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    • 1. 发明授权
    • Etching method and composition for forming etching protective layer
    • 用于形成蚀刻保护层的蚀刻方法和组合物
    • US07141177B2
    • 2006-11-28
    • US10487658
    • 2002-09-04
    • Hatsuyuki Tanaka
    • Hatsuyuki Tanaka
    • B44C1/22
    • H01L21/32139G03F7/40H01L21/0274H01L21/3081H01L21/31144
    • This invention offers a method to improve-etching resistance of etching mask upon etching comprising steps of forming a pattern on a substrate by using photoresist, applying a composition for forming an etching protection layer containing water-soluble or water-dispersible resin, crosslinking agent and water and/or water-soluble organic solvent as a solvent, forming etching protection layer which is insoluble in a developer containing water in the interface between a composition for forming an etching protection layer and a photoresist by heating, removing by a developer unnecessary area excluding etching protection layer made of a composition for forming an etching protection layer, and treating a substrate by etching using photoresist pattern as a mask.
    • 本发明提供了一种提高蚀刻掩模在蚀刻时的耐蚀性的方法,包括以下步骤:通过使用光致抗蚀剂在基片上形成图案,施加用于形成含有水溶性或水分散性树脂的蚀刻保护层的组合物,交联剂和 水和/或水溶性有机溶剂作为溶剂,在加热下形成蚀刻保护层的组合物和光刻胶之间的界面中形成不溶于含水显影剂的蚀刻保护层,除去由显影剂排出的不需要的区域 由用于形成蚀刻保护层的组合物制成的蚀刻保护层,以及使用光致抗蚀剂图案作为掩模的蚀刻来处理基板。
    • 6. 发明授权
    • Method for rinse treatment of a substrate
    • 冲洗处理基材的方法
    • US4824762A
    • 1989-04-25
    • US67313
    • 1987-06-26
    • Masakazu KobayashiShingo AsaumiHatsuyuki Tanaka
    • Masakazu KobayashiShingo AsaumiHatsuyuki Tanaka
    • H01L21/30G03C11/00G03F7/00G03F7/26G03F7/42H01L21/027H01L21/461G03C11/12G03C5/00
    • G03F7/425
    • The improvement of the invention consists in the use of a specific ether compound, e.g., diethyleneglycol monomethyl, monoethyl and monobutyl ethers, dipropyleneglycol monomethyl and monoethyl ethers, triethyleneglycol monomethyl and monoethyl ethers and tripropyleneglycol monomethyl ether, as a rinse solvent for a substrate from which the pattern photoresist layer has been removed with a remover solution in the photolithographic processing of semiconductor devices. The rinse solvent is free from the problems in the toxicity to human body and environment pollution relative to waste disposal as well as the danger of fire. The rinse solvent is versatile to be applicable to both of the negative- and positive-working photoresist compositions. Further advantages are obtained by adding an aliphatic amine compound to the rinse solvent.
