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1. 发明申请

WO1992019091A1 PROCESS FOR THE METALLIZATION OF NON-CONDUCTORS, IN PARTICULAR CIRCUIT BOARDS, AND THE USE OF NITROGEN-CONTAINING QUATERNARY SALTS IN THE PROCESS 审中-公开
标题翻译：非导体金属化，特殊电路板的使用和含氮含量季铵盐在工艺过程中的应用
公开(公告)号：WO1992019091A1
公开(公告)日：1992-10-29
申请号：PCT/DE1992000311
申请日：1992-04-13
申请人： SCHERING AKTIENGESELLSCHAFT , GRAPENTIN, Hans-Joachim , NATUSCH, Andreas , TIEMANN, Norbert
发明人： SCHERING AKTIENGESELLSCHAFT
IPC分类号： H05K03/42
CPC分类号： H05K3/424 , C25D5/54 , H05K3/427 , H05K2201/0329 , H05K2203/0796 , H05K2203/122
摘要： Described is a process for the metallization of non-conductors, and the use of monomeric or polymeric nitrogen-containing quaternary salts or chelating agents in the process.

2. 发明申请

WO1997014282A1 METHOD OF PLATING THROUGH HOLES OF A PRINTED CIRCUIT BOARD 审中-公开
标题翻译：印刷电路板通孔的方法
公开(公告)号：WO1997014282A1
公开(公告)日：1997-04-17
申请号：PCT/IB1996001048
申请日：1996-10-04
申请人： PHILIPS ELECTRONICS N.V. , PHILIPS NORDEN AB
发明人： PHILIPS ELECTRONICS N.V. , PHILIPS NORDEN AB , FRIEND, Stephen, D., E., J. , ROBERTS, John, W., J., W.
IPC分类号： H05K03/42
CPC分类号： H05K3/428 , H05K3/243 , H05K3/28 , H05K2201/09909 , H05K2203/0571 , H05K2203/058 , H05K2203/072
摘要： Through holes (18) of a printed circuit board (10, 12) are plated by electroless metal deposition. A plating mask (22) has openings (24) which are larger than the conductive areas (19) around the through holes. Shielding portions (28), which may be of a solder resist material, prevent undesired deposition of metal on the substrate (10) and can be accurately positioned by screen printing.
摘要翻译：通过无电金属沉积对印刷电路板（10,12）的通孔（18）进行电镀。电镀掩模（22）具有比通孔周围的导电区域（19）大的开口（24）。可以是阻焊材料的屏蔽部分（28）防止金属在基板（10）上的不希望的沉积，并且可以通过丝网印刷被精确地定位。

3. 发明申请

WO1996021341A1 METHOD AND DEVICE FOR THE TREATMENT OF PLATE-SHAPED WORKPIECES HAVING SMALL HOLES 审中-公开
标题翻译：对于FINEST HOLES处理方法及装置标明板形状的工件
公开(公告)号：WO1996021341A1
公开(公告)日：1996-07-11
申请号：PCT/DE1995000029
申请日：1995-01-05
申请人： HÜBEL, Egon , HENIG, Hans
发明人： HÜBEL, Egon
IPC分类号： H05K03/42
CPC分类号： C25D21/10 , H05K3/0088 , Y10S134/902
摘要： The treatment of plate-shaped workpieces (3), in particular circuit boards, with small holes (2) by means of liquid or gaseous agents has been found to be difficult since the fluid flows through the holes (2) only at very low speeds, particularly if the ratio of hole diameter to hole length is very small, thus preventing adequate movement of fluid through the hole. The invention calls for this problem to be solved by causing the workpiece (3), held in a horizontal position, to carry out a composite motion made up of a first, continuous and/or periodic sliding movement along a horizontal path and a second movement consisting of vigorous vibrational oscillations, the two movements being produced independently of each other. The device used to carry out the method includes means for holding the workpieces (3) in a horizontal position and for sliding them continuously and/or periodically along a horizontal path and means for imparting vigourous pulsating movements to the workpieces, plus means for bringing the workpieces in contact with the treatment agent.
摘要翻译：设置有微细孔（2）的板状工件（3），尤其是印刷电路板，通过液体或气体处理剂的装置已经证明是困难的治疗中，由于在特定的细孔（2）当这些孔的直径与长度的比率是非常小的，在非常低的速度流过只，使得足够的传质更为得到保证。根据本发明，该问题是由在其中工件位于一个水平的操作位置的方法来解决（3）被设置成组合运动，其从第一连续延伸和/或周期性地间断地滑动运动在水平延伸的传送路径和的第二组成的，由剧烈振动振荡运动，这两种运动是彼此独立的，可以预先确定。用于实施该方法的装置包括，一个装置，用于在水平的操作位置检测的工件（3）和用于连续地和/或周期性地间断地滑动运动在水平延伸的传送路径和在另一方面用于将所述工件移位到剧烈脉动运动和装置在用于工件与所述处理剂接触。

