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1. 发明申请

WO2016118908A1 ACTUATOR APPARATUS WITH DISTANCE SENSOR FOR USE IN AUTOMATED ASSEMBLY AND MANUFACTURING 审中-公开
标题翻译：具有距离传感器的执行器装置，用于自动组装和制造
公开(公告)号：WO2016118908A1
公开(公告)日：2016-07-28
申请号：PCT/US2016/014602
申请日：2016-01-22
申请人： SYSTEMS, MACHINES, AUTOMATION COMPONENTS CORPORATION
发明人： NEFF, Edward A.
IPC分类号： H02P25/06 , G01B21/16
CPC分类号： B23Q17/2419 , B23P19/10 , G01S17/08 , G05B19/402 , G05B2219/37275 , G05B2219/37423 , G05B2219/45029 , G05B2219/45165 , G05B2219/50109
摘要： A system and method for measuring a distance to a target work surface to precisely position a tool assembly coupled to an actuator. The method includes measuring a distance to a work surface using a distance sensor, moving the tool assembly into an approach position, the approach position being adjacent to a location on the work surface. The tool assembly is then moved from the approach position to the location on the work surface pursuant to a soft landing procedure. The soft landing procedure may include determining that the tool assembly has moved into soft contact with the target work surface. Methods also include topologically mapping a work surface, comparing map data to predefined data, and adjusting a positioning routine. Additionally, methods include optimizing actuator movements to timely measure distances from a distance sensor to a location on a work surface with minimal actuator movement.
摘要翻译：一种用于测量到目标工作表面的距离以精确地定位联接到致动器的工具组件的系统和方法。该方法包括使用距离传感器测量到工作表面的距离，将工具组件移动到接近位置，接近位置与工作表面上的位置相邻。然后，根据软着陆程序，将工具组件从接近位置移动到工作表面上的位置。软着陆程序可以包括确定工具组件已经移动到与目标工作表面的软接触。方法还包括拓扑地映射工作表面，将地图数据与预定义数据进行比较，以及调整定位程序。此外，方法包括优化致动器运动以及时地测量从距离传感器到工作表面上的位置的距离，同时具有最小的致动器运动。

2. 发明申请

WO2009134708A1 DYNAMIC METROLOGY METHODS AND SYSTEMS 审中-公开
标题翻译：动态计量学方法与系统
公开(公告)号：WO2009134708A1
公开(公告)日：2009-11-05
申请号：PCT/US2009/041777
申请日：2009-04-27
申请人： UNIVERSITY OF NORTH CAROLINA AT CHARLOTTE , SMITH, Kevin, Scott , HOCKEN, Robert, J.
发明人： SMITH, Kevin, Scott , HOCKEN, Robert, J.
IPC分类号： G06F19/00
CPC分类号： G05B19/401 , G05B2219/37275 , G05B2219/37388
摘要： The present invention provides dynamic metrology methods and systems for: periodically determining an actual position of one or more of a machine and a tool with respect to a workpiece using one or more laser interferometers; tracking a tracked position of the one or more of the machine and the tool with respect to the workpiece using one or more accelerometers; and altering a controlled position of the one or more of the machine and the tool with respect to the workpiece when either the actual position or the tracked position of the one or more of the machine and the tool with respect to the workpiece diverges from a desired position of one or more of the machine and the tool with respect to the workpiece.
摘要翻译：本发明提供了动态计量方法和系统，用于：使用一个或多个激光干涉仪周期性地确定机器和工具中的一个或多个相对于工件的实际位置; 使用一个或多个加速度计跟踪相对于工件的机器和工具中的一个或多个的跟踪位置; 以及当机器和工具中的一个或多个相对于工件的实际位置或跟踪位置相对于工件偏离期望的位置时，改变机器和工具中的一个或多个相对于工件的受控位置一个或多个机器和工具相对于工件的位置。

3. 发明申请

WO1990004223A1 PROCESS AND DEVICE FOR SURFACE MACHINING BY MEANS OF ELECTROMAGNETIC RADIATION 审中-公开
标题翻译：通过电磁辐射进行表面加工的工艺和装置
公开(公告)号：WO1990004223A1
公开(公告)日：1990-04-19
申请号：PCT/DE1989000644
申请日：1989-10-10
申请人： VAN DIJK, Johannes, Wilhelmus
IPC分类号： G05B19/42
CPC分类号： G05B19/4205 , G05B2219/37275 , G05B2219/45165
摘要： The graphic elements of a document are reproduced on the surface of a workpiece (5) that is machined by focussed electromagnetic radiation (11), in particular laser radiation. In an installation for scanning the document and for machining the surface of the workpiece (5), the document, for example a drawing, is first scanned by electromagnetic radiation and an electronic reproduction of the document is prepared in the control and memory unit (16) that controls the installation. The surface of the workpiece (5) that takes the place of the document is machined according to this electronic reproduction. The same radiation guiding (3, 4) and focussing means (2), controlled by the same programme, are used for scanning and for machining. The machining process can be repeated on a plurality of workpieces (5). Small errors in the reproduction of the optical elements used in the focussing means (2) do not affect the quality of the reproduction. Only simple programmes are required for electronically controlling the installation. It is possible to include various quality control means in this process and in the corresponding devices.

