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    • 2. 发明授权
    • Method for forming pattern and treating agent for use therein
    • 用于形成图案和处理剂的方法
    • US07018785B2
    • 2006-03-28
    • US10416412
    • 2001-10-24
    • Kazuyo OnoYusuke TakanoHatsuyuki TanakaSatoru Funato
    • Kazuyo OnoYusuke TakanoHatsuyuki TanakaSatoru Funato
    • G03F7/00
    • G03F7/0382G03F7/0392G03F7/168
    • A method of forming resist patterns comprises the steps of (a) applying and forming a chemically amplified photoresist film, (b) applying a treating agent with a pH value of 1.3 to 4.5 onto said chemically amplified photoresist film, (c) baking said chemically amplified photoresist film after at least one of the steps of applying and forming said chemically amplified photoresist film and applying said treating agent, (d) selectively exposing said chemically amplified photoresist film, (e) post exposure-baking said chemically amplified photoresist film, and (f) developing said chemically amplified photoresist film, wherein the contact angle of a non-exposed portion of said chemically amplified photoresist film to a developing solution after wash with water to remove the treating agent on the photoresist and spin-drying before development is made lower by 10° to 110° than that in the case where said treating agent is not applied. In this method, the wetting property of the developing solution to the photoresist film are improved and the influence of floating basic species are reduced by the action of an acid component such as organic acid contained in the treating agent to form resist patterns with good shape.
    • 形成抗蚀剂图案的方法包括以下步骤:(a)施加和形成化学放大的光致抗蚀剂膜,(b)将pH值为1.3至4.5的处理剂施加到所述化学放大的光致抗蚀剂膜上,(c) 在施加和形成所述化学放大光致抗蚀剂膜并施加所述处理剂的步骤中的至少一个步骤之后,(d)选择性地暴露所述化学放大的光致抗蚀剂膜,(e)曝光后曝光烘烤所述化学放大的光致抗蚀剂膜,以及 (f)显影所述化学放大型光致抗蚀剂膜,其中使用所述化学放大的光致抗蚀剂膜的未曝光部分与水洗涤后的显影溶液的接触角,以除去光刻胶上的处理剂并在显影前进行旋转干燥 比不使用所述处理剂的情况低10°〜110°。 在该方法中,改善了显影液对光致抗蚀剂膜的润湿性能,并且由于处理剂中所含的有机酸等酸成分的作用,漂浮的碱性物质的影响降低,形成具有良好形状的抗蚀剂图案。
    • 3. 发明授权
    • Composition for reflection reducing coating
    • 防反射涂层用组合物
    • US06309789B1
    • 2001-10-30
    • US09485087
    • 2000-05-25
    • Yusuke TakanoHatsuyuki TanakaKiyofumi TakanoYutaka Hashimoto
    • Yusuke TakanoHatsuyuki TanakaKiyofumi TakanoYutaka Hashimoto
    • G03F7004
    • C09D5/00G03F7/091
    • The anti-reflective coating composition comprising at least perfluoroalkylsulfonic acid (A) represented by the general formula: CnF2n+1SO3H (n is an integer of 4 to 8), organic amine (B), water-soluble polymer (C), perfluoroalkyl sulfonamide (D) represented by the general formula: CnF2n+1SO2NH2 (n is an integer of 1 to 8) and water (E) and having a pH value of 1.3 to 3.3 is applied onto a photoresist film formed on a substrate, thus forming an anti-reflective coating. The photoresist and anti-reflective coating are then exposed to light and developed to give a resist pattern. The coating composition can form a uniform anti-reflective coating free of standing wave, multiple reflection, T-top and PED (Post Exposure Delay) in a small amount of drip onto any types of resists regardless of the surface shape of a substrate.
    • 所述抗反射涂料组合物至少包含由以下通式表示的全氟烷基磺酸(A):CnF2n + 1SO3H(n为4〜8的整数),有机胺(B),水溶性聚合物(C),全氟烷基磺酰胺 (D)由CnF2n + 1SO2NH2(n为1〜8的整数)和水(E)表示,pH值为1.3〜3.3的物质涂布到形成在基板上的光致抗蚀剂膜上,形成 防反射涂层。 然后将光致抗蚀剂和抗反射涂层曝光并显影以得到抗蚀剂图案。 涂料组合物可以形成均匀的抗反射涂层,无需驻留波,多重反射,T顶和PED(Post Exposure Delay),少量滴落到任何类型的抗蚀剂上,而不管基材的表面形状如何。