4. 发明申请

WO1997002727A1 METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD 审中-公开
标题翻译：制造印刷电路板的方法
公开(公告)号：WO1997002727A1
公开(公告)日：1997-01-23
申请号：PCT/EP1995002634
申请日：1995-07-06
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , IBM SEMEA S.P.A. , MAZZONI, Roberto , MONZANI, Adelio , SIRTORI, Vittorio
发明人： INTERNATIONAL BUSINESS MACHINES CORPORATION , IBM SEMEA S.P.A.
IPC分类号： H05K03/42
CPC分类号： H05K3/3473 , H05K3/243 , H05K3/3489 , H05K3/428 , H05K2203/0485 , H05K2203/0542 , Y10T29/49144
摘要： A method of manufacturing a printed circuit board including the step of selectively electroplating a high thick solder (340) onto selected conductive projections (230). The selective electrodeposition is performed by electroless applying a conductive layer (310) onto the board (100), previously provided with circuit conductors (220) and conductive projections (230), providing a high thick insulating mask (320) onto the conductive layer (310) leaving exposed the selected conductive projections (230) and electroplating the high thick solder (340). The method of manufacturing an electronic card by surface mounting of components (SMT) onto the printed circuit board (100) obtainable by the above-described method further includes the step of dispensing a flux, preferably a no clean flux dispensed by syringe, onto the board (100), avoiding the solder paste or adhesive screening.
摘要翻译：一种制造印刷电路板的方法，包括将高厚度焊料（340）选择性地电镀到选定的导电突起（230）上的步骤。通过将预先设置有电路导体（220）和导电突起（230）的导电层（310）化学镀在基板（100）上来进行选择性电沉积，在导电层上提供高厚度的绝缘掩模（320） 310），使所选择的导电突起（230）暴露并且电镀高厚度焊料（340）。通过将组件（SMT）表面安装到通过上述方法获得的印刷电路板（100）上制造电子卡的方法还包括将助熔剂（优选地，由注射器分配的无清洁的焊剂）分配到板（100），避免焊膏或粘合剂的筛选。

