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1. 发明授权

US5950646A Vapor feed supply system 失效
标题翻译：蒸气供料系统
公开(公告)号：US5950646A
公开(公告)日：1999-09-14
申请号：US3947
申请日：1998-01-08
申请人： Kuniaki Horie , Hidenao Suzuki , Tsutomu Nakada , Takeshi Murakami , Yukio Fukunaga , Masahito Abe , Hiroyuki Shinozaki , Kiwamu Tsukamoto , Mitsunao Shibasaki , Yuji Araki , Hiroyuki Ueyama
发明人： Kuniaki Horie , Hidenao Suzuki , Tsutomu Nakada , Takeshi Murakami , Yukio Fukunaga , Masahito Abe , Hiroyuki Shinozaki , Kiwamu Tsukamoto , Mitsunao Shibasaki , Yuji Araki , Hiroyuki Ueyama
IPC分类号： B08B9/00 , C23C16/44 , C23C16/448 , B08B3/10
CPC分类号： C23C16/448 , B08B9/00 , C23C16/4407 , Y10S134/902
摘要： A vapor feed supply system including a vaporizer device and a method of cleaning a vapor flow region employing such a vaporizer device enables thorough cleaning of the system, without having to degrade the overall system vacuum in the process of cleaning the vaporizer device. The method includes defining a cleaning fluid passage having a predetermined withstand pressure by isolating a cleaning region of the vapor flow region, and flowing a cleaning fluid into the cleaning fluid passage under a pressure so as to enable the cleaning fluid to remain in a liquid state at a cleaning temperature of the cleaning region.
摘要翻译：包括蒸发器装置和使用这种蒸发器装置的蒸汽流动区域的清洁方法的蒸汽供给系统能够彻底清洁系统，而不必在清洁蒸发器装置的过程中降低整个系统的真空度。该方法包括通过隔离蒸汽流动区域的清洁区域来限定具有预定耐受压力的清洁流体通道，并且在压力下将清洁流体流入清洁流体通道以使清洁流体保持在液体状态在清洁区域的清洁温度下。

2. 发明授权

US06176929B1 Thin-film deposition apparatus 失效
标题翻译：薄膜沉积装置
公开(公告)号：US06176929B1
公开(公告)日：2001-01-23
申请号：US09118177
申请日：1998-07-17
申请人： Yukio Fukunaga , Hiroyuki Shinozaki , Kiwamu Tsukamoto , Mitsunao Shibasaki , Kuniaki Horie , Hiroyuki Ueyama , Takeshi Murakami
发明人： Yukio Fukunaga , Hiroyuki Shinozaki , Kiwamu Tsukamoto , Mitsunao Shibasaki , Kuniaki Horie , Hiroyuki Ueyama , Takeshi Murakami
IPC分类号： C23C1600
CPC分类号： C23C16/45565 , C23C16/4412 , C23C16/4557 , C23C16/45591 , C23C16/46
摘要： A compact thin-film deposition apparatus can promote a stable growth of a high quality thin-film product of uniform quality. The apparatus comprises a vacuum-tight deposition chamber enclosing a substrate holding device for holding a substrate. An elevator device for moving the substrate holding device and a gas showering head for flowing a film forming gas towards the substrate are provided. A transport opening and an exhaust opening are provided on a wall section of the deposition chamber at a height corresponding to the transport position and the deposition position, respectively. The deposition chamber is provided with a flow guiding member, and the flow guiding member comprises a cylindrical member to surround an elevating path of the substrate holding device and a first ring member to vertically divide a chamber space at a height between the exhaust opening and the transport opening.
摘要翻译：紧凑的薄膜沉积装置可以促进质量均匀的高质量薄膜产品的稳定生长。该装置包括一个真空密封的沉积室，其包围用于保持基板的基板保持装置。提供了一种用于移动基板保持装置的电梯装置和用于使成膜气体朝向基板流动的气体淋浴头。输送开口和排气口分别设置在沉积室的壁部分上，其高度分别对应于输送位置和沉积位置。沉积室设置有导流构件，并且流动引导构件包括圆筒构件以包围基板保持装置的升降路径和第一环构件，以在排气口和排气口之间的高度垂直分隔腔室空间运输开放。

