专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2004107422A3 PLATING APPARATUS AND PLATING METHOD 审中-公开
标题翻译：电镀设备和电镀方法
公开(公告)号：WO2004107422A3
公开(公告)日：2005-06-16
申请号：PCT/JP2004007437
申请日：2004-05-25
申请人： EBARA CORP , SEKIMOTO MASAHIKO , ENDO YASUHIKO , STRAUSSER STEPHEN , TAKEMURA TAKASHI , SAITO NOBUTOSHI , KURIYAMA FUMIO , YOSHIOKA JUNICHIRO , HORIE KUNIAKI , MINAMI YOSHIO , KAMODA KENJI
发明人： SEKIMOTO MASAHIKO , ENDO YASUHIKO , STRAUSSER STEPHEN , TAKEMURA TAKASHI , SAITO NOBUTOSHI , KURIYAMA FUMIO , YOSHIOKA JUNICHIRO , HORIE KUNIAKI , MINAMI YOSHIO , KAMODA KENJI
IPC分类号： C25D5/02 , C25D7/12 , H01L21/00 , H01L21/288 , H01L21/60
CPC分类号： C25D5/022 , C25D7/123 , C25D17/001 , H01L21/2885 , H01L21/67173 , H01L21/6723 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/1147 , H01L2224/13099 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2224/05647 , H01L2924/00014
摘要： A plating apparatus has an ashing unit (300) configured to perform an ashing process on a resist (502) applied on a surface of a seed layer (500) formed on a substrate (W), and a pre-wetting section (26) configured to provide hydrophilicity to a surface of the substrate after the ashing process. The plating apparatus includes a pre-soaking section (28) configured to bring the surface of the substrate into contact with a treatment solution to clean or activate a surface of the seed layer formed on the substrate. The plating apparatus also includes a plating unit (34) configured to bring the surface of the substrate into a plating solution in a plating tank while the resist is used as a mask so as to form a plated film (504) on the surface of the seed layer formed on the substrate.
摘要翻译：电镀装置具有灰化单元（300），其被配置为对施加在形成在基板（W）上的种子层（500）的表面上的抗蚀剂（502）和预润湿部分（26）进行灰化处理，被配置为在灰化过程之后向基板的表面提供亲水性。电镀装置包括预浸渍部分（28），其被配置为使基材的表面与处理溶液接触以清洁或活化形成在基材上的种子层的表面。电镀装置还包括电镀单元（34），其被配置为在将抗蚀剂用作掩模的同时使基板的表面进入电镀槽中的镀液中，以在该表面上形成镀膜（504）种子层形成在基底上。

2. 发明专利

DE60125859T2 未知
公开(公告)号：DE60125859T2
公开(公告)日：2007-11-08
申请号：DE60125859
申请日：2001-05-14
申请人： EBARA CORP
发明人： KATSUOKA SEIJI , SEKIMOTO MASAHIKO , MIYAZAKI MITSURU , NOJI NAOKI , CHIBA KAZUKI , FUJIMOTO KENJI
IPC分类号： B24B7/17 , B24B37/04 , B24B37/32 , H01L21/00 , H01L21/304 , H01L21/677 , H01L21/687
摘要： A multi-head type polishing apparatus has a plurality of top rings for holding workpieces with respect to a single polishing table. A polishing apparatus includes a polishing table having a polishing surface, a plurality of top rings for holding workpieces and pressing the workpieces against the polishing surface, and a carousel for supporting the top rings and indexing the top rings. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by the top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces, and a pusher for transferring the workpieces between the rotary transporter and the top rings.

3. 发明专利

DE60125859D1 未知
公开(公告)号：DE60125859D1
公开(公告)日：2007-02-22
申请号：DE60125859
申请日：2001-05-14
申请人： EBARA CORP
发明人： KATSUOKA SEIJI , SEKIMOTO MASAHIKO , MIYAZAKI MITSURU , NOJI NAOKI , CHIBA KAZUKI , FUJIMOTO KENJI
IPC分类号： B24B7/17 , B24B37/04 , B24B37/32 , H01L21/00 , H01L21/304 , H01L21/677 , H01L21/687
摘要： A multi-head type polishing apparatus has a plurality of top rings for holding workpieces with respect to a single polishing table. A polishing apparatus includes a polishing table having a polishing surface, a plurality of top rings for holding workpieces and pressing the workpieces against the polishing surface, and a carousel for supporting the top rings and indexing the top rings. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by the top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces, and a pusher for transferring the workpieces between the rotary transporter and the top rings.