4. 发明申请

WO0237196A2 LOCATION AND IDENTIFICATION SYSTEMS 审中-公开
标题翻译：位置和识别系统
公开(公告)号：WO0237196A2
公开(公告)日：2002-05-10
申请号：PCT/GB0104907
申请日：2001-11-06
申请人： ABLETT & STEBBING , STERN IVAN
发明人： STERN IVAN
IPC分类号： G05B19/12 , G05B19/00
CPC分类号： G05B19/128 , G05B2219/31304 , G05B2219/31432 , G05B2219/37275 , G05B2219/37558 , Y02P90/10
摘要： The present invention concerns a system for location of items within a facility, the system comprising providing a computer device (2) with information as to said items and as to a location (11) within said facility to which said items should be moved for use, storage or distribution, and illumination means (3, 4), operated under the control of said computer device, capable of illuminating said items and of illuminating, for each item, said location.
摘要翻译：本发明涉及一种用于在设施内的物品定位的系统，该系统包括向计算机设备（2）提供关于所述物品的信息以及所述物品应移动到所述设施内的位置（11）以供使用，存储或分配以及在所述计算机设备的控制下操作的照明装置（3,4）能够照亮所述物品并且对于每个物品照亮所述位置。

5. 发明申请

WO01083171A1 SELF TEACHING ROBOTIC WAFER HANDLING SYSTEM 审中-公开
标题翻译：自我教学机器人处理系统
公开(公告)号：WO01083171A1
公开(公告)日：2001-11-08
申请号：PCT/US2001/013972
申请日：2001-04-30
IPC分类号： B25J9/16 , B25J9/18 , B25J9/22 , H01L21/00 , H01L21/677 , H01L21/68
CPC分类号： H01L21/67265 , B25J9/1692 , G05B2219/37275 , G05B2219/39024 , G05B2219/39048 , G05B2219/39056 , G05B2219/40623 , G05B2219/45031 , H01L21/67766
摘要： A wafer handling apparatus (10) having input and output robotic systems directed by a programmed controller (32). The controller (32) is pre-programmed with approximate physical dimensions of the system components and their relative positions, and additionally programmed to automatically perform a precision calibration/teaching routine to gather more precise location data.
摘要翻译：一种具有由编程控制器（32）引导的输入和输出机器人系统的晶片处理装置（10）。控制器（32）用系统组件的近似物理尺寸及其相对位置进行预编程，并且还被编程为自动执行精密校准/教学例程以收集更精确的位置数据。

6. 发明申请

WO1988008355A1 NUMERICAL CONTROLLER FOR LASER 审中-公开
标题翻译：激光数控系统
公开(公告)号：WO1988008355A1
公开(公告)日：1988-11-03
申请号：PCT/JP1988000428
申请日：1988-04-28
申请人： FANUC LTD , KARUBE, Norio , MANABE, Mitsuo
发明人： FANUC LTD
IPC分类号： B23K26/00
CPC分类号： B23K26/0853 , G05B19/414 , G05B2219/37275
摘要： A numerical controller for laser comprising a laser oscillator (1), a power source (3) for driving the laser oscillator, and a numerical controller (CNC) (5). The numerical controller for laser includes means for controlling the sequence of the laser oscillator, output control means for controlling the output condition of the laser oscillator, feedback control means for the output of the laser oscillator, and indication control means for indicating the condition of the laser oscillator. The numerical controller for laser which is small in size and simple in construction is realized by combining the laser oscillator (1), power source (3) and numerical controller (5) together as a unitary structure.

7. 发明申请

WO2019141884A1 MÉTODO PARA LA AUTO-VERIFICACIÓN DE SISTEMAS MECATRÓNICOS 审中-公开
公开(公告)号：WO2019141884A1
公开(公告)日：2019-07-25
申请号：PCT/ES2018/070048
申请日：2018-01-22
申请人： FUNDACIÓN TEKNIKER
发明人： MUTILBA LARREA, Unai , GOMEZ-ACEDO BILBAO, Eneko , OLARRA URBERUAGA, Aitor , KORTABERRIA BERRIOZABAL, Gorka
IPC分类号： G05B19/401
CPC分类号： G05B19/401 , G05B2219/37027 , G05B2219/37275
摘要： Un método para determinar el rendimiento de error volumétrico de un sistema mecatrónico (20, 20') movible que comprende: definir (31) una nube de puntos volumétrica (25) que representa el espacio de trabajo volumétrico del sistema mecatrónico (20, 20'), comprendiendo dicha nube de puntos volumétrica (25) N puntos; conectar (32) un dispositivo de medición (21) al sistema mecatrónico (20, 20'); fijar (33) M puntos fiduciales (24) que rodean el sistema mecatrónico (20, 20'), en el que M>3; definir (34) un sistema de referencia común para el sistema mecatrónico (20, 20'), el dispositivo de medición (21) y los M puntos fiduciales (24); mover secuencialmente el dispositivo de medición (21) a cada uno de los N puntos de la nube de puntos volumétrica (25) y, desde cada posición en la nube de puntos volumétrica (25), obtener (35) un valor de distancia (D ij ) a cada uno de los M puntos fiduciales (24); procesar dichos N x M valores de distancia D ij aplicando un enfoque de multilateración (37) para obtener (38) la coordenadas reales de cada una de las N posiciones reales a las que se ha movido el dispositivo de medición (21). Sistema de medición.