5. 发明申请

WO1995015674A1 METHOD OF MAKING A PRINTED CIRCUIT BOARD 审中-公开
标题翻译：制作印刷电路板的方法
公开(公告)号：WO1995015674A1
公开(公告)日：1995-06-08
申请号：PCT/GB1994002651
申请日：1994-12-02
申请人： KNOPP, John, Frederick, David
IPC分类号： H05K03/42
CPC分类号： H05K3/428 , H05K2201/0344 , H05K2203/0565 , H05K2203/0723
摘要： A method of making a plate through hole printed circuit board, comprises the steps of: a) forming conductive circuit elements (10) on two opposed faces of a paper phenolic containing substrate (11); b) coating the substrate and circuit elements with a de-sensitising material (12); c) forming holes (13) through the substrate, each hole passing through a circuit element on each of the opposed faces of the board; d) treating the board to render the substrate exposed in the holes receptive to the action of a metallic plating solution; e) removing the de-sensitising material; f) printing an acid-resist mask (14) on to both faces of the board, the mask leaving exposed only a small area of the board surrounding each hole therethrough; and g) treating the board with an electroless nickel-plating solution to deposit nickel (15) in the holes to the desired thickness to provide an electrical connection through each hole between two opposed conductive circuit elements.
摘要翻译：一种制造板状通孔印刷电路板的方法，包括以下步骤：a）在含酚醛树脂基材（11）的两个相对的面上形成导电电路元件（10）; b）用去敏材料（12）涂覆基板和电路元件; c）通过所述基板形成孔（13），每个孔穿过所述板的每个相对面上的电路元件; d）处理板以使基板暴露于容纳金属电镀液的作用的孔中; e）去除去敏材料; f）将抗酸剂掩模（14）印刷在板的两个面上，掩模仅使围绕每个孔的板的小面积露出; 和g）用无电镀镍溶液处理该板，以将镍（15）沉积在所述孔中以达到所需厚度，从而通过两个相对的导电电路元件之间的每个孔提供电连接。

6. 发明申请

WO1993026145A1 METHOD OF MAKING A PRINTED CIRCUIT BOARD 审中-公开
标题翻译：制作印刷电路板的方法
公开(公告)号：WO1993026145A1
公开(公告)日：1993-12-23
申请号：PCT/GB1993001152
申请日：1993-06-01
申请人： KNOPP, John, Frederick, David
IPC分类号： H05K03/42
CPC分类号： H05K3/428 , H05K2201/0344 , H05K2203/0565 , H05K2203/0723 , H05K2203/1383
摘要： A method of making a plate through hole printed circuit board, comprises the steps of: a) forming conductive circuit elements (20) on two opposed faces of a non-conductive substrate (21); b) coating the substrate and circuit elements with a de-sensitising material (22); c) forming holes (23) through the substrate, each hole passing through a circuit element on each of the opposed faces of the board; d) treating the board to render the substrate exposed in the holes receptive to the action of a metallic plating solution; e) removing the de-sensitising material; and f) treating the board with a metallic plating solution to deposit conductive metal (24) in the holes to the desired thickness to provide an electrical connection through each hole between two opposed conductive circuit elements. This may be in two stages, with an initial thin layer of copper being deposited, followed by a main layer of nickel to the desired thickness.
摘要翻译：一种制造板状通孔印刷电路板的方法，包括以下步骤：a）在非导电衬底（21）的两个相对面上形成导电电路元件（20）; b）用去敏材料（22）涂覆基底和电路元件; c）通过基板形成孔（23），每个孔穿过板的每个相对面上的电路元件; d）处理板以使基板暴露于容纳金属电镀液的作用的孔中; e）去除去敏材料; 以及f）用金属电镀液处理所述板，以将所述孔中的导电金属（24）沉积到所需厚度，以提供通过两个相对的导电电路元件之间的每个孔的电连接。这可以分为两个阶段，初始薄层的铜被沉积，随后是主层的镍到所需的厚度。

