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1. 发明申请

US20050145482A1 Apparatus and method for processing substrate 审中-公开
标题翻译：基板处理装置及方法
公开(公告)号：US20050145482A1
公开(公告)日：2005-07-07
申请号：US10973350
申请日：2004-10-27
申请人： Hidenao Suzuki , Koji Mishima , Hiroyuki Kanda , Kazufumi Nomura , Kunihito Ide , Kazuyuki Yahiro , Hiroshi Toyoda , Tetsuo Matsuda
发明人： Hidenao Suzuki , Koji Mishima , Hiroyuki Kanda , Kazufumi Nomura , Kunihito Ide , Kazuyuki Yahiro , Hiroshi Toyoda , Tetsuo Matsuda
IPC分类号： C25D7/12 , C25D17/00 , C25D17/06 , C25D21/10 , H01L21/288 , H01L21/3205 , H01L21/68 , H01L21/683
CPC分类号： H01L21/2885 , C25D7/123 , C25D17/001 , C25D17/06
摘要： An apparatus and a method for processing substrate are generally used for apparatuses for wet-type process of substrate, such as an electrolytic processing apparatus for use in forming interconnects by embedding a metal such as copper (Cu) or the like in fine interconnect patterns (recesses) that are formed in a substrate such as a semiconductor wafer and for use in forming bumps for electrical connections. The substrate processing apparatus includes: a substrate holder for holding a substrate; a first electrode for contacting the substrate to supply electricity to a processing surface of the substrate; a second electrode disposed so as to face the processing surface of the substrate held by the substrate holder; and a processing liquid supply section for supplying a processing liquid into the space between the processing surface of the substrate held by the substrate holder and the second electrode, wherein the substrate holder is designed to rotate the substrate during processing in such a manner that acceleration and slowdown and/or normal rotation and reverse rotation are repeated.
摘要翻译：用于处理衬底的装置和方法通常用于衬底的湿式处理装置，例如通过将金属（例如铜）（Cu）等嵌入到精细互连图案中而形成互连件的电解处理装置凹部），其形成在诸如半导体晶片的基板中，并且用于形成用于电连接的凸块。基板处理装置包括：用于保持基板的基板保持件; 第一电极，用于接触所述衬底以向所述衬底的处理表面供电; 第二电极，其设置成面对由所述基板保持器保持的所述基板的处理表面; 以及处理液体供应部分，用于将处理液体供应到由基板保持器保持的基板的处理表面与第二电极之间的空间中，其中基板保持器设计成在加工期间使基板旋转，重复减速和/或正常旋转和反向旋转。

2. 发明授权

US06269221B1 Liquid feed vaporization system and gas injection device 失效
公开(公告)号：US06269221B1
公开(公告)日：2001-07-31
申请号：US09662897
申请日：2000-09-15
申请人： Kuniaki Horie , Hidenao Suzuki , Tsutomu Nakada , Fumio Kuriyama , Takeshi Murakami , Masahito Abe , Yuji Araki , Hiroyuki Ueyama
发明人： Kuniaki Horie , Hidenao Suzuki , Tsutomu Nakada , Fumio Kuriyama , Takeshi Murakami , Masahito Abe , Yuji Araki , Hiroyuki Ueyama
IPC分类号： F22B2906
CPC分类号： C23C16/45565 , C23C16/448 , C23C16/45561 , C23C16/4557
摘要： A compact vaporizer system is presented to produce a high quality vapor feed from a liquid feed to be delivered to a chemical vapor deposition processing chamber to produce thin film devices based on highly dielectric or ferroelectric materials such as BaTiO3, SrTiO3 and other such materials. The vaporization apparatus comprises a feed tank for storing the liquid feed; feed delivery means for transporting the liquid feed by way of a feed delivery path; a vaporizer section disposed in the delivery path comprising a high temperature heat exchanger having a capillary tube for transporting the liquid feed and a heat source for externally heating the capillary tube; and a vaporization prevention section disposed upstream of the vaporizer section for preventing effects of the vaporizer section to the liquid feed within the vaporization prevention section.

