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    • 2. 发明申请
    • INSPECTION AND METROLOGY MODULE CLUSTER TOOL WITH MULTI-TOOL MANAGER
    • 具有多工具管理员的检查和计量模块组合工具
    • WO2005008737A3
    • 2005-08-18
    • PCT/US2004022591
    • 2004-07-14
    • AUGUST TECHNOLOGY CORP
    • WATKINS CORY
    • G01R31/26G06F7/00H01L20060101H01L21/00
    • H01L21/67276G05B2219/32197G05B2219/37224G05B2219/45031Y02P90/22
    • A semiconductor inspection system (100) comprises a first inspection tool (108A) communicatively coupled to a network (104), a second inspection tool (108B) communicatively coupled to the network, and a multi-tool manager (102) communicatively coupled to the network. The multi-tool manager is configured to monitor the first inspection tool and the second inspection tool through the network. The inspection tool (300) includes a robot (304), a first wafer carrier (312) proximate the robot, a first wafer inspection module (320) proximate the robot, a second wafer inspection module (318) proximate the robot, and a controller (308) configured for controlling the robot to pass wafers between the first wafer carrier, the first wafer inspection module, and the second wafer inspection module.
    • 半导体检查系统(100)包括通信地耦合到网络(104)的第一检查工具(108A),通信地耦合到网络的第二检查工具(108B)和通信地耦合到网络的多工具管理器(102) 网络。 多工具管理器被配置为通过网络监视第一检查工具和第二检查工具。 检查工具(300)包括机器人(304),靠近机器人的第一晶片载体(312),靠近机器人的第一晶片检查模块(320),靠近机器人的第二晶片检查模块(318) 控制器(308)被配置为控制机器人在第一晶片载体,第一晶片检查模块和第二晶片检查模块之间传送晶片。
    • 4. 发明申请
    • EDGE NORMAL PROCESS
    • 边缘正常工艺
    • WO2005008170A3
    • 2005-05-06
    • PCT/US2004022401
    • 2004-07-14
    • AUGUST TECHNOLOGY CORP
    • WATKINS CORYHARLESS MARKABRAHAM FRANCYSIM HAK CHUAH
    • G01B20060101G06K9/00
    • G01B1/00G06K9/00
    • An edge inspection method (Figure 10) for detecting defects on a wafer surface (step 302 in Figure 10) includes acquiring a set of digital images which captures a circumference of the wafer. An edge of the wafer about the circumference is determined. Each digital image is segmented into a plurality of horizontal bands (step 306 in Figure 10). Adjacent edge clusters (step 314 in Figure 10) about the circumference of the wafer are combined into edge pixel bins. The edge pixel bins are analyzed via edge clusters analysis (step 316 in Figure 10) to identify defects. The edge pixel bins are also analyzed via blob analysis (step 318 in Figure 10) to determine defects.
    • 用于检测晶片表面上的缺陷的边缘检查方法(图10)(图10中的步骤302)包括获取捕获晶片周围的一组数字图像。 确定围绕圆周的晶片的边缘。 每个数字图像被分割成多个水平带(图10中的步骤306)。 围绕晶片圆周的相邻边缘簇(图10中的步骤314)被组合成边缘像素块。 通过边缘簇分析(图10中的步骤316)分析边缘像素箱,以识别缺陷。 还通过斑点分析(图10中的步骤318)分析边缘像素箱,以确定缺陷。