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1. 发明授权

US06365017B1 Substrate plating device 有权
标题翻译：基板电镀装置
公开(公告)号：US06365017B1
公开(公告)日：2002-04-02
申请号：US09530805
申请日：2000-05-05
申请人： Akihisa Hongo , Naoaki Ogure , Hiroyuki Ueyama , Junitsu Yamakawa , Mizuki Nagai , Kenichi Suzuki , Atsushi Chono , Satoshi Sendai , Koji Mishima
发明人： Akihisa Hongo , Naoaki Ogure , Hiroyuki Ueyama , Junitsu Yamakawa , Mizuki Nagai , Kenichi Suzuki , Atsushi Chono , Satoshi Sendai , Koji Mishima
IPC分类号： C25D1700
CPC分类号： C25D21/14 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/02
摘要： The present invention relates to a substrate plating apparatus for plating a substrate in a plating bath containing plating solution. An insoluble anode is disposed in the plating bath opposite the substrate. The substrate plating apparatus comprises a circulating vessel or dummy vessel provided separate from the plating bath, with a soluble anode and a cathode disposed in the circulating vessel or dummy vessel. An anion exchange film or selective cation exchange film is disposed between the anode and cathode and isolates the same, wherein metal ions are generated in the circulating vessel or dummy vessel by flowing current between the soluble anode and the cathode therein, and the generated metal ions are supplied to the plating bath. The substrate plating apparatus can also comprise an ion exchange film or neutral porous diaphragm disposed between the substrate and anode in the plating bath, wherein the ion exchange film or neutral porous diaphragm divides the plating bath into a substrate region and an anode region.
摘要翻译：本发明涉及一种用于在含有电镀液的电镀液中电镀基板的基板电镀装置。不同的阳极设置在与基底相对的电镀槽中。基板电镀装置包括与电镀槽分开设置的循环容器或虚拟容器，其中可溶性阳极和阴极设置在循环容器或假容器中。阴极交换膜或选择性阳离子交换膜设置在阳极和阴极之间，并隔离其中，其中通过在可溶性阳极和阴极之间流动电流而在循环容器或虚拟容器中产生金属离子，并且所产生的金属离子被供应到电镀浴。基板电镀装置还可以包括设置在电镀槽中的基板和阳极之间的离子交换膜或中性多孔隔膜，其中离子交换膜或中性多孔隔膜将电镀槽分成衬底区域和阳极区域。

2. 发明授权

US06793794B2 Substrate plating apparatus and method 有权
标题翻译：基板电镀装置及方法
公开(公告)号：US06793794B2
公开(公告)日：2004-09-21
申请号：US10098415
申请日：2002-03-18
申请人： Akihisa Hongo , Naoaki Ogure , Hiroyuki Ueyama , Junitsu Yamakawa , Mizuki Nagai , Kenichi Suzuki , Atsushi Chono , Satoshi Sendai , Koji Mishima
发明人： Akihisa Hongo , Naoaki Ogure , Hiroyuki Ueyama , Junitsu Yamakawa , Mizuki Nagai , Kenichi Suzuki , Atsushi Chono , Satoshi Sendai , Koji Mishima
IPC分类号： C25D500
CPC分类号： C25D21/14 , C25D7/12 , C25D17/001
摘要： The present invention relates to a substrate plating apparatus for plating a substrate in a plating bath containing plating solution. An insoluble anode is disposed in the plating bath opposite the substrate. The substrate plating apparatus comprises a circulating vessel or dummy vessel provided separate from the plating bath, with a soluble anode and a cathode disposed in the circulating vessel or dummy vessel. An anion exchange film or selective cation exchange film is disposed between the anode and cathode and isolates the same, wherein metal ions are generated in the circulating vessel or dummy vessel by flowing current between the soluble anode and the cathode therein, and the generated metal ions are supplied to the plating bath. The substrate plating apparatus can also comprise an ion exchange film or neutral porous diaphragm disposed between the substrate and anode in the plating bath, wherein the ion exchange film or neutral porous diaphragm divides the plating bath into a substrate region and an anode region.
摘要翻译：本发明涉及一种用于在含有电镀液的电镀液中电镀基板的基板电镀装置。不同的阳极设置在与基底相对的电镀槽中。基板电镀装置包括与电镀槽分开设置的循环容器或虚拟容器，其中可溶性阳极和阴极设置在循环容器或假容器中。阴极交换膜或选择性阳离子交换膜设置在阳极和阴极之间，并隔离其中，其中通过在可溶性阳极和阴极之间流动电流而在循环容器或虚拟容器中产生金属离子，并且所产生的金属离子被供应到电镀浴。基板电镀装置还可以包括设置在电镀槽中的基板和阳极之间的离子交换膜或中性多孔隔膜，其中离子交换膜或中性多孔隔膜将电镀槽分成衬底区域和阳极区域。

