基本信息:
- 专利标题： METHOD, APPARATUS AND PRODUCT FOR SURFACE MOUNT SOLDER JOINTS
- 专利标题（中）：方法，装置和表面安装焊接接头的产品
- 申请号：PCT/US1993004168 申请日：1993-05-03
- 公开(公告)号：WO1993023981A1 公开(公告)日：1993-11-25
- 发明人： MASK TECHNOLOGY, INC.
- 申请人： MASK TECHNOLOGY, INC. , HOLZMANN, Damian, J.
- 专利权人： MASK TECHNOLOGY, INC.,HOLZMANN, Damian, J.
- 当前专利权人： MASK TECHNOLOGY, INC.,HOLZMANN, Damian, J.
- 优先权： US7/881,872 19920512; US8/042,202 19930402
- 主分类号： H05K03/34
- IPC分类号： H05K03/34
摘要：
A method and apparatus for the forming of a solder deposit (2) on an SMD pad (4) on a printed circuit (3) or hybrid circuit board, the formed solder deposit (2) itself as well as a circuit board with the solder so formed thereon. This formed solder deposit (2) is in a defined three-dimensional well having the proper profile and a defined solder gap. By the placement of a mesh (14) on the surface of the circuit board with the solder in place on the pads, applying a slight positive pressure on a rigid or elastic surface (13) on the other side of the mesh, and subjecting this system to a temperature just low enough to reflow the solder by means of a heat transfer fluid, thereby the laminate structure of the board and the coating thereon remain substantially unaffected, then cooling the board to solidify the solder, a product results having the above properties.
摘要（中）：
一种用于在印刷电路（3）或混合电路板上的SMD焊盘（4）上形成焊料沉积物（2）的方法和装置，所形成的焊料沉积物（2）本身以及具有焊料的电路板 如此形成。 这种形成的焊料沉积物（2）在具有适当轮廓和限定的焊料间隙的限定的三维孔中。 通过将焊料（14）放置在电路板的表面上，焊料就位于焊盘上，在网的另一侧的刚性或弹性表面（13）上施加轻微的正压力，并对其进行处理 系统达到刚刚低到足以通过传热流体回流焊料的温度，由此板上的层压结构和其上的涂层基本上不受影响，然后冷却板以固化焊料，具有上述性能的产品结果 。