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1. 发明申请

WO1991003920A2 PLATED-THROUGH PRINTED CIRCUIT BOARD WITH RESIST AND PROCESS FOR PRODUCING IT 审中-公开
标题翻译：通过电阻印刷电路板和生产IT的过程
公开(公告)号：WO1991003920A2
公开(公告)日：1991-03-21
申请号：PCT/EP1990001326
申请日：1990-08-11
申请人： BLASBERG-OBERFLÄCHENTECHNIK GMBH , HUPE, Jürgen , KRONENBERG, Walter
发明人： BLASBERG-OBERFLÄCHENTECHNIK GMBH
IPC分类号： H05K03/42
CPC分类号： H05K3/424 , C08G61/123 , H05K3/108 , H05K3/4038 , H05K3/427 , H05K2201/0329 , H05K2203/0796 , H05K2203/107 , H05K2203/122 , H05K2203/1415 , Y10T29/49144 , Y10T29/49165 , Y10T428/24322 , Y10T428/24802 , Y10T428/24917 , Y10T428/31
摘要： In a process for producing plated-through single- or multi-layered printed circuit boards comprising a polymer base or ceramic which is coated, possibly on both sides, with at least one photoresist layer which temporarily exposes the electrically conductive circuit pattern, a metallic layer is deposited electrolytically or non-electrolytically on the surfaces of the base, including those which are not coated with a conducive metallic layer. The process is characterized in that (a) the surface of the base is drilled, subjected to a mechanical surface treatment, laminated with a suitable photoresist, illuminated and developed, in order to expose the circuit pattern, (b) the surfaces of the base are pretreated in an oxidizing solution, (c) the solvent residues are rinsed off the base, which is then placed in a solution containing a heterocyclic monomer, in particular pyrrol, thiophene, furan or their derivatives, which in polymer form is electrically conductive, (d) the base is then placed in an acidic solution in which an electrically conductive polymer layer is formed, the solvent residues are rinsed off, and the drilled holes and circuit pattern are metallized preferably electrolytically or non-electrolytically.
摘要翻译：在生产金属化孔单或多层印刷电路板的方法中，该印刷电路板包括任选在两侧涂覆有聚合物基体或陶瓷的至少一层光致抗蚀剂，其暂时暴露导电电路中，金属层电解或电解沉积在基底的表面上，包括没有涂覆导电金属层的表面。该方法的特征在于在基座的是：（a）表面被钻孔，进行机械表面处理，层压有合适的光致抗蚀剂的层，照射并显影以暴露所述电路图案，（二）基体表面在氧化溶液预处理，（C）中的溶剂残基被从通过漂洗，基中，然后放置在含杂环单体的溶液，包括吡咯，噻吩，呋喃，或它们的除去衍生物，其以聚合物形式是导电的，（d），则基极被置于在其上形成导电聚合物层的酸溶液中，溶剂残基被漂洗除去，并且将钻孔和电路图案是优选电解或电解金属化。

2. 发明申请

WO1989008375A1 NEW THROUGH-HOLE PLATED PRINTED CIRCUIT BOARD AND PROCESS FOR MANUFACTURING SAME 审中-公开
标题翻译：新型贯通孔印刷电路板及其制造方法
公开(公告)号：WO1989008375A1
公开(公告)日：1989-09-08
申请号：PCT/EP1989000204
申请日：1989-03-01
申请人： BLASBERG-OBERFLÄCHENTECHNIK GMBH , HUPE, Jürgen , KRONENBERG, Walter
发明人： BLASBERG-OBERFLÄCHENTECHNIK GMBH
IPC分类号： H05K03/42
CPC分类号： C08G61/123 , H05K3/424 , H05K3/427 , H05K2201/0329 , H05K2203/0783 , H05K2203/0796 , H05K2203/122 , Y10T428/24322 , Y10T428/24802 , Y10T428/24917 , Y10T428/31 , Y10T428/31678
摘要： A process is described for manufacturing through-hole plated single-layer or multi-layer printed circuit boards based on a polymeric substrate material or on a ceramic material provided optionally on both sides with at least one electroconductive layer by electroplating or electroless plating with a metal layer also on those surfaces which have not been coated with a conductive metal layer, said process being characterized in that a) the surfaces of the substrate are pre-treated in a solution having oxidizing activity, b) after removal of the residual solution by rinsing, the substrate is introduced into a solution which contains at least one monomer, and more specifically pyrrole, furane, thiophene or derivative(s) thereof, which in a polymeric or copolymeric form is electrically conductive, c) the substrate is then transferred into an acidic solution whereby an electrically conductive polymeric layer, more specifically of polymerized or copolymerized pyrrole, furane, thiophene or derivative(s) thereof, whereupon, if desired or required, any residual solution is removed by rinsing, and the galvanic or electroless metallization is carried out.
摘要翻译：描述了一种用于制造基于聚合物基底材料的通孔电镀单层或多层印刷电路板的工艺，或者在任选地在两侧提供至少一个导电层的陶瓷材料上，通过电镀或化学镀金属所述方法的特征在于：a）将基材的表面在具有氧化活性的溶液中进行预处理，b）在通过冲洗除去残余溶液之后，将底物引入到含有至少一种单体的溶液中，更具体地，其是以聚合或共聚形式导电的吡咯，呋喃，噻吩或其衍生物，c）然后将基底转移到酸性溶液，由此导电聚合物层，更具体地是聚合或共聚的吡咯，呋喃，噻吩或衍生物因此，如果需要或需要，通过冲洗除去任何残余溶液，并进行电化学或无电镀金属化。