3. 发明授权

US06269221B1 Liquid feed vaporization system and gas injection device 失效
公开(公告)号：US06269221B1
公开(公告)日：2001-07-31
申请号：US09662897
申请日：2000-09-15
申请人： Kuniaki Horie , Hidenao Suzuki , Tsutomu Nakada , Fumio Kuriyama , Takeshi Murakami , Masahito Abe , Yuji Araki , Hiroyuki Ueyama
发明人： Kuniaki Horie , Hidenao Suzuki , Tsutomu Nakada , Fumio Kuriyama , Takeshi Murakami , Masahito Abe , Yuji Araki , Hiroyuki Ueyama
IPC分类号： F22B2906
CPC分类号： C23C16/45565 , C23C16/448 , C23C16/45561 , C23C16/4557
摘要： A compact vaporizer system is presented to produce a high quality vapor feed from a liquid feed to be delivered to a chemical vapor deposition processing chamber to produce thin film devices based on highly dielectric or ferroelectric materials such as BaTiO3, SrTiO3 and other such materials. The vaporization apparatus comprises a feed tank for storing the liquid feed; feed delivery means for transporting the liquid feed by way of a feed delivery path; a vaporizer section disposed in the delivery path comprising a high temperature heat exchanger having a capillary tube for transporting the liquid feed and a heat source for externally heating the capillary tube; and a vaporization prevention section disposed upstream of the vaporizer section for preventing effects of the vaporizer section to the liquid feed within the vaporization prevention section.

4. 发明授权

US06282368B1 Liquid feed vaporization system and gas injection device 失效
标题翻译：液体进料蒸发系统和气体注入装置
公开(公告)号：US06282368B1
公开(公告)日：2001-08-28
申请号：US09663358
申请日：2000-09-15
申请人： Kuniaki Horie , Hidenao Suzuki , Tsutomu Nakada , Takeshi Murakami , Masahito Abe , Yuji Araki , Hiroyuki Ueyama
发明人： Kuniaki Horie , Hidenao Suzuki , Tsutomu Nakada , Takeshi Murakami , Masahito Abe , Yuji Araki , Hiroyuki Ueyama
IPC分类号： A61H3306
CPC分类号： C23C16/45565 , C23C16/448 , C23C16/45561 , C23C16/4557
摘要： A compact vaporizer system is presented to produce a high quality vapor feed from a liquid feed to be delivered to a chemical vapor deposition processing chamber to produce thin film devices based on highly dielectric or ferroelectric materials such as BaTiO3, SrTiO3 and other such materials. The vaporization apparatus comprises a feed tank for storing the liquid feed; feed delivery means for transporting the liquid feed by way of a feed delivery path; a vaporizer section disposed in the delivery path comprising a high temperature heat exchanger having a capillary tube for transporting the liquid feed and a heat source for externally heating the capillary tube; and a vaporization prevention section disposed upstream of the vaporizer section for preventing effects of the vaporizer section to the liquid feed within the vaporization prevention section.
摘要翻译：提供了一种紧凑的蒸发器系统，以从液体进料产生高品质的蒸气进料，以将其输送到化学气相沉积处理室，以产生基于高电介质或铁电材料如BaTiO 3，SrTiO 3等材料的薄膜器件。蒸发装置包括用于储存液体进料的进料罐; 用于通过进料输送路径输送液体进料的进料输送装置; 设置在输送路径中的蒸发器部分包括具有用于输送液体进料的毛细管和用于外部加热毛细管的热源的高温热交换器; 以及设置在蒸发部的上游的防蒸发部，用于防止蒸发部对蒸发防止部内的液体进料的影响。