    • 本发明的改进在于使用特定的醚化合物,例如二甘醇单甲基,单乙基和单丁基醚,二丙二醇单甲基和单乙基醚,三乙二醇单甲基和单乙基醚和三丙二醇单甲醚作为底物的漂洗溶剂, 在半导体器件的光刻处理中,用去除剂溶液除去图案光致抗蚀剂层。 冲洗溶剂没有相对于废物处理对人体的毒性和环境污染的问题以及火灾的危险。 漂洗溶剂是通用的,适用于负性和正性光致抗蚀剂组合物。 通过向漂洗溶剂中加入脂族胺化合物可获得进一步的优点。
    • 8. 发明授权
    • Method for forming pattern and treating agent for use therein
    • 用于形成图案和处理剂的方法
    • US07018785B2
    • 2006-03-28
    • US10416412
    • 2001-10-24
    • Kazuyo OnoYusuke TakanoHatsuyuki TanakaSatoru Funato
    • Kazuyo OnoYusuke TakanoHatsuyuki TanakaSatoru Funato
    • G03F7/00
    • G03F7/0382G03F7/0392G03F7/168
    • A method of forming resist patterns comprises the steps of (a) applying and forming a chemically amplified photoresist film, (b) applying a treating agent with a pH value of 1.3 to 4.5 onto said chemically amplified photoresist film, (c) baking said chemically amplified photoresist film after at least one of the steps of applying and forming said chemically amplified photoresist film and applying said treating agent, (d) selectively exposing said chemically amplified photoresist film, (e) post exposure-baking said chemically amplified photoresist film, and (f) developing said chemically amplified photoresist film, wherein the contact angle of a non-exposed portion of said chemically amplified photoresist film to a developing solution after wash with water to remove the treating agent on the photoresist and spin-drying before development is made lower by 10° to 110° than that in the case where said treating agent is not applied. In this method, the wetting property of the developing solution to the photoresist film are improved and the influence of floating basic species are reduced by the action of an acid component such as organic acid contained in the treating agent to form resist patterns with good shape.
    • 形成抗蚀剂图案的方法包括以下步骤:(a)施加和形成化学放大的光致抗蚀剂膜,(b)将pH值为1.3至4.5的处理剂施加到所述化学放大的光致抗蚀剂膜上,(c) 在施加和形成所述化学放大光致抗蚀剂膜并施加所述处理剂的步骤中的至少一个步骤之后,(d)选择性地暴露所述化学放大的光致抗蚀剂膜,(e)曝光后曝光烘烤所述化学放大的光致抗蚀剂膜,以及 (f)显影所述化学放大型光致抗蚀剂膜,其中使用所述化学放大的光致抗蚀剂膜的未曝光部分与水洗涤后的显影溶液的接触角,以除去光刻胶上的处理剂并在显影前进行旋转干燥 比不使用所述处理剂的情况低10°〜110°。 在该方法中,改善了显影液对光致抗蚀剂膜的润湿性能,并且由于处理剂中所含的有机酸等酸成分的作用,漂浮的碱性物质的影响降低,形成具有良好形状的抗蚀剂图案。
    • 9. 发明授权
    • Developer solution for photoresist composition
    • 光致抗蚀剂组合物的显影剂溶液
    • US5985525A
    • 1999-11-16
    • US127640
    • 1993-09-28
    • Mitsuru SatoHatsuyuki TanakaToshimasa Nakayama
    • Mitsuru SatoHatsuyuki TanakaToshimasa Nakayama
    • G03F7/32H01L21/027H01L21/30G03C5/00
    • G03F7/322
    • Proposed is an aqueous developer solution for an alkali-developable photoresist composition which contains, besides a water-soluble organic basic compound such as tetramethyl ammonium hydroxide and an anionic or non-ionic surface active agent as conventional ingredients in the prior art developwer solutions, an inorganic ammonium salt such as ammonium sulfate, ammonium phosphates and ammonium borates in a limited amount. By virtue of this unique additive, the developer solution is advantageous in respect of the absence of any scums on the patterned resist layer obtained by the development treatment therewith as well as quite good orthogonality in the cross sectional profile of line-patterned resist layer in addition to the greatly improved latitude in the light exposure dose and range of focusing depth in the light-exposure process of the resist layer with ultraviolet light.
    • 提出了一种用于碱显影光致抗蚀剂组合物的水性显影剂溶液,其除了水溶性有机碱性化合物如四甲基氢氧化铵和阴离子或非离子表面活性剂外,还含有现有技术的开发溶液中的常规成分, 无机铵盐如硫酸铵,磷酸铵和硼酸铵。 由于这种独特的添加剂,显影剂溶液在通过其显影处理获得的图案化抗蚀剂层上不存在任何浮渣以及线图案化抗蚀剂层的横截面轮廓中的相当好的正交性方面是有利的 在抗紫外线的光曝光过程中的曝光剂量和聚焦深度的范围大大提高。