3. 发明申请

WO9960188A3 METHOD FOR ELECTRO COPPERPLATING SUBSTRATES 审中-公开
标题翻译：方法镀铜SUBSTRATES
公开(公告)号：WO9960188A3
公开(公告)日：2000-01-13
申请号：PCT/EP9903321
申请日：1999-05-14
申请人： BLASBERG OBERFLAECHENTECH , HUPE JUERGEN , KRONENBERG WALTER , BREITKREUZ EUGEN , SCHMERGEL ULRICH
发明人： HUPE JUERGEN , KRONENBERG WALTER , BREITKREUZ EUGEN , SCHMERGEL ULRICH
IPC分类号： C25D3/38 , C25D21/14 , H05K3/24
CPC分类号： C25D21/14 , H05K3/241
摘要： A method for electro copperplating substrates, using insoluble anodes in acid copper baths and a separate supply of used copper ions. The inventive method is characterized in that the bulk of the copper ions are supplied directly without the aid of diaphragms and auxiliary electrodes in the form of copper carbonate and/or basic copper carbonate in a separate tank which is directed towards the working electrodes via a bypass, whereby the gaseous CO2 thus released is separated in the separate tank.
摘要翻译：根据与膜片和辅助电解质分配用于使用与所消耗的铜离子，其特征在于，单独的补充酸性铜浴不溶性阳极的基板的铜电镀的方法，所述铜离子的堆积在碳酸铜和/或碱式碳酸铜的形式被直接提供在一个单独的这是在旁通到工作电解质引导，所释放的气态CO 2在单独的罐罐分离。

4. 发明申请

WO1992020204A1 MEANS FOR THE SELECTIVE FORMATION OF A THIN OXIDISING LAYER 审中-公开
标题翻译：意味着选择性形成一个薄氧化层
公开(公告)号：WO1992020204A1
公开(公告)日：1992-11-12
申请号：PCT/EP1992000864
申请日：1992-04-17
申请人： BLASBERG OBERFLÄCHENTECHNIK GMBH , HUPE, Jürgen , ALTGELD, Werner , KRONENBERG, Walter , FIX, Sabine
发明人： BLASBERG OBERFLÄCHENTECHNIK GMBH
IPC分类号： H05K03/42
CPC分类号： C08G61/123 , C25D5/54 , H05K3/424 , H05K3/427 , H05K2201/0329 , H05K2203/0796 , H05K2203/122
摘要： The means of the invention for the selective formation of a thin oxidising layer by means of permanganate on polymers, glass fibres and ceramics but not on copper consists of an aqueous solution of potassium permanganate adjusted to a pH of 6.0 to 0, and preferably 5.0 to 2.0, by means of sulphonic acids, preferably methane sulphonic acid.
摘要翻译：通过高锰酸盐在聚合物，玻璃纤维和陶瓷而不是铜上选择性形成薄氧化层的本发明的方法包括调节至pH 6.0至0，优选5.0至 2.0，通过磺酸，优选甲烷磺酸。

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