4. 发明公开

EP0987084A4 POLISHING APPARATUS 审中-公开
标题翻译： SCHLEIFMASCHINE
公开(公告)号：EP0987084A4
公开(公告)日：2006-11-15
申请号：EP99939175
申请日：1999-03-09
申请人： EBARA CORP
发明人： YOSHIDA MASAO , SEKIMOTO MASAHIKO
IPC分类号： B24B37/04 , B24B37/10 , B24B37/27 , H01L21/00 , H01L21/304 , H01L21/677
CPC分类号： H01L21/67161 , B24B37/04 , B24B37/345 , H01L21/67219 , H01L21/67259 , H01L21/67745 , H01L21/681
摘要： A polishing apparatus for polishing a polishing object, such as a semiconductor wafer, comprising a processing unit which includes a polisher (1) for polishing a semiconductor wafer (6) and a cleaning section (10) for cleaning the polished semiconductor wafer, a housing unit (40) for supplying a semiconductor wafer (6) to be polished to the processing unit and receiving the polished semiconductor wafer (6), and a clean room (20) provided between both units and defined by partitioning walls (102, 103) with shutters (22, 24) for isolation from both units.
摘要翻译：一种抛光装置，用于抛光诸如半导体晶片之类的抛光物体，包括处理单元，该处理单元包括用于抛光半导体晶片（6）的抛光器（1）和用于清洁抛光的半导体晶片的清洁部分（10）用于将要抛光的半导体晶片（6）供应给处理单元并接收抛光的半导体晶片（6）的单元（40）;以及设置在两个单元之间并由间隔壁（102,103）限定的清洁室（20）用快门（22,24）与两个单元隔离。

5. 发明专利

DE60041671D1 未知
公开(公告)号：DE60041671D1
公开(公告)日：2009-04-09
申请号：DE60041671
申请日：2000-03-06
申请人： EBARA CORP
发明人： SAKURAI KUNIHIKO , TOGAWA TETSUJI , TAKADA NOBUYUKI , WAKABAYASHI SATOSHI , SAITO KENICHIRO , SEKIMOTO MASAHIKO , HAYAMA TAKUJI , KOGA DAISUKE
IPC分类号： B08B3/02 , B08B11/00 , B23Q7/02 , B24B37/04 , H01L21/306

6. 发明公开

EP1532668A4 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 审中-公开
标题翻译：基板处理装置及基板处理
公开(公告)号：EP1532668A4
公开(公告)日：2009-09-23
申请号：EP03730715
申请日：2003-05-30
申请人： EBARA CORP
发明人： KATSUOKA SEIJI , SEKIMOTO MASAHIKO , WATANABE TERUYUKI , OGAWA TAKAHIRO , KOBAYASHI KENICHI , MIYAZAKI MITSURU , MOTOJIMA YASUYUKI , YOKOYAMA TOSHIO
IPC分类号： C23C18/16 , C25D7/12 , C25D17/00 , C25D17/02 , H01L21/00 , H01L21/02 , C23C18/00 , C25C7/00 , C25D5/00 , H01L21/304
CPC分类号： H01L21/67051 , C23C18/1619 , C25D7/123 , C25D17/001 , C25D17/02

