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    • 1. 发明申请
    • PLASMA REACTOR HAVING A HELICON WAVE HIGH DENSITY PLASMA SOURCE
    • 具有HELICON WAVE高密度等离子体源的等离子体反应器
    • WO00052973A2
    • 2000-09-08
    • PCT/US2000/005797
    • 2000-03-06
    • C23C16/00H01J37/32H05H20060101H05H1/00H05H1/24H05H
    • H01J37/321H01J37/32678
    • A helicon wave, high density RF plasma reactor having improved plasma and contaminant control. The reactor contains a well defined anode electrode that is heated above a polymer condensation temperature to ensure that deposits of material that would otherwise alter the ground plane characteristics do not form on the anode. The reactor also contains a magnetic bucket for axially confining the plasma in the chamber using a plurality of vertically oriented magnetic strips or horizontally oriented magnetic toroids that circumscribe the chamber. The reactor may utilize a temperature control system to maintain a constant temperature on the surface of the chamber.
    • 具有改进的等离子体和污染物控制的螺旋波,高密度RF等离子体反应器。 反应器包含明确定义的阳极电极,其被加热到聚合物冷凝温度以上,以确保否则会改变接地平面特性的材料沉积物不会在阳极上形成。 反应器还包含磁性桶,用于使用多个垂直取向的磁条或围绕室的水平取向的磁环将轴向限制在室中的等离子体。 反应器可以利用温度控制系统来维持室的表面上恒定的温度。
    • 4. 发明申请
    • SYSTEMS AND METHODS UTILIZING AN APERTURE WITH A REACTIVE ATOM PLASMA TORCH
    • 使用反应性ATOM等离子体转鼓使用孔的系统和方法
    • WO2005020646A2
    • 2005-03-03
    • PCT/US2004025410
    • 2004-08-06
    • RAPT IND INCCHANG ANDREWCARR JEFFREY WKELLEY JUDEFISKE PETER
    • CHANG ANDREWCARR JEFFREY WKELLEY JUDEFISKE PETER
    • B23K10/00H05H20060101H05H
    • H05H1/30
    • The footprint of a reactive atom plasma processing tool can be modified using an aperture device. A flow of reactive gas can be injected into the center of an annular plasma. An aperture can be positioned relative to the plasma such that the effective footprint of the plasma can be changed without adjusting the gas flows or swapping out the tool. Once the aperture and tool are in position relative to a workpiece, reactive atom plasma processing can be used to modify the surface of the workpiece, such as to etch, smooth, polish, clean, and/or deposit material onto the workpiece. If necessary, a coolant can be circulated about the aperture. Multiple apertures can also be used to provide a variety of footprint sizes and/or shapes. This description is not intended to be a complete description of, or limit the scope of, the invention. Other features, aspects, and objects of the invention can be obtained from a review of the specification, the figures, and the claims.
    • 可以使用孔径装置修改反应性原子等离子体处理工具的占地面积。 反应气体流可以注入环形等离子体的中心。 可以相对于等离子体定位孔,使得等离子体的有效占地面积可以在不调节气流或换出工具的情况下改变。 一旦孔和工具相对于工件就位,反应性原子等离子体处理可用于改变工件的表面,例如蚀刻,光滑,抛光,清洁和/或沉积材料到工件上。 如果需要,可以在孔周围循环冷却剂。 也可以使用多个孔来提供各种尺寸和/或形状。 本说明书不是对本发明的完整描述或限制本发明的范围。 本发明的其它特征,方面和目的可以通过对说明书,附图和权利要求的评论来获得。