专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2021055446A1 SYSTEM AND METHOD FOR RAPID INSPECTION OF PRINTED CIRCUIT BOARD USING MULTIPLE MODALITIES 审中-公开
公开(公告)号：WO2021055446A1
公开(公告)日：2021-03-25
申请号：PCT/US2020/051032
申请日：2020-09-16
申请人： BATTELLE MEMORIAL INSTITUTE
发明人： KENT, Thomas , SCHLEY, Jeremiah , GEORGE, Anthony , HIGGINS, Richard , LISZEWSKI, Katie , MAUNG, David
IPC分类号： G01R31/309 , G01R31/265 , G01N21/00
摘要： A multispectral inspection (MSI) device for analyzing an electronic item having a printed circuit board (PCB). An electronic power supply powers the electronic item in accordance with one or more test vectors. An optical imaging scanner, terahertz (THz) imaging scanner, and a functional imaging scanner are each operative to scan the electronic item. An electronic processor is programmed to scan the various scanners and control the power supply to acquire optical, THz, and functional images of the electronic item. The images are combined to form a standard three-dimensional (3D) signature and artificial intelligence (AI) classifiers are applied to the 3D signature to perform non-destructive analyses of the electronic item.

2. 发明申请

WO2015024679A1 LOCK-IN THERMOGRAPHY METHOD AND SYSTEM FOR HOT SPOT LOCALIZATION 审中-公开
标题翻译：用于热点定位的锁定热成像方法和系统
公开(公告)号：WO2015024679A1
公开(公告)日：2015-02-26
申请号：PCT/EP2014/061232
申请日：2014-05-30
申请人： DCG SYSTEMS, INC. , FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E. V.
发明人： SCHMIDT, Christian , MEINHARDT-WILDEGGER, Raiko , ALTMANN, Frank , NAUMANN, Falk , SCHLANGEN, Rudolf
IPC分类号： G01N25/72 , G01R31/309
CPC分类号： G01J5/0066 , G01J5/0096 , G01J5/10 , G01N25/72 , G01R31/311
摘要： A method for localizing a hot spot (27) in a sample (12), in particular an encapsulated device under test (DUT), by using lock-in thermography (LIT), where at least one heat source (23) of an electrical circuit is buried within the sample (12) and generated the hot spot (27) upon flow of current therein, comprises applying a non-harmonic excitation wave test signal at a lock-in frequency to the electrical circuit of the sample (12) to activate the heat source (23) for generating the hot spot (27); imaging the sample (12) using an infrared sensor (16) to obtain IR images of the sample (12) while the non-harmonic test signal is applied to the electrical circuit; and detecting a thermal response signal obtained from the imaging, the thermal response signal being in correlation to the thermal heat propagation within the sample (12). The invention is characterized in that applying the non-harmonic test signal comprises applying a non-harmonic signal at a single selected frequency; that the thermal response signal is subjected to a Fourier transformation (FT) to break down the thermal response signal into a frequency spectrum containing harmonics signals of a base and higher harmonic signals to thereby obtain a plurality of frequency-specific response signals at multiple specific frequencies; that the phase shifts of each of the frequency-specific response signals is determined; that a frequency vs. phase shift curve is obtained from the phase shifts of the frequency-specific response signals; and that a plurality of images, each corresponding to one of the specific frequencies are displayed.
摘要翻译：一种用于通过使用锁定热成像（LIT）来定位样品（12）中的热点（27），特别是被测试的被封装器件（DUT）的方法，其中至少一个电源（23）电路被埋在样品（12）内，并且在其中流过电流时产生热点（27），包括以锁定频率将非谐波激发波测试信号施加到样品（12）的电路至激活用于产生热点（27）的热源（23）; 使用红外传感器（16）对样品（12）成像，以获得样品（12）的IR图像，同时将非谐波测试信号施加到电路; 以及检测从所述成像获得的热响应信号，所述热响应信号与所述样品（12）内的热传热相关。本发明的特征在于，应用非谐波测试信号包括以单个选定频率施加非谐波信号; 对热响应信号进行傅里叶变换（FT），以将热响应信号分解为包含基波和高次谐波信号的谐波信号的频谱，从而获得多个特定频率的特定响应信号 ; 确定每个频率特定响应信号的相移; 从频率特定响应信号的相移中获得频率相移相位曲线; 并且显示各自对应于特定频率之一的多个图像。

