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    • 6. 发明申请
    • SCANNING LITHOGRAPHY SYSTEM HAVING DOUBLE PASS WYNNE-DYSON OPTICS
    • 具有双通道WYNNE-DYSON OPTICS的扫描光刻系统
    • WO1996029630A2
    • 1996-09-26
    • PCT/US1996003298
    • 1996-03-19
    • ETEC SYSTEMS, INC.
    • ETEC SYSTEMS, INC.ALLEN, Paul, C.
    • G03F07/20
    • G02B17/0892G02B17/008G02B17/08G03F7/70225G03F7/70275G03F7/70358
    • A small field scanning photolithography system (700) has a double pass Wynne-Dyson optical system (770) which provides an erect, non-reverted, unmagnified image. An optical path through the system passes from an object (722), reflects off an input reflector (731), passes through a first quadrant of a lens (740), reflects off a concave mirror (750), passes through a second quadrant of lens (740) into folding optics (732) where an intermediate image forms, passes from folding optics (732) through a third quadrant of lens (740), reflects off concave mirror (750) a second time, passes through a fourth quadrant of lens (740), and finally reflects off an output reflector (733) to a plane (160) where a final image (362) forms. Typically, input and output reflectors (731, 733) and the folding optics (732) are prisms. A field stop (760) may be provided in folding optics (732) where the intermediate image forms. Magnification adjusting optics (710, 720) can be added to input and output prisms (731, 733) or to folding optics (732). The magnification adjusting optics (710, 720) forms two narrow meniscus air gaps (713, 723) which are equal size for unity magnification. Narrowing one air gap (713 or 723) and widening the other air gap (723 or 713) changes magnification slightly.
    • 小场扫描光刻系统(700)具有双通道Wynne-Dyson光学系统(770),其提供直立的,未回复的非放大图像。 通过系统的光路从物体(722)通过,从输入反射器(731)反射,穿过透镜的第一象限(740),从凹面镜(750)反射,穿过第二象限 透镜(740)进入中间图像形成的折叠光学器件(732),从折叠光学器件(732)穿过透镜的第三象限(740),第二次反射出凹面镜(750),穿过第四象限 透镜(740),并且最终从输出反射器(733)反射到形成最终图像(362)的平面(160)。 通常,输入和输出反射器(731,733)和折叠光学器件(732)是棱镜。 可以在形成中间图像的折叠光学器件(732)中提供场停止器(760)。 可以将放大调整光学元件(710,720)添加到输入和输出棱镜(731,733)或折叠光学器件(732)。 倍率调节光学器件(710,720)形成两个相同尺寸的窄弯液面气隙(713,723),用于单位放大。 缩小一个气隙(713或723)并加宽另一个气隙(723或713)稍微改变放大倍数。
    • 7. 发明申请
    • ADAPTIVE OPTIC WAFER STEPPER ILLUMINATION SYSTEM
    • 自适应光学平移式照明系统
    • WO1993022711A1
    • 1993-11-11
    • PCT/US1992003998
    • 1992-05-07
    • LITEL INSTRUMENTS
    • LITEL INSTRUMENTSMacDONALD, Bruce, G.HUNTER, Robert, O., Jr.SMITH, Adlai, H.
    • G03F07/20
    • G03F7/70233G03F7/70266
    • The illumination system for a semiconductor wafer stepper includes reflective elements within the projection optics of a primary mirror (10), a secondary mirror (8), a deformable mirror (6) and a beamsplitter (4). The beamsplitter directs light reflected from the wafer surface (24) back into an interferometer camera to provide depth of focus and aberration information to a computer (16) which activates and selectively deforms the deformable mirror (6). Light, input from a mercury arc lamp or laser source, is projected either with an expanded or scanned beam through a reticle (20) which is printed with the pattern to be transferred to the wafer. An interferometer is included to combine light reflected from the wafer surface with a portion of the incoming light at the beamsplitter. The interference pattern formed by that combination is used by the computer to provide real-time manipulation of focus errors, vibration and aberration by deformation of the deformable mirror. The deformable mirror and interferometer system is also applicable to folded beam refractive optic illumination systems and pure refractive optic systems in which a detour is made within the optical train to access the deformable mirror.
    • 用于半导体晶片步进器的照明系统包括主镜(10),副镜(8),可变形反射镜(6)和分束器(4)的投影光学器件内的反射元件。 分束器将从晶片表面(24)反射的光引导回到干涉仪相机中以向计算机(16)提供焦点深度和像差信息,从而激活并选择性地使可变形反射镜(6)变形。 来自水银弧光灯或激光源的光线通过扩展的或扫描的光束投射通过掩模版(20),该掩模版(20)被打印以转印到晶片上。 包括干涉仪以将从晶片表面反射的光与分束器处的入射光的一部分组合。 由该组合形成的干涉图案由计算机用于通过可变形反射镜的变形来实时地处理聚焦误差,振动和像差。 可变形反射镜和干涉仪系统也可用于折叠光束折射光学照明系统和纯折射光学系统,其中在光学系列内形成绕行线以接近可变形反射镜。
    • 8. 发明申请
    • METHOD FOR FORMING A LITHOGRAPHIC PATTERN IN A PROCESS FOR MANUFACTURING SEMICONDUCTOR DEVICES
    • 在制造半导体器件的过程中形成图形图案的方法
    • WO1993020482A1
    • 1993-10-14
    • PCT/US1993003126
    • 1993-03-29
    • MICROUNITY SYSTEMS ENGINEERING, INC.
    • MICROUNITY SYSTEMS ENGINEERING, INC.CHEN, Jang, FungMATTHEWS, James, A.
    • G03F07/20
    • G03F7/70466G03F7/2022
    • A method of printing a sub-resolution device feature (16) having first and second edges spaced in close proximity to one another on a semiconductor substrate (20) includes the steps of first depositing a radiation-sensitive material on the substrate, then providing a first mask image segment (11) which corresponds to the first edge. The first mask image segment is then exposed with radiation (10) using an imaging tool (12) to produce a first pattern edge gradient (14). The first pattern edge gradient defines the first edge of the feature in the material. A second mask image segment (13) is then provided corresponding to the second feature edge. This second mask image segment is exposed to radiation (10) to produce a second pattern edge gradient (17) which defines the second edge of the feature. Once the radiation-sensitive material has been developed, the two-dimensional feature is reproduced on the substrate.
    • 印刷具有在半导体衬底(20)上彼此靠近彼此间隔开的第一和第二边缘的子分辨率器件特征(16)的方法包括以下步骤:首先在衬底上沉积辐射敏感材料,然后提供 第一掩模图像段(11),其对应于第一边缘。 然后使用成像工具(12)用辐射(10)将第一掩模图像段曝光以产生第一图案边缘梯度(14)。 第一个图案边缘渐变定义材料中特征的第一个边缘。 然后对应于第二特征边缘提供第二掩模图像段(13)。 该第二掩模图像段暴露于辐射(10)以产生限定特征的第二边缘的第二图案边缘梯度(17)。 一旦辐射敏感材料已经开发出来,二维特征就在基片上再现。