会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明申请
    • METHOD FOR FORMING A LITHOGRAPHIC PATTERN IN A PROCESS FOR MANUFACTURING SEMICONDUCTOR DEVICES
    • 在制造半导体器件的过程中形成图形图案的方法
    • WO1993020482A1
    • 1993-10-14
    • PCT/US1993003126
    • 1993-03-29
    • MICROUNITY SYSTEMS ENGINEERING, INC.
    • MICROUNITY SYSTEMS ENGINEERING, INC.CHEN, Jang, FungMATTHEWS, James, A.
    • G03F07/20
    • G03F7/70466G03F7/2022
    • A method of printing a sub-resolution device feature (16) having first and second edges spaced in close proximity to one another on a semiconductor substrate (20) includes the steps of first depositing a radiation-sensitive material on the substrate, then providing a first mask image segment (11) which corresponds to the first edge. The first mask image segment is then exposed with radiation (10) using an imaging tool (12) to produce a first pattern edge gradient (14). The first pattern edge gradient defines the first edge of the feature in the material. A second mask image segment (13) is then provided corresponding to the second feature edge. This second mask image segment is exposed to radiation (10) to produce a second pattern edge gradient (17) which defines the second edge of the feature. Once the radiation-sensitive material has been developed, the two-dimensional feature is reproduced on the substrate.
    • 印刷具有在半导体衬底(20)上彼此靠近彼此间隔开的第一和第二边缘的子分辨率器件特征(16)的方法包括以下步骤:首先在衬底上沉积辐射敏感材料,然后提供 第一掩模图像段(11),其对应于第一边缘。 然后使用成像工具(12)用辐射(10)将第一掩模图像段曝光以产生第一图案边缘梯度(14)。 第一个图案边缘渐变定义材料中特征的第一个边缘。 然后对应于第二特征边缘提供第二掩模图像段(13)。 该第二掩模图像段暴露于辐射(10)以产生限定特征的第二边缘的第二图案边缘梯度(17)。 一旦辐射敏感材料已经开发出来,二维特征就在基片上再现。