3. 发明申请

WO03091949A2 SWITCHED FABRIC BASED INSPECTION SYSTEM 审中-公开
标题翻译：基于开关织物的检验系统
公开(公告)号：WO03091949A2
公开(公告)日：2003-11-06
申请号：PCT/US0312785
申请日：2003-04-25
申请人： AUGUST TECHNOLOGY CORP
发明人： WATKINS CORY , PALM STEVEN G
IPC分类号： G01R31/307 , G01R31/309 , G03F1/84 , G06F15/173 , G06T7/00
CPC分类号： G01R31/307 , G01R31/309 , G03F1/84
摘要： An inspection system is provided for performing high speed inspection. The system includes a data source, one or more computers for processing the data, and a switched fabric for data distribution to the one or more computers.
摘要翻译：提供检查系统进行高速检查。该系统包括数据源，用于处理数据的一个或多个计算机，以及用于将数据分发到一个或多个计算机的交换结构。

4. 发明申请

WO02001193A3 OPTICAL SYSTEM 审中-公开
标题翻译：光学系统
公开(公告)号：WO02001193A3
公开(公告)日：2002-06-27
申请号：PCT/US2001/019987
申请日：2001-06-22
IPC分类号： G01B11/30 , G01J3/50 , G01N21/84 , G01N21/88 , G01N21/956 , H05K3/00 , G01R31/309
CPC分类号： G01N21/8806 , G01N21/95684 , G01N2021/8812 , G01N2021/8816 , G01N2021/8825 , G01N2021/8838 , G01N2021/8845 , G01N2021/95638 , G01N2021/95661 , G01N2021/95669 , G01N2201/062
摘要： An optical system for use in an inspection system is described. The optical system includes an imaging system which may be provided as a multi-spectral band pass image recording system and a lighting system which includes at least one coaxial light and at least one side light to provide spectral discrimination and to provide contrast between a first surface made from a first material and a second surface made from a second different material.
摘要翻译：用于检查系统的光学系统包括可以作为多光谱带通图像记录系统生产的成像系统，以及成像系统。其包含至少一个同轴光束和至少一个侧光束，所述侧光束旨在提供光谱鉴别并且在由第一材料制成的第一表面和由第二材料制成的第二表面之间产生对比，所述第二表面与所述第一材料不同。

5. 发明申请

WO0214885A2 DEFECTIVE CIRCUIT SCANNING DEVICE AND METHOD 审中-公开
标题翻译：有缺陷的电路扫描装置和方法
公开(公告)号：WO0214885A2
公开(公告)日：2002-02-21
申请号：PCT/US0121365
申请日：2001-07-03
申请人： SIEMENS ENERGY & AUTOMAT
发明人： HUBER ROBERT
IPC分类号： G01R31/309 , G01R31/01
CPC分类号： G01R31/309 , Y10T29/49004 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178
摘要： A device for processing multi-up panels (10) includes a bad mark scanner (30) for reading a surface of a multi-up panel and a processor (22) receiving at least one input from the scanner for determining a bad mark on the multi-up panel. Also provided is circuit panel manufacturing assembly line having a circuit panel bad mark scanner, a panel component placement machine (32, 34) separate from the scanner, and a panel conveyor (6) located at least between the circuit panel scanner and the panel component placement machine for conveying the panels. Further provided is a method for determining bad marks on multi-up panels comprising the steps of scanning a multi-up panel with a scanner so as to form scan data and determining a bad mark on the multi-up panel as a function of the scan data.
摘要翻译：一种用于处理多层面板（10）的设备包括用于读取多层面板的表面的坏标记扫描器（30）和接收来自扫描仪的至少一个输入的处理器（22），用于确定在多功能面板。还提供了具有电路板坏标记扫描器的电路板制造装配线，与扫描仪分离的面板组件放置机器（32,34）以及至少位于电路板扫描仪和面板组件之间的面板传送器（6）贴片机用于输送面板。还提供了一种用于确定多层面板上的不良标记的方法，包括以下步骤：用扫描仪扫描多层面板，以便形成扫描数据并根据扫描形成多重面板上的不良标记数据。