7. 发明申请

WO1991003920A2 PLATED-THROUGH PRINTED CIRCUIT BOARD WITH RESIST AND PROCESS FOR PRODUCING IT 审中-公开
标题翻译：通过电阻印刷电路板和生产IT的过程
公开(公告)号：WO1991003920A2
公开(公告)日：1991-03-21
申请号：PCT/EP1990001326
申请日：1990-08-11
申请人： BLASBERG-OBERFLÄCHENTECHNIK GMBH , HUPE, Jürgen , KRONENBERG, Walter
发明人： BLASBERG-OBERFLÄCHENTECHNIK GMBH
IPC分类号： H05K03/42
CPC分类号： H05K3/424 , C08G61/123 , H05K3/108 , H05K3/4038 , H05K3/427 , H05K2201/0329 , H05K2203/0796 , H05K2203/107 , H05K2203/122 , H05K2203/1415 , Y10T29/49144 , Y10T29/49165 , Y10T428/24322 , Y10T428/24802 , Y10T428/24917 , Y10T428/31
摘要： In a process for producing plated-through single- or multi-layered printed circuit boards comprising a polymer base or ceramic which is coated, possibly on both sides, with at least one photoresist layer which temporarily exposes the electrically conductive circuit pattern, a metallic layer is deposited electrolytically or non-electrolytically on the surfaces of the base, including those which are not coated with a conducive metallic layer. The process is characterized in that (a) the surface of the base is drilled, subjected to a mechanical surface treatment, laminated with a suitable photoresist, illuminated and developed, in order to expose the circuit pattern, (b) the surfaces of the base are pretreated in an oxidizing solution, (c) the solvent residues are rinsed off the base, which is then placed in a solution containing a heterocyclic monomer, in particular pyrrol, thiophene, furan or their derivatives, which in polymer form is electrically conductive, (d) the base is then placed in an acidic solution in which an electrically conductive polymer layer is formed, the solvent residues are rinsed off, and the drilled holes and circuit pattern are metallized preferably electrolytically or non-electrolytically.
摘要翻译：在生产金属化孔单或多层印刷电路板的方法中，该印刷电路板包括任选在两侧涂覆有聚合物基体或陶瓷的至少一层光致抗蚀剂，其暂时暴露导电电路中，金属层电解或电解沉积在基底的表面上，包括没有涂覆导电金属层的表面。该方法的特征在于在基座的是：（a）表面被钻孔，进行机械表面处理，层压有合适的光致抗蚀剂的层，照射并显影以暴露所述电路图案，（二）基体表面在氧化溶液预处理，（C）中的溶剂残基被从通过漂洗，基中，然后放置在含杂环单体的溶液，包括吡咯，噻吩，呋喃，或它们的除去衍生物，其以聚合物形式是导电的，（d），则基极被置于在其上形成导电聚合物层的酸溶液中，溶剂残基被漂洗除去，并且将钻孔和电路图案是优选电解或电解金属化。

8. 发明申请

WO1989008375A1 NEW THROUGH-HOLE PLATED PRINTED CIRCUIT BOARD AND PROCESS FOR MANUFACTURING SAME 审中-公开
标题翻译：新型贯通孔印刷电路板及其制造方法
公开(公告)号：WO1989008375A1
公开(公告)日：1989-09-08
申请号：PCT/EP1989000204
申请日：1989-03-01
申请人： BLASBERG-OBERFLÄCHENTECHNIK GMBH , HUPE, Jürgen , KRONENBERG, Walter
发明人： BLASBERG-OBERFLÄCHENTECHNIK GMBH
IPC分类号： H05K03/42
CPC分类号： C08G61/123 , H05K3/424 , H05K3/427 , H05K2201/0329 , H05K2203/0783 , H05K2203/0796 , H05K2203/122 , Y10T428/24322 , Y10T428/24802 , Y10T428/24917 , Y10T428/31 , Y10T428/31678
摘要： A process is described for manufacturing through-hole plated single-layer or multi-layer printed circuit boards based on a polymeric substrate material or on a ceramic material provided optionally on both sides with at least one electroconductive layer by electroplating or electroless plating with a metal layer also on those surfaces which have not been coated with a conductive metal layer, said process being characterized in that a) the surfaces of the substrate are pre-treated in a solution having oxidizing activity, b) after removal of the residual solution by rinsing, the substrate is introduced into a solution which contains at least one monomer, and more specifically pyrrole, furane, thiophene or derivative(s) thereof, which in a polymeric or copolymeric form is electrically conductive, c) the substrate is then transferred into an acidic solution whereby an electrically conductive polymeric layer, more specifically of polymerized or copolymerized pyrrole, furane, thiophene or derivative(s) thereof, whereupon, if desired or required, any residual solution is removed by rinsing, and the galvanic or electroless metallization is carried out.
摘要翻译：描述了一种用于制造基于聚合物基底材料的通孔电镀单层或多层印刷电路板的工艺，或者在任选地在两侧提供至少一个导电层的陶瓷材料上，通过电镀或化学镀金属所述方法的特征在于：a）将基材的表面在具有氧化活性的溶液中进行预处理，b）在通过冲洗除去残余溶液之后，将底物引入到含有至少一种单体的溶液中，更具体地，其是以聚合或共聚形式导电的吡咯，呋喃，噻吩或其衍生物，c）然后将基底转移到酸性溶液，由此导电聚合物层，更具体地是聚合或共聚的吡咯，呋喃，噻吩或衍生物因此，如果需要或需要，通过冲洗除去任何残余溶液，并进行电化学或无电镀金属化。