5. 发明授权

US06195504B1 Liquid feed vaporization system and gas injection device 失效
标题翻译：液体进料蒸发系统和气体注入装置
公开(公告)号：US06195504B1
公开(公告)日：2001-02-27
申请号：US08974512
申请日：1997-11-19
申请人： Kuniaki Horie , Hidenao Suzuki , Tsutomu Nakada , Fumio Kuriyama , Takeshi Murakami , Masahito Abe , Yuji Araki , Hiroyuki Ueyama
发明人： Kuniaki Horie , Hidenao Suzuki , Tsutomu Nakada , Fumio Kuriyama , Takeshi Murakami , Masahito Abe , Yuji Araki , Hiroyuki Ueyama
IPC分类号： A61H3306
CPC分类号： C23C16/45565 , C23C16/448 , C23C16/45561 , C23C16/4557
摘要： A compact vaporizer system is presented to produce a high quality vapor feed from a liquid feed to be delivered to a chemical vapor deposition processing chamber to produce thin film devices based on highly dielectric or ferroelectric materials such as BaTiO3, SrTiO3 and others such materials. The vaporization apparatus comprises a feed tank for storing the liquid feed; feed delivery means for transporting the liquid feed by way of a feed delivery path; a vaporizer section disposed in the delivery path comprising a high temperature heat exchanger having a capillary tube for transporting the liquid feed and a heat source for externally heating the capillary tube; and a vaporization prevention section disposed upstream of the vaporizer section for preventing heating effects of the vaporizer section to the liquid feed within the vaporization prevention section.
摘要翻译：提供了一种紧凑的蒸发器系统，用于从液体进料产生高质量的蒸汽进料，以将其输送到化学气相沉积处理室，以产生基于高电介质或铁电材料如BaTiO 3，SrTiO 3等材料的薄膜器件。蒸发装置包括用于储存液体进料的进料罐; 用于通过进料输送路径输送液体进料的进料输送装置; 设置在输送路径中的蒸发器部分包括具有用于输送液体进料的毛细管和用于外部加热毛细管的热源的高温热交换器; 以及蒸发防止部，其设置在所述蒸发部的上游侧，用于防止所述蒸发部对所述蒸发防止部内的所述液体进料的加热效果。

6. 发明申请

US20070289604A1 Substrate Processing Apparatus 审中-公开
标题翻译：基板加工装置
公开(公告)号：US20070289604A1
公开(公告)日：2007-12-20
申请号：US11587974
申请日：2005-04-27
申请人： Yukio Fukunaga , Akira Susaki , Junji Kunisawa , Hiroyuki Ueyama , Shohei Shima , Akira Fukunaga , Hideki Tateishi , Junko Mine
发明人： Yukio Fukunaga , Akira Susaki , Junji Kunisawa , Hiroyuki Ueyama , Shohei Shima , Akira Fukunaga , Hideki Tateishi , Junko Mine
IPC分类号： C23G1/02 , B08B3/00 , G05D23/00 , G05D99/00
CPC分类号： H01L21/76838 , H01L21/02063 , H01L21/02068 , H01L21/67253
摘要： To provide an apparatus and a method capable of supplying a gas containing an evaporated reducing organic compound while strictly controlling the flow rate thereof to process a surface of a metal on a substrate without causing any deterioration of various types of films forming a semiconductor element with a simple apparatus configuration. The apparatus includes a process chamber 10 for keeping a substrate W therein, the process chamber 10 being gastight, an evacuation control system 20 for controlling the pressure in the process chamber 10, and a process gas supply system 30 for supplying a process gas containing a reducing organic compound to the process chamber 10. The process gas supply system 30 has an evaporator 32 keeping liquid material of the reducing organic compound therein and having an evaporating liquid surface S, a process gas pipe 18 for directing the process gas containing the reducing organic compound evaporated in the evaporator 32 into the process chamber 10, and a throttle element 40 disposed in the process gas pipe 18 for controlling the flow rate of the process gas to be supplied to the process chamber 10 by adjusting the opening of the throttle element 40. The opening of the throttle element 40 is so set that the pressure variation in the evaporator 32 can be maintained within a prescribed range.
摘要翻译：提供一种能够提供含有蒸发还原性有机化合物的气体的装置和方法，同时严格控制其流速来处理基板上的金属表面，而不会导致形成半导体元件的各种类型的膜的劣化简单的设备配置。该装置包括用于将基板W保持在其中的处理室10，气密的处理室10，用于控制处理室10中的压力的抽空控制系统20以及用于提供含有将有机化合物还原成处理室10。工艺气体供给系统30具有：蒸发器32，其中还原有机化合物的液体材料保持在其中并具有蒸发的液体表面S;一个工艺气体管道18，用于将含有在蒸发器32中蒸发的还原性有机化合物的工艺气体引导到过程设置在处理气体管道18中的节流元件40，用于通过调节节流元件40的开口来控制供给处理室10的处理气体的流量。节流元件40的开度被设定为使得蒸发器32中的压力变化可以保持在规定范围内。