6. 发明申请

WO00048012A1 METHOD FOR THE VERIFICATION OF THE POLARITY, PRESENCE, ALIGNMENT OF COMPONENTS AND SHORT CIRCUITS ON A PRINTED CIRCUIT BOARD 审中-公开
标题翻译：打印电路板上组件的极性，存在，对准和短路的方法
公开(公告)号：WO00048012A1
公开(公告)日：2000-08-17
申请号：PCT/CA2000/000129
申请日：2000-02-11
IPC分类号： G01N21/956 , G01R31/28 , H05K1/02 , H05K3/00 , H05K3/30 , H05K13/08 , G01R31/309
CPC分类号： H05K1/0269 , G01R31/2813 , H05K3/303 , H05K2201/10689 , H05K2203/161 , H05K2203/163 , H05K2203/168 , Y10T29/49131 , Y10T29/49133
摘要： The invention relates to a method for the verification of the presence and proper orientation of a component on a printed circuit board (1). The board has a plurality of areas (10) for receiving a component (20) respectively. Each area is marked in the center thereof with a first marker (30). Adjacent each area, and indicative of the polarity of the component, a second marker (40) is marked on the board. The presence or absence of a component can be evaluated by inspecting the board after it has been populated and determining whether any of the first markers appear, indicat ing that a component is missing. Verification of the polarity of a component is done by placing a marker (40) on a portion of a component required to be installed in a predetermined position indicative of polarity. Inspection of the board once it has been populated will determine if the component is in the proper orientation by verifying if the second marker and the marker on the component are in alignment. Preferably, the first marker and the second marker are of different colours, and are preferably UV compatible layers. Additionally, the method of the invention, when applied between the leads of a multi-legged component or between discrete components, such as by the etching of additional portions of the solder mask or by adding an additional layer, will produce a shadow on the reflective surface, thereby identifying a short at that location.
摘要翻译：本发明涉及一种用于验证印刷电路板（1）上的部件的存在和适当取向的方法。板具有分别用于接收部件（20）的多个区域（10）。每个区域在其中心标记有第一标记（30）。邻近每个区域并指示部件的极性，在板上标记第二标记（40）。组件的存在或不存在可以通过在填充板之后检查板来确定是否出现任何第一个标记，指示组件是否缺失来进行评估。通过将标记（40）放置在需要安装在指示极性的预定位置的部件的一部分上来验证部件的极性。一旦填充了板的检查，将通过验证组件上的第二个标记和标记是否对齐来确定组件是否处于正确的方向。优选地，第一标记和第二标记具有不同的颜色，并且优选地是UV兼容层。另外，本发明的方法当应用于多腿部件的引线之间或者在分立部件之间，例如通过蚀刻焊接掩模的附加部分或通过添加附加层时，将在反射层上产生阴影表面，从而在该位置识别短路。