3. 发明授权

US6053265A High ground-clearance hybrid track/wheel drive 失效
标题翻译：高离地间隙混合轨道/车轮驱动
公开(公告)号：US6053265A
公开(公告)日：2000-04-25
申请号：US354116
申请日：1999-07-15
申请人： Hidenao Suzuki , Ryohei Matsumoto
发明人： Hidenao Suzuki , Ryohei Matsumoto
IPC分类号： B62D55/06 , B62D55/075 , B62D55/084 , B62D51/06
CPC分类号： B62D55/0842 , B62D55/06 , B62D55/075
摘要： A rough-terrain vehicle employs separate track drives located on opposite sides of a vehicle body, like the wheels of a car. The tractor drives can revolve the track to permit track-driven travel. The drives can also halt the tracks relative to the drives and rotated the entire track drive that supports the track in which case the track drive rotates like a wheel. The latter mode provides an ability to traverse very rough surfaces. To provide high ground clearance, the support connecting the track drive to the vehicle body is located above the axis of rotation of the track drive. Almost the entire transmission mechanism for the track drive is confined to a volume enclosed by the loop of the track protecting it. The track drive supports the track on a polar array of wheels, each located along the line that divides the track into two loops.
摘要翻译：崎岖地形的车辆采用位于车身相对两侧的独立轨道驱动器，如汽车车轮。拖拉机驱动器可以旋转轨道，以允许轨道驱动的行驶。驱动器还可以相对于驱动器停止轨道并且旋转支撑轨道的整个轨道驱动器，在这种情况下，轨道驱动器像车轮一样旋转。后一种模式提供了穿过非常粗糙表面的能力。为了提供高的离地间隙，将轨道驱动器连接到车身的支撑件位于轨道驱动器的旋转轴线的上方。轨道驱动器的整个传输机构几乎都被限制在由保护它的轨道的环路所包围的体积上。轨道驱动器支持极地阵列阵列上的轨道，每个轨道沿着将轨道分成两个回路的线。

4. 发明授权

US5395474A Apparatus and method for etching semiconductor wafer 失效
标题翻译：用于蚀刻半导体晶片的装置和方法
公开(公告)号：US5395474A
公开(公告)日：1995-03-07
申请号：US268547
申请日：1994-07-06
申请人： Hidenao Suzuki , Tatsuya Nishimura , Yoshio Hatada
发明人： Hidenao Suzuki , Tatsuya Nishimura , Yoshio Hatada
IPC分类号： H01L21/302 , H01J37/02 , H01L21/3065 , H01L21/311 , H01L21/3213 , C23F1/02
CPC分类号： H01L21/3065 , H01J37/026 , H01L21/31116 , H01L21/32136
摘要： A semiconductor wafer etching apparatus is capable of anisotropically etching a large-diameter semiconductor wafer with high accuracy without causing the semiconductor wafer to be charged. First, the apparatus cools the wafer in an atmosphere of a nitrogen or a halogen gas so that the wafer adsorbs and is covered by atoms of the gas. Then, a fast atom beam source of the apparatus generates an electrically neutral fast atom beam of gas atoms or molecules to etch the semiconductor wafer. The etching speed is promoted by an interaction of the adsorbed atoms and the fast atom beam.
摘要翻译：半导体晶片蚀刻装置能够高精度地各向异性地蚀刻大直径半导体晶片，而不会导致半导体晶片被充电。首先，该装置在氮气或卤素气体的气氛中冷却晶片，使得晶片吸附并被气体的原子覆盖。然后，该装置的快速原子束源产生气体原子或分子的电中性的快速原子束以蚀刻半导体晶片。蚀刻速度通过吸附原子和快原子束的相互作用来促进。

5. 发明申请

US20120193865A1 Recording Apparatus 有权
标题翻译：录音设备
公开(公告)号：US20120193865A1
公开(公告)日：2012-08-02
申请号：US13360871
申请日：2012-01-30
申请人： Sanshiro Takeshita , Takehiko Saito , Hidenao Suzuki , Hiroyuki Yoda
发明人： Sanshiro Takeshita , Takehiko Saito , Hidenao Suzuki , Hiroyuki Yoda
IPC分类号： B65H1/02
CPC分类号： B41J13/106
摘要： A recording apparatus includes a holding unit that holds a recorded recording medium in a standing posture, a roller that sends the recording medium to the holding unit, and a restricting unit that restricts the position of the recording medium not to be in contact with the roller.
摘要翻译：记录装置包括：保持单元，其以立式姿势保持记录的记录介质;将记录介质发送到保持单元的辊;以及限制单元，其限制不与辊接触的记录介质的位置。