3. 发明授权

US06379520B1 Plating apparatus 有权
标题翻译：电镀装置
公开(公告)号：US06379520B1
公开(公告)日：2002-04-30
申请号：US09601084
申请日：2000-07-27
申请人： Fumio Kuriyama , Hiroyuki Ueyama , Junitsu Yamakawa , Kenichi Suzuki , Atsushi Chono
发明人： Fumio Kuriyama , Hiroyuki Ueyama , Junitsu Yamakawa , Kenichi Suzuki , Atsushi Chono
IPC分类号： C25D2112
CPC分类号： C25D21/14 , C25D17/001 , C25D21/16 , C25D21/18
摘要： The plating apparatus has a plating section in which a plating process is performed and a control section for regulating the plating solution. The plating section includes a plating bath containing plating solution, an anode provided in the plating solution, and a plating object serving as a cathode placed in the plating solution opposite the anode. The control section includes a regulating tank for regulating the composition and/or concentration of the plating solution, and a replenishing tank for injecting solution into the plating solution in the regulating tank. The plating apparatus also includes a mechanism for circulating plating solution between the regulating tank in the control section and the plating bath in the plating section. The plating section is installed in a first room, while the control section is installed in a second room, which is separate from the first room Accordingly, contamination in the plating section is prevented.
摘要翻译：电镀装置具有执行电镀处理的电镀部分和用于调节电镀液的控制部分。电镀部分包括含有电镀液的镀浴，设置在电镀液中的阳极，以及放置在与阳极相对的电镀溶液中的用作阴极的电镀对象。控制部分包括用于调节电镀溶液的组成和/或浓度的调节罐，以及用于将溶液注入调节罐中的电镀溶液的补充槽。电镀装置还包括用于在控制部分中的调节罐和电镀部分中的镀浴之间循环电镀液的机构。电镀部分安装在第一房间中，而控制部分安装在与第一房间分开的第二房间中。因此，防止了电镀部分中的污染。

4. 再颁专利

USRE39123E1 Plating apparatus 有权
公开(公告)号：USRE39123E1
公开(公告)日：2006-06-13
申请号：US10187801
申请日：1999-11-26
申请人： Fumio Kuriyama , Hiroyuki Ueyama , Junitsu Yamakawa , Kenichi Suzuki , Atsushi Chono
发明人： Fumio Kuriyama , Hiroyuki Ueyama , Junitsu Yamakawa , Kenichi Suzuki , Atsushi Chono
IPC分类号： C25D21/12 , C25B15/00 , C25B7/00
CPC分类号： C25D21/14 , C25D17/001 , C25D21/16 , C25D21/18
摘要： The plating apparatus has a plating section in which a plating process is performed and a control section for regulating the plating solution. The plating section includes a plating bath containing plating solution, an anode provided in the plating solution, and a plating object serving as a cathode placed in the plating solution opposite the anode. The control section includes a regulating tank for regulating the composition and/or concentration of the plating solution, and a replenishing tank for injecting solution into the plating solution in the regulating tank. The plating apparatus also includes a mechanism for circulating plating solution between the regulating tank in the control section and the plating bath in the plating section. The plating section is installed in a first room, while the control section is installed in a second room, which is separate from the first room Accordingly, contamination in the plating section is prevented.

5. 发明授权

US06627066B1 Method of measuring the concentration of a leveler in a plating liquid 有权
标题翻译：测量电镀液中矫正剂浓度的方法
公开(公告)号：US06627066B1
公开(公告)日：2003-09-30
申请号：US09830407
申请日：2001-04-27
申请人： Yasushi Isayama , Hiroyuki Ueyama , Hiroyuki Kaneko , Junitsu Yamakawa , Akihisa Hongo , Ryoichi Kimizuka , Megumi Maruyama
发明人： Yasushi Isayama , Hiroyuki Ueyama , Hiroyuki Kaneko , Junitsu Yamakawa , Akihisa Hongo , Ryoichi Kimizuka , Megumi Maruyama
IPC分类号： G01N2742
CPC分类号： C25D21/18 , C25D21/12 , C25D21/14
摘要： The concentration of a leveler in a plating liquid that is used by a plating apparatus for filling metal such as copper in interconnection trenches and holes defined in the surface of a semiconductor substrate or the like is determined based on a peak area (Ar value) in a peel-off region of the plating liquid measured according to a CV or CVS process.
摘要翻译：基于在半导体衬底等的表面中限定的互连沟槽和孔中的用于填充铜等金属的电镀装置所使用的电镀液中的矫顽剂的浓度基于根据CV或CVS工艺测量电镀液的剥离区域。