7. 发明申请

WO00040985A1 PROGNOSTIC SYSTEM FOR DETERMINING INFRARED SIGNATURE PATTERNS EMITTED FROM ELECTRONIC DEVICES 审中-公开
标题翻译：用于确定从电子设备发射的红外标识图案的预测系统
公开(公告)号：WO00040985A1
公开(公告)日：2000-07-13
申请号：PCT/US1999/029520
申请日：1999-12-14
IPC分类号： G01N25/72 , G01R31/309
CPC分类号： G01N25/72 , G01R31/309
摘要： An electronic prognostic and diagnostic system for determining infrared signature patterns emitted from electronic devices on circuit boards comprising a means for surveying and collecting infrared emission signature patterns emitted from each circuit assembly; at least one sensor array in communication with the means for surveying and collecting infrared emission signatures, each sensor array sensing and receiving infrared data information from the means for surveying and collecting infrared emission signatures, each sensor array generating current and voltage signals which are proportional to the infrared emission signatures thereby defining an infrared emission signature pattern; and electronic means for comparing and processing infrared data information, the electronic means for comparing and processing in electrical communication with each sensor array to receive the current and voltage signals, the electronic means for comparing and processing further including a means for resolving the location of the infrared signature pattern.
摘要翻译：一种用于确定从电路板上的电子设备发射的红外签名图案的电子预测和诊断系统，包括用于测量和收集从每个电路组件发射的红外发射签名图案的装置; 与用于测量和收集红外发射特征的装置通信的至少一个传感器阵列，每个传感器阵列感测和接收来自用于测量和收集红外发射特征的装置的红外数据信息，每个传感器阵列产生电流和电压信号，其与红外发射特征从而限定了红外发射特征图; 以及用于比较和处理红外数据信息的电子装置，用于与每个传感器阵列进行电通信的比较和处理以接收电流和电压信号的电子装置，用于比较和处理的电子装置，还包括用于解决红外签名图案。

8. 发明申请

WO00011454A1 INSPECTION OF PRINTED CIRCUIT BOARDS USING COLOR 审中-公开
标题翻译：使用颜色检查印刷电路板
公开(公告)号：WO00011454A1
公开(公告)日：2000-03-02
申请号：PCT/IL1998/000393
申请日：1998-08-18
IPC分类号： G01N21/956 , G01R31/309 , G06T7/00 , H05K1/02 , G01N21/88
CPC分类号： G01R31/309 , G01N21/95684 , G06T7/0002 , G06T2207/30141 , H05K1/0269 , H05K2203/0315 , H05K2203/161
摘要： A method of analysis of a printed circuit board comprising: generating an image of the printed circuit board, preferably a multicolor image; and determining the presence of an oxide from an analysis of the image, preferably from brightness values of pixels in the image.
摘要翻译：一种印刷电路板的分析方法，包括：生成印刷电路板的图像，优选为多色图像; 以及从图像的分析中，优选地从图像中的像素的亮度值确定氧化物的存在。

9. 发明申请

WO98055826A3 MEASURING SURFACE FLATNESS USING SHADOW MOIRE TECHNOLOGY AND PHASE-STEPPING IMAGE PROCESSING 审中-公开
标题翻译：使用阴影技术和相位步进图像处理测量表面平面度
公开(公告)号：WO98055826A3
公开(公告)日：1999-03-18
申请号：PCT/US1998/011378
申请日：1998-06-03
IPC分类号： G01B11/30 , G01R31/309 , G01B
CPC分类号： G01B11/306 , G01R31/309
摘要： A system for quantifying the surface flatness of objects utilizing shadow moire and phase-stepping image processing techniques. A grating (28) is suspended above an object and illuminated by a light source (32). The light source projects a shadow of opaque lines upon the object. A two-dimensional array of phase values is calculated from digitized phase-shifted shadow moire fringe patterns that are indicative of the flatness of the surface of an object (22). There may be three, four or more of such phase shifted shadow moire fringe patterns.

10. 发明申请

WO2022187464A1 SYSTEMS AND METHODS FOR INSPECTION OF IC DEVICES 审中-公开
公开(公告)号：WO2022187464A1
公开(公告)日：2022-09-09
申请号：PCT/US2022/018673
申请日：2022-03-03
申请人： BATTELLE MEMORIAL INSTITUTE
发明人： DARBY, Nicholas , SCHLEY, Jeremiah , BELLAY, Jeremy
IPC分类号： G06T7/00 , G01N21/00 , G01R31/28 , G01R31/309
摘要： In an approach to non-destructive inspection of IC devices, one or more images of a Device Under Test (DUT) are received from one or more imaging devices. Observed features are detected in the one or more images and producing a first synthetic representation of a part design of the DUT that includes the observed features. The presence of one or more first unobserved features are inferred, where the one or more first unobserved features are inferred using a mapping and inference model (MIM). The one or more first unobserved features are added to the first synthetic representation of the part design of the DUT.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式