6. 发明申请

US20120193864A1 Recording Apparatus 有权
标题翻译：录音设备
公开(公告)号：US20120193864A1
公开(公告)日：2012-08-02
申请号：US13360943
申请日：2012-01-30
申请人： Hiroyuki Yoda , Takehiko Saito , Sanshiro Takeshita , Hidenao Suzuki
发明人： Hiroyuki Yoda , Takehiko Saito , Sanshiro Takeshita , Hidenao Suzuki
IPC分类号： B65H1/02
CPC分类号： B65H1/027 , B41J29/02 , B41J29/023 , B41J29/026 , B65H3/0607 , B65H31/22 , B65H2301/4213 , B65H2301/4214 , B65H2301/51256 , B65H2402/46 , B65H2404/1115 , B65H2404/1531 , B65H2405/20 , B65H2405/31 , B65H2405/33125 , B65H2405/3322
摘要： A recording apparatus includes a recording section that performs recording on a recording medium, a housing that stores the recording section, a recording medium cassette that is detachably mounted on the housing and has a cassette body that holds the recording medium in the vertical position, and a holder that holds the recording medium that has been fed from the cassette body and has been recorded in the recording section on the outer surface of the cassette body in the vertical position.
摘要翻译：一种记录装置，包括：记录介质，记录介质的存储部分;存储记录部分的壳体;可拆卸地安装在壳体上并具有将记录介质保持在垂直位置的盒体的记录介质盒;以及保持器，其保持已经从盒体馈送并已被记录在盒体的外表面上的记录部分中的垂直位置的记录介质。

7. 发明申请

US20090045067A1 Apparatus and method for processing a substrate 审中-公开
标题翻译：用于处理衬底的装置和方法
公开(公告)号：US20090045067A1
公开(公告)日：2009-02-19
申请号：US12232516
申请日：2008-09-18
申请人： Koji Mishima , Kunihito Ide , Hidenao Suzuki , Kazufumi Nomura , Hiroyuki Kanda
发明人： Koji Mishima , Kunihito Ide , Hidenao Suzuki , Kazufumi Nomura , Hiroyuki Kanda
IPC分类号： C25D5/02 , C25D17/10 , C25D21/12
CPC分类号： C25D17/002 , C25D17/001 , C25D21/04 , H01L21/2885
摘要： A method and apparatus are set forth capable of processing a substrate with a high uniformity within the surface area even for a thin feeding layer. The method comprises arranging a counter electrode and the substrate to confront each other; providing a membrane between the counter electrode and the substrate to define a substrate side region and a counter electrode side region. The substrate side region and the counter electrode side region are capable of accommodating respective electrolytes. The substrate side region and the counter electrode side region are supplied with respective electrolytes having different specific resistances. A processing current is also supplied between the substrate and the counter electrode.
摘要翻译：提出了一种方法和装置，即使对于薄的进料层，也能够在表面积内处理高均匀性的基板。该方法包括布置对置电极和基板以彼此面对; 在对电极和基板之间提供膜以限定基板侧区域和对电极侧区域。基板侧区域和对置电极侧区域能够容纳各种电解质。向基板侧区域和对电极侧区域供给具有不同比电阻的各电解质。在基板和对置电极之间也提供处理电流。

8. 发明申请

US20060086616A1 Plating apparatus and plating method 失效
标题翻译：电镀装置及电镀方法
公开(公告)号：US20060086616A1
公开(公告)日：2006-04-27
申请号：US11245490
申请日：2005-10-07
申请人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Shinya Morisawa , Junji Kunisawa , Kunihito Ide , Hidenao Suzuki , Emanuel Cooper , Philippe Vereecken , Brett Baker-O' Neal , Hariklia Deligianni
发明人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Shinya Morisawa , Junji Kunisawa , Kunihito Ide , Hidenao Suzuki , Emanuel Cooper , Philippe Vereecken , Brett Baker-O' Neal , Hariklia Deligianni
IPC分类号： C25D21/12 , C25B15/00
CPC分类号： C25D5/22 , C25D5/18 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/004 , C25D17/005 , C25D17/12 , C25D21/12 , H01L21/2885 , H01L21/7684 , H01L21/76849 , H01L21/76877
摘要： A plating apparatus can securely carry out a flattening plating of a substrate to form a plated film having a flat surface without using a costly mechanism, and without applying an extra plating to the substrate. The plating apparatus includes a substrate holder; a cathode section having a seal member for watertightly sealing a peripheral portion of the substrate, and a cathode electrode for supplying an electric current to the substrate; an anode disposed in a position facing the surface of the substrate; a porous member disposed between the anode and the surface of the substrate; a constant-voltage control section for controlling a voltage applied between the cathode electrode and the anode at a constant value; and a current monitor section for monitoring an electric current flowing between the cathode electrode and the anode, and feeding back a detection signal to the constant-voltage control section.
摘要翻译：电镀装置可以可靠地进行基板的平坦化镀以形成具有平坦表面的镀膜而不使用昂贵的机构，并且不对基板施加额外的电镀。电镀装置包括：基板支架; 具有用于水密密封基板的周边部分的密封部件的阴极部分和用于向基板供给电流的阴极电极; 设置在面向所述基板的表面的位置的阳极; 设置在所述阳极和所述基板的表面之间的多孔构件; 恒定电压控制部分，用于以恒定值控制在所述阴极和所述阳极之间施加的电压; 以及电流监视部分，用于监视在阴极和阳极之间流动的电流，并将检测信号反馈到恒压控制部分。