6. 发明申请

US20070102285A1 Apparatus for managing a plating liquid 审中-公开
标题翻译：用于管理电镀液的设备
公开(公告)号：US20070102285A1
公开(公告)日：2007-05-10
申请号：US11643771
申请日：2006-12-22
申请人： Yasushi Isayama , Hiroyuki Ueyama , Hiroyuki Kaneko , Junitsu Yamakawa , Akihisa Hongo , Ryoichi Kimizuka , Megumi Maruyama
发明人： Yasushi Isayama , Hiroyuki Ueyama , Hiroyuki Kaneko , Junitsu Yamakawa , Akihisa Hongo , Ryoichi Kimizuka , Megumi Maruyama
IPC分类号： C25B15/00
CPC分类号： C25D21/18 , C25D21/12 , C25D21/14
摘要： The concentration of a leveler in a plating liquid that is used by a plating apparatus for filling metal such as copper in interconnection trenches and holes defined in the surface of a semiconductor substrate or the like is determined based on a peak area (Ar value) in a peel-off region of the plating liquid measured according to a CV or CVS process.
摘要翻译：基于在半导体衬底等的表面中限定的互连沟槽和孔中的用于填充铜等金属的电镀装置所使用的电镀液中的矫顽剂的浓度基于根据CV或CVS工艺测量电镀液的剥离区域。

7. 发明授权

US07172683B2 Method of managing a plating liquid used in a plating apparatus 有权
标题翻译：电镀装置中使用的电镀液的管理方法
公开(公告)号：US07172683B2
公开(公告)日：2007-02-06
申请号：US10627684
申请日：2003-07-28
申请人： Yasushi Isayama , Hiroyuki Ueyama , Hiroyuki Kaneko , Junitsu Yamakawa , Akihisa Hongo , Ryoichi Kimizuka , Megumi Maruyama
发明人： Yasushi Isayama , Hiroyuki Ueyama , Hiroyuki Kaneko , Junitsu Yamakawa , Akihisa Hongo , Ryoichi Kimizuka , Megumi Maruyama
IPC分类号： C25D21/14 , C25D7/12
CPC分类号： C25D21/18 , C25D21/12 , C25D21/14
摘要： The concentration of a leveler in a plating liquid that is used by a plating apparatus for filling metal such as copper in interconnection trenches and holes defined in the surface of a semiconductor substrate or the like is determined based on a peak area (Ar value) in a peel-off region of the plating liquid measured according to a CV or CVS process.
摘要翻译：基于在半导体衬底等的表面中限定的互连沟槽和孔中的用于填充铜等金属的电镀装置所使用的电镀液中的矫顽剂的浓度基于根据CV或CVS工艺测量电镀液的剥离区域。

8. 发明申请

US20060118598A1 Bonding apparatus and bonding method 审中-公开
标题翻译：接合装置和接合方法
公开(公告)号：US20060118598A1
公开(公告)日：2006-06-08
申请号：US11291838
申请日：2005-12-02
申请人： Yusuke Chikamori , Naoaki Ogure , Hideki Tateishi , Yukio Fukunaga , Hiroyuki Ueyama
发明人： Yusuke Chikamori , Naoaki Ogure , Hideki Tateishi , Yukio Fukunaga , Hiroyuki Ueyama
IPC分类号： B23K1/00 , B23K5/00 , B23K20/14
CPC分类号： B23K20/023 , B23K2101/40
摘要： A bonding apparatus can bond contacts of electronic components directly to each other without the need for solder. The bonding apparatus include a hermetically sealed processing chamber, a plurality of bases for holding at least two workpieces having respective bonding regions in the processing chamber, a gas inlet for introducing a processing gas to clean the bonding regions into the processing chamber, a pressure controller for controlling a predetermined pressure to be developed in the processing chamber, a heater for heating the workpieces in the processing chamber, and a bonding unit for pressing and bonding the bonding regions of the workpieces to each other in the processing chamber.
摘要翻译：接合装置可以将电子部件的触点彼此直接接合而不需要焊料。接合装置包括密封处理室，用于在处理室中保持具有各自的接合区域的至少两个工件的多个基座，用于引入处理气体以将接合区域引入处理室的气体入口，压力控制器用于控制处理室中要显影的预定压力，用于加热处理室中的工件的加热器，以及用于在处理室中将工件的接合区域彼此压合并粘合的接合单元。

