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    • 5. 发明申请
    • SYSTEMS AND METHODS FOR A TARGET AND BACKING PLATE ASSEMBLY
    • 目标和背板组件的系统和方法
    • WO2004024972A2
    • 2004-03-25
    • PCT/US0326465
    • 2003-08-26
    • TOSOH SMD INCIVANOV EUGENE Y
    • IVANOV EUGENE Y
    • B23K20/02B23K28/00C23C20060101C23C14/34C23C
    • C23C14/3407B23K20/021B23K20/023
    • A target and backing plate assembly and method of making the same. The target and backing plate assembly provides a mechanical interlock between the target and backing plate in addition to diffusion bonding between dissimilar materials comprising the target and backing plate. An interlayer may also be used between the target and backing plate. A plurality of ridges, or other salient surface features on one of the target and backing plate are joined to corresponding members or channels on the other of the target and backing plate. The dissimilar materials of the target and backing plate fill negative angled cavities formed by the plurality of ridges and corresponding channels or members of the target and backing plate to accommodate the diffusion bonded dissimilar materials. A target and backing plate assembly with increased strength results.
    • 目标和背板组件及其制造方法。 目标和背板组件除了在包括目标板和背板之间的不同材料之间的扩散接合之外,还在目标板和背板之间提供机械互锁。 也可以在靶材和背板之间使用中间层。 目标板和背板之一上的多个脊或其他突出表面特征被连接到目标和背板的另一个上的对应的构件或通道。 目标和背板的不同材料填充由多个脊形成的负角度空腔以及目标和背板的相应通道或构件,以适应扩散接合的不同材料。 具有增加强度的目标和背板组件结果。