COPYRIGHT: (C)2004,JPO&NCIPI

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