9. 发明授权

US5950646A Vapor feed supply system 失效
标题翻译：蒸气供料系统
公开(公告)号：US5950646A
公开(公告)日：1999-09-14
申请号：US3947
申请日：1998-01-08
申请人： Kuniaki Horie , Hidenao Suzuki , Tsutomu Nakada , Takeshi Murakami , Yukio Fukunaga , Masahito Abe , Hiroyuki Shinozaki , Kiwamu Tsukamoto , Mitsunao Shibasaki , Yuji Araki , Hiroyuki Ueyama
发明人： Kuniaki Horie , Hidenao Suzuki , Tsutomu Nakada , Takeshi Murakami , Yukio Fukunaga , Masahito Abe , Hiroyuki Shinozaki , Kiwamu Tsukamoto , Mitsunao Shibasaki , Yuji Araki , Hiroyuki Ueyama
IPC分类号： B08B9/00 , C23C16/44 , C23C16/448 , B08B3/10
CPC分类号： C23C16/448 , B08B9/00 , C23C16/4407 , Y10S134/902
摘要： A vapor feed supply system including a vaporizer device and a method of cleaning a vapor flow region employing such a vaporizer device enables thorough cleaning of the system, without having to degrade the overall system vacuum in the process of cleaning the vaporizer device. The method includes defining a cleaning fluid passage having a predetermined withstand pressure by isolating a cleaning region of the vapor flow region, and flowing a cleaning fluid into the cleaning fluid passage under a pressure so as to enable the cleaning fluid to remain in a liquid state at a cleaning temperature of the cleaning region.
摘要翻译：包括蒸发器装置和使用这种蒸发器装置的蒸汽流动区域的清洁方法的蒸汽供给系统能够彻底清洁系统，而不必在清洁蒸发器装置的过程中降低整个系统的真空度。该方法包括通过隔离蒸汽流动区域的清洁区域来限定具有预定耐受压力的清洁流体通道，并且在压力下将清洁流体流入清洁流体通道以使清洁流体保持在液体状态在清洁区域的清洁温度下。

10. 发明授权

US5166652A Bistable solenoid for use with a knitting machine 失效
标题翻译：用于使用针织机的耐用电磁铁
公开(公告)号：US5166652A
公开(公告)日：1992-11-24
申请号：US717586
申请日：1991-06-19
申请人： Yoshiteru Koyama , Hiroyuki Ueyama
发明人： Yoshiteru Koyama , Hiroyuki Ueyama
IPC分类号： D04B15/82 , D04B15/78 , H01F7/122 , H01F7/16
CPC分类号： D04B15/78 , H01F7/1615 , H01F2007/1669
摘要： A bistable solenoid for use with a knitting machine. The bistable solenoid includes an enclosure made of magnetic material which includes bearing surfaces at opposite ends. A plunger having a central region made of magnetic material and outer end regions made of non-magnetic material is movable within the enclosure for operation of a cam of a knitting machine. The movable plunger is controlled by axially aligned permanent magnets which are spaced from each other by a yoke. The permanent magnets are sandwiched between magnetizable coils which move the plunger toward the coil that is excited. The plunger is spaced radially from the coil's magnets and bearing so that very little wear is brought about during use in operating the cam of the knitting machine.
摘要翻译：一种用于针织机的双稳电磁铁。双稳态螺线管包括由磁性材料制成的外壳，其包括在相对端的轴承表面。具有由磁性材料制成的中心区域和由非磁性材料制成的外端区域的柱塞可在外壳内移动，以操作编织机的凸轮。可移动柱塞由轴对齐的永久磁铁控制，永磁体通过轭彼此间隔开。永磁体被夹在可激励的线圈之间，该线圈将柱塞朝向被激励的线圈移动。柱塞与线圈的磁体和轴承径向间隔开，从而在使用时在操作编织机的凸轮时产生很少的磨损。

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