9. 发明申请

WO1996015651A1 METHOD OF PRODUCING A FEEDTHROUGH ON A CIRCUIT BOARD 审中-公开
标题翻译：方法通过在电路板生产
公开(公告)号：WO1996015651A1
公开(公告)日：1996-05-23
申请号：PCT/DE1995001497
申请日：1995-10-27
申请人： BLAUPUNKT-WERKE GMBH , BACKASCH, Wolf , HOHMANN, Rolf
发明人： BLAUPUNKT-WERKE GMBH
IPC分类号： H05K03/42
CPC分类号： H05K3/244 , H05K3/243 , H05K3/3452 , H05K3/4007 , H05K3/428 , H05K2201/0344 , H05K2203/0571 , H05K2203/1423 , Y10T29/49165
摘要： The invention proposes a method of producing a feedthrough on a circuit board, the method calling for the circuit board first to be drilled, catalysed and the surface structured. The feedthrough is then built up by electro-deposition in such a way that electrical components can be mounted in the feedthrough. The metallization (7) is preferably carried out using nickel or nickel compounds so that no additional corrosion-protection measures are necessary. By coating connecting lands (2b) with gold or palladium, bonding can be carried out directly on the lands.
摘要翻译：根据本发明，提供了一种用于在电路板上，其特征在于，所述印刷电路板第一钻出生产电镀穿通孔，催化和被图案化。此后，在电化学沉积过程中，通过被构造为使得经由为电部件的通孔安装使用。金属化（7）优选用镍或镍的化合物进行，以使得不需要额外的防腐蚀保护。通过用金或钯涂覆连接盘（2b）中可以直接键合到连接焊盘。

10. 发明申请

WO1994026082A1 PROCESS FOR THROUGHPLATING PRINTED CIRCUIT BOARDS USING CONDUCTIVE PLASTICS FOR DIRECT PLATING 审中-公开
标题翻译：通过印制电路板的方法，使用导电塑料对直接金属化
公开(公告)号：WO1994026082A1
公开(公告)日：1994-11-10
申请号：PCT/EP1994001340
申请日：1994-04-28
申请人： GRUNDIG E.M.V. ELEKTRO-MECHANISCHE VERSUCHSANSTALT MAX GRUNDIG HOLLÄND. STIFTUNG & CO KG , RÖSCH, Gerhard , STUCKMANN, Walter
发明人： GRUNDIG E.M.V. ELEKTRO-MECHANISCHE VERSUCHSANSTALT MAX GRUNDIG HOLLÄND. STIFTUNG & CO KG
IPC分类号： H05K03/42
CPC分类号： C25D5/54 , C08G73/0611 , C25D5/02 , H01B1/127 , H01B1/128 , H05K3/424 , H05K3/427 , H05K2201/0329 , H05K2203/0783
摘要： The invention pertains to a process for throughplating of printed circuit boards using conductive plastics for direct plating, wherein a polymer film with intrinsically electrical conductivity is adhesively deposited on nonconductive areas of the printed circuit boards, whereupon a metal film is applied. Selective production of the polymer film has previously been seen as requiring an oxidative pretreatment of the printed circuit board, though this can negatively affect the further course of the process. With the present invention the potential negative effects are avoided by forgoing the oxidative pretreatment.

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