7. 发明专利

JP2008066755A Polishing device 有权
标题翻译：抛光装置
公开(公告)号：JP2008066755A
公开(公告)日：2008-03-21
申请号：JP2007304919
申请日：2007-11-26
申请人： Ebara Corp , 株式会社荏原製作所
发明人： SAKURAI KUNIHIKO , TOGAWA TETSUJI , TAKADA NOBUYUKI , WAKABAYASHI SATOSHI , SAITO KENICHIRO , SEKIMOTO MASAHIKO , HAYAMA TAKUJI , KOGA DAISUKE
IPC分类号： H01L21/304 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To provide a polishing device which can be applied to a dry-in/dry-out type polishing device and respond to cleaning of semiconductor wafers accompanying miniaturization, having three or more cleaning steps in a cleaning process without spoiling processing capacity per unit time and per unit footprint. SOLUTION: The device comprises polishing tables 34, 35, 36, and 37 with polishing surfaces, top rings 32 and 33 which hold an object to be polished to press it to the polishing surfaces, transporting mechanisms 27, 27A, and 27B equipped with a plurality of bases on which the object is placed and is movable horizontally, pressures 30 and 30' which deliver the object between the bases and the top rings 32 and 33, and inversion device 28 and 28' which can deliver the object between the bases and invert the object. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种可应用于干式/干式抛光装置并且对小型化的半导体晶片的清洁作出反应的抛光装置，其具有在清洁过程中具有三个或更多个清洁步骤而没有每单位时间和每单位占地面积的破坏处理能力。解决方案：该装置包括具有抛光表面的抛光台34,35,36和37，顶表面32和33，其保持要抛光的物体将其推压到抛光表面，输送机构27,27A和27B 配备有多个基座，物体被放置在其上并且可水平移动，将物体在基座与顶环32和33之间输送的压力30和30'以及可以在物体之间传送物体的反转装置28和28' 基础和反转对象。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2005191368A Substrate retaining device, substrate retaining method, and substrate treatment device 有权
标题翻译：基板保持装置，基板保持方法和基板处理装置
公开(公告)号：JP2005191368A
公开(公告)日：2005-07-14
申请号：JP2003432480
申请日：2003-12-26
申请人： Ebara Corp , 株式会社荏原製作所
发明人： SEKIMOTO MASAHIKO , KATSUOKA SEIJI , DAI NAOKI , WATANABE TERUYUKI , OGAWA TAKAHIRO , SUZUKI KENICHI , KOBAYASHI KENICHI , MOTOJIMA YASUYUKI , KATO AKIRA
IPC分类号： B24B37/30 , H01L21/288 , H01L21/304 , H01L21/677 , H01L21/68 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To reliably suck and retain a substrate by reliably adhering the rear surface periphery of a substrate without a gaps over the entire periphery of a suction seal on the end face of the suction seal. SOLUTION: A substrate retaining device comprises a substrate pressing section 82 for supporting the substrate W while the surface faces down, and a suction head 84 having the suction seal 90 for retaining the substrate by sealing the rear surface periphery of the substrate W supported by the substrate pressing section 82 annularly for suction. A plurality of pressing mechanisms 164 that come into contact with the surface periphery of the substrate W supported by the substrate pressing section 82 and press the substrate W toward the suction head 84 are provided at positions along the circumferential direction at the substrate pressing section 82. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：通过在吸入密封件的端面上的吸入密封件的整个周边上可靠地粘附基板的后表面周边而不间隙地可靠地吸附和保持基板。解决方案：基板保持装置包括：基板按压部82，用于在表面朝下的同时支撑基板W;吸入头84具有用于通过密封基板W的后表面周边来保持基板的吸入密封件90 由基板按压部82支撑，用于抽吸。与基板按压部82支撑的基板W的表面周边接触并将基板W朝向吸引头84按压的多个按压机构164设置在基板按压部82的周向的位置。版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JP2005191304A Substrate retaining device, substrate retaining method, and substrate treatment device 审中-公开
标题翻译：基板保持装置，基板保持方法和基板处理装置
公开(公告)号：JP2005191304A
公开(公告)日：2005-07-14
申请号：JP2003431346
申请日：2003-12-25
申请人： Ebara Corp , 株式会社荏原製作所
发明人： SEKIMOTO MASAHIKO , KATSUOKA SEIJI , DAI NAOKI , WATANABE TERUYUKI , OGAWA TAKAHIRO , SUZUKI KENICHI , KOBAYASHI KENICHI , MOTOJIMA YASUYUKI , KATO AKIRA
IPC分类号： C23C18/18 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To respond to a request for miniaturizing and making compact a device by securing the dipping depth of a substrate into a treatment liquid.
SOLUTION: A substrate retaining device comprises a substrate holder 84 that has a first annular sealing member 92 and retains a substrate W by bringing the periphery of the treatment surface of the substrate W into contact with the first sealing member 92; and a substrate pressing section 85 that goes down relatively to the substrate holder 84, presses the substrate W supported by the substrate holder 84 downward, and pressure-welds the first sealing member 92 to the substrate W. A second annular sealing member 170 that is pressure-welded to the upper surface of an annular retaining section 82 of the substrate holder 84 and seals the outer periphery of the substrate pressing section 85 when the second annular sealing member 170 goes down relatively to the substrate holder 84 is provided at the substrate pressing section 85.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：通过将基板的浸入深度确保到处理液中来应对小型化和紧凑化装置的要求。解决方案：衬底保持装置包括：衬底保持器84，其具有第一环形密封构件92，并且通过使衬底W的处理表面的周边与第一密封构件92接触来保持衬底W; 以及相对于基板保持件84下降的基板按压部85，将由基板保持件84支撑的基板W向下压，并将第一密封部件92加压焊接到基板W.第二环状密封部件170 在第二环状密封构件170相对于基板保持件84下降时，被压焊到基板保持件84的环状保持部82的上表面，并密封基板按压部85的外周，第85条。版权所有（C）2005，JPO＆NCIPI

10. 发明专利

JP2004010961A SUBSTRATE TREATMENT SYSTEM 审中-公开
公开(公告)号：JP2004010961A
公开(公告)日：2004-01-15
申请号：JP2002166111
申请日：2002-06-06
申请人： EBARA CORP
发明人： KATSUOKA SEIJI , SEKIMOTO MASAHIKO , YOKOYAMA TOSHIO , WATANABE TERUYUKI , OGAWA TAKAHIRO , KOBAYASHI KENICHI , MIYAZAKI MITSURU , MOTOJIMA YASUYUKI
IPC分类号： B65G49/07 , C23C18/31 , H01L21/288 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To efficiently form a wiring protective film or the like on the surface of a substrate at a low initial cost and a low running cost without requiring a wide installation space. SOLUTION: The system is provided with a load/unload area 10 housing a load/unload unit 18 mounted with the primary conveyance robot 22 having a plurality of hands in dry specifics and a substrate cassette 16 with a substrate housed, a cleaning area 12 housing the second conveyance robot 36 having a plurality of hands in wet specifics and a cleaning unit 26 of performing cleaning for the substrate, and a plating treatment area 14 housing the third conveyance robot 46 having hands of a back face adsorption type, pretreatment units 38 and 40 of performing treatment to plating and an electroless plating treatment unit 42 of performing plating treatment. COPYRIGHT: (C)2004,JPO

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式