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1. 发明申请

WO2005020646A2 SYSTEMS AND METHODS UTILIZING AN APERTURE WITH A REACTIVE ATOM PLASMA TORCH 审中-公开
标题翻译：使用反应性ATOM等离子体转鼓使用孔的系统和方法
公开(公告)号：WO2005020646A2
公开(公告)日：2005-03-03
申请号：PCT/US2004025410
申请日：2004-08-06
申请人： RAPT IND INC , CHANG ANDREW , CARR JEFFREY W , KELLEY JUDE , FISKE PETER
发明人： CHANG ANDREW , CARR JEFFREY W , KELLEY JUDE , FISKE PETER
IPC分类号： B23K10/00 , H05H20060101 , H05H
CPC分类号： H05H1/30
摘要： The footprint of a reactive atom plasma processing tool can be modified using an aperture device. A flow of reactive gas can be injected into the center of an annular plasma. An aperture can be positioned relative to the plasma such that the effective footprint of the plasma can be changed without adjusting the gas flows or swapping out the tool. Once the aperture and tool are in position relative to a workpiece, reactive atom plasma processing can be used to modify the surface of the workpiece, such as to etch, smooth, polish, clean, and/or deposit material onto the workpiece. If necessary, a coolant can be circulated about the aperture. Multiple apertures can also be used to provide a variety of footprint sizes and/or shapes. This description is not intended to be a complete description of, or limit the scope of, the invention. Other features, aspects, and objects of the invention can be obtained from a review of the specification, the figures, and the claims.
摘要翻译：可以使用孔径装置修改反应性原子等离子体处理工具的占地面积。反应气体流可以注入环形等离子体的中心。可以相对于等离子体定位孔，使得等离子体的有效占地面积可以在不调节气流或换出工具的情况下改变。一旦孔和工具相对于工件就位，反应性原子等离子体处理可用于改变工件的表面，例如蚀刻，光滑，抛光，清洁和/或沉积材料到工件上。如果需要，可以在孔周围循环冷却剂。也可以使用多个孔来提供各种尺寸和/或形状。本说明书不是对本发明的完整描述或限制本发明的范围。本发明的其它特征，方面和目的可以通过对说明书，附图和权利要求的评论来获得。

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