9. 发明申请

US20050164498A1 Plating method and plating apparatus 有权
标题翻译：电镀方法和电镀装置
公开(公告)号：US20050164498A1
公开(公告)日：2005-07-28
申请号：US10989658
申请日：2004-11-17
申请人： Kunihito Ide , Koji Mishima , Hiroyuki Kanda , Hidenao Suzuki , Kazufumi Nomura
发明人： Kunihito Ide , Koji Mishima , Hiroyuki Kanda , Hidenao Suzuki , Kazufumi Nomura
IPC分类号： C25D3/38 , C25D7/12 , H01L21/288 , H01L21/44 , H01L21/768
CPC分类号： C25D17/001 , C25D3/38 , C25D7/123 , H01L21/2885
摘要： A plating method is capable of depositing a plated film having excellent in-plane uniformity with respect to a thin seed layer and excellent embeddability with respect to fine damascene structures. The plating method including: positioning an electric resistor between a conductive layer formed on at least a portion of a surface of the substrate and an anode; introducing respectively a plating solution into a space between the conductive layer and the anode on the conductive layer side, and an anode solution into the space between the conductive layer and the anode on the anode side, thereby filling the space with a plating bath composed of the plating solution and the anode solution, the plating solution containing 25 to 75 g/L of copper ions and 0.4 mole/L or more of an organic acid or an inorganic acid, and the anode solution being of the same composition as said plating solution, or containing 0 to 75 g/L of copper ions and 0.6 mole/L or less of an organic acid or an inorganic acid; and applying a voltage between the conductive layer and the anode to plate a surface of the conductive layer.
摘要翻译：电镀方法能够沉积相对于薄种子层具有优异的面内均匀性的电镀膜，并且相对于细的镶嵌结构具有优异的嵌入性。电镀方法包括：在形成在基板表面的至少一部分上的导电层和阳极之间定位电阻器; 在导电层侧的导电层和阳极之间的空间中分别引入电镀液，将阳极溶液引入到阳极侧的导电层和阳极之间的空间中，由此填充由电镀液和阳极溶液，含有25〜75g / L的铜离子和0.4mol / L以上的有机酸或无机酸的电镀液，所述阳极溶液与所述电镀液的组成相同，或含有0〜75g / L的铜离子和0.6摩尔/ L以下的有机酸或无机酸; 以及在所述导电层和所述阳极之间施加电压以对所述导电层的表面进行平板化。

10. 发明授权

US6116267A Valving device 失效
标题翻译：阀门装置
公开(公告)号：US6116267A
公开(公告)日：2000-09-12
申请号：US172146
申请日：1998-10-14
申请人： Hidenao Suzuki , Kuniaki Horie , Kiwamu Tsukamoto , Yuji Araki
发明人： Hidenao Suzuki , Kuniaki Horie , Kiwamu Tsukamoto , Yuji Araki
IPC分类号： F16K7/17 , F16K41/10 , F16K41/12 , F16K49/00
CPC分类号： F16K41/12 , F16K41/10 , F16K49/005 , Y10T137/6579
摘要： A valving device can operate stably to provide switching or flow rate control operations, even when it is used for controlling thermodynamically unstable gases. The valving device including a valve casing having an internal passage for process fluids. A valve body is movable against a valve seat for adjusting opening of the internal passage, and a valve driving mechanism can drive the valve body. A flexible member is provided for separating a fluid handling space including the internal passage from a valve mechanism space for housing the valve driving mechanism. A thermal medium space is formed within the valve mechanism space for receiving a thermal medium for providing heat to the valve body.
摘要翻译：即使用于控制热力学不稳定的气体，阀门装置也可以稳定运行，以提供切换或流量控制操作。阀装置包括具有用于处理流体的内部通道的阀壳体。阀体可以抵靠阀座移动，用于调节内部通道的开口，阀驱动机构可以驱动阀体。提供了一种柔性构件，用于将包括内部通道的流体处理空间与用于容纳阀驱动机构的阀机构空间分离。在阀机构空间内形成有热介质空间，用于接收用于向阀体提供热量的热介质。

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