7. 发明申请

US20060118598A1 Bonding apparatus and bonding method 审中-公开
标题翻译：接合装置和接合方法
公开(公告)号：US20060118598A1
公开(公告)日：2006-06-08
申请号：US11291838
申请日：2005-12-02
申请人： Yusuke Chikamori , Naoaki Ogure , Hideki Tateishi , Yukio Fukunaga , Hiroyuki Ueyama
发明人： Yusuke Chikamori , Naoaki Ogure , Hideki Tateishi , Yukio Fukunaga , Hiroyuki Ueyama
IPC分类号： B23K1/00 , B23K5/00 , B23K20/14
CPC分类号： B23K20/023 , B23K2101/40
摘要： A bonding apparatus can bond contacts of electronic components directly to each other without the need for solder. The bonding apparatus include a hermetically sealed processing chamber, a plurality of bases for holding at least two workpieces having respective bonding regions in the processing chamber, a gas inlet for introducing a processing gas to clean the bonding regions into the processing chamber, a pressure controller for controlling a predetermined pressure to be developed in the processing chamber, a heater for heating the workpieces in the processing chamber, and a bonding unit for pressing and bonding the bonding regions of the workpieces to each other in the processing chamber.
摘要翻译：接合装置可以将电子部件的触点彼此直接接合而不需要焊料。接合装置包括密封处理室，用于在处理室中保持具有各自的接合区域的至少两个工件的多个基座，用于引入处理气体以将接合区域引入处理室的气体入口，压力控制器用于控制处理室中要显影的预定压力，用于加热处理室中的工件的加热器，以及用于在处理室中将工件的接合区域彼此压合并粘合的接合单元。

8. 发明授权

US06627066B1 Method of measuring the concentration of a leveler in a plating liquid 有权
标题翻译：测量电镀液中矫正剂浓度的方法
公开(公告)号：US06627066B1
公开(公告)日：2003-09-30
申请号：US09830407
申请日：2001-04-27
申请人： Yasushi Isayama , Hiroyuki Ueyama , Hiroyuki Kaneko , Junitsu Yamakawa , Akihisa Hongo , Ryoichi Kimizuka , Megumi Maruyama
发明人： Yasushi Isayama , Hiroyuki Ueyama , Hiroyuki Kaneko , Junitsu Yamakawa , Akihisa Hongo , Ryoichi Kimizuka , Megumi Maruyama
IPC分类号： G01N2742
CPC分类号： C25D21/18 , C25D21/12 , C25D21/14
摘要： The concentration of a leveler in a plating liquid that is used by a plating apparatus for filling metal such as copper in interconnection trenches and holes defined in the surface of a semiconductor substrate or the like is determined based on a peak area (Ar value) in a peel-off region of the plating liquid measured according to a CV or CVS process.
摘要翻译：基于在半导体衬底等的表面中限定的互连沟槽和孔中的用于填充铜等金属的电镀装置所使用的电镀液中的矫顽剂的浓度基于根据CV或CVS工艺测量电镀液的剥离区域。

9. 发明授权

US06379520B1 Plating apparatus 有权
标题翻译：电镀装置
公开(公告)号：US06379520B1
公开(公告)日：2002-04-30
申请号：US09601084
申请日：2000-07-27
申请人： Fumio Kuriyama , Hiroyuki Ueyama , Junitsu Yamakawa , Kenichi Suzuki , Atsushi Chono
发明人： Fumio Kuriyama , Hiroyuki Ueyama , Junitsu Yamakawa , Kenichi Suzuki , Atsushi Chono
IPC分类号： C25D2112
CPC分类号： C25D21/14 , C25D17/001 , C25D21/16 , C25D21/18
摘要： The plating apparatus has a plating section in which a plating process is performed and a control section for regulating the plating solution. The plating section includes a plating bath containing plating solution, an anode provided in the plating solution, and a plating object serving as a cathode placed in the plating solution opposite the anode. The control section includes a regulating tank for regulating the composition and/or concentration of the plating solution, and a replenishing tank for injecting solution into the plating solution in the regulating tank. The plating apparatus also includes a mechanism for circulating plating solution between the regulating tank in the control section and the plating bath in the plating section. The plating section is installed in a first room, while the control section is installed in a second room, which is separate from the first room Accordingly, contamination in the plating section is prevented.
摘要翻译：电镀装置具有执行电镀处理的电镀部分和用于调节电镀液的控制部分。电镀部分包括含有电镀液的镀浴，设置在电镀液中的阳极，以及放置在与阳极相对的电镀溶液中的用作阴极的电镀对象。控制部分包括用于调节电镀溶液的组成和/或浓度的调节罐，以及用于将溶液注入调节罐中的电镀溶液的补充槽。电镀装置还包括用于在控制部分中的调节罐和电镀部分中的镀浴之间循环电镀液的机构。电镀部分安装在第一房间中，而控制部分安装在与第一房间分开的第二房间中。因此，防止了电镀部分中的污染。

10. 发明授权

US5166652A Bistable solenoid for use with a knitting machine 失效
标题翻译：用于使用针织机的耐用电磁铁
公开(公告)号：US5166652A
公开(公告)日：1992-11-24
申请号：US717586
申请日：1991-06-19
申请人： Yoshiteru Koyama , Hiroyuki Ueyama
发明人： Yoshiteru Koyama , Hiroyuki Ueyama
IPC分类号： D04B15/82 , D04B15/78 , H01F7/122 , H01F7/16
CPC分类号： D04B15/78 , H01F7/1615 , H01F2007/1669
摘要： A bistable solenoid for use with a knitting machine. The bistable solenoid includes an enclosure made of magnetic material which includes bearing surfaces at opposite ends. A plunger having a central region made of magnetic material and outer end regions made of non-magnetic material is movable within the enclosure for operation of a cam of a knitting machine. The movable plunger is controlled by axially aligned permanent magnets which are spaced from each other by a yoke. The permanent magnets are sandwiched between magnetizable coils which move the plunger toward the coil that is excited. The plunger is spaced radially from the coil's magnets and bearing so that very little wear is brought about during use in operating the cam of the knitting machine.
摘要翻译：一种用于针织机的双稳电磁铁。双稳态螺线管包括由磁性材料制成的外壳，其包括在相对端的轴承表面。具有由磁性材料制成的中心区域和由非磁性材料制成的外端区域的柱塞可在外壳内移动，以操作编织机的凸轮。可移动柱塞由轴对齐的永久磁铁控制，永磁体通过轭彼此间隔开。永磁体被夹在可激励的线圈之间，该线圈将柱塞朝向被激励的线圈移动。柱塞与线圈的磁体和轴承径向间隔开，从而在使用时在操作编织机的凸轮时产生很少的磨损。

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