8. 发明申请

WO0239794A9 SYSTEM AND METHOD FOR FABRICATING PRINTED CIRCUIT BOARDS 审中-公开
标题翻译：制作印刷电路板的系统和方法
公开(公告)号：WO0239794A9
公开(公告)日：2011-08-11
申请号：PCT/IL0101028
申请日：2001-11-06
申请人： ORBOTECH LTD
发明人： BEN-EZRA BARRY , GROSS ABRAHAM , GINO HANAN , KLING BORIS , ALON DAN , KANTOR ZEEV , GANOT AMNON
IPC分类号： G03F9/00 , H05K1/02 , H05K3/00 , H05K3/46
CPC分类号： G03F9/00 , G05B2219/37275 , G05B2219/37563 , G05B2219/45035 , H05K1/0269 , H05K3/0008 , H05K3/0035 , H05K3/0082 , H05K3/4652 , H05K2201/09063 , H05K2201/09918
摘要： A method of recording aligned images on two sides of a printed circuit board substrate, comprising: recording and image of an electrical circuit pattern on a first side of a printed circuit board substrate (804); forming an alignment pattern on a side of the printed circuit board substrate, wherein said alignment pattern has a known spatial relationship to said image of an electrical circuit pattern; determining a location of the alignment pattern on the printed circuit board substrate (812, 814); and recording an image of an electrical circuit pattern on a second side of the printed circuit board substrate (818) in response to the determined location of the alignment pattern (816).
摘要翻译：一种在印刷电路板基板的两面上记录对准图像的方法，包括：在印刷电路板基板的第一面上记录和图像电路图案; 在所述印刷电路板基板的一侧形成对准图案，其中所述对准图案与电路图案的所述图像具有已知的空间关系; 确定所述对准图案在所述印刷电路板基板（812,814）上的位置; 以及响应于所确定的所述对准图案（816）的位置，在所述印刷电路板基板（818）的第二面上记录电路图案的图像。

9. 发明申请

WO00003312A1 PROCESS AND SYSTEM FOR COMPENSATING STATIC ERRORS ON NUMERICALLY CONTROLLED MACHINE TOOLS 审中-公开
标题翻译：对数控机床的静态误差进行补偿的过程和系统
公开(公告)号：WO00003312A1
公开(公告)日：2000-01-20
申请号：PCT/IT1999/000205
申请日：1999-07-05
IPC分类号： G05B19/404
CPC分类号： G05B19/404 , G05B2219/37275 , G05B2219/37506
摘要： A system and a process are described for performing the Static Error Compensation on numerically controlled machine tools. The process comprises the steps of: connecting a measuring laser device (5) to a numerically controlled machine tool (1); automatically sending a point 0 of the machine (1) to the laser device (5); sending commands for taking m measure points of the machine (1) from the control (3) to the laser device (5); automatically detecting the measure points and sending consolidated data from the laser device (5) to the control (3); producing a model of static errors of the machine (1); executing the Static Error Compensation depending on said produced model.
摘要翻译：描述了一种用于在数控机床上执行静态误差补偿的系统和过程。该方法包括以下步骤：将测量激光装置（5）连接到数控机床（1）; 自动将机器（1）的点0发送到激光装置（5）; 发送用于将所述机器（1）的测量点从所述控制（3）到所述激光装置（5）的命令; 自动检测测量点，并将激光装置（5）的合并数据发送到控制装置（3）; 产生机器的静态误差模型（1）; 根据所产生的模型执行静态误差补偿。

10. 发明申请

WO1988006947A1 MACHINING CENTER 审中-公开
标题翻译：加工中心
公开(公告)号：WO1988006947A1
公开(公告)日：1988-09-22
申请号：PCT/JP1988000248
申请日：1988-03-10
申请人： KITAMURA MACHINERY CO., LTD. , KITAMURA, Koichiro
发明人： KITAMURA MACHINERY CO., LTD.
IPC分类号： B23Q17/20
CPC分类号： B23Q17/20 , G05B19/18 , G05B2219/37038 , G05B2219/37207 , G05B2219/37275 , G05B2219/37405 , G05B2219/37617 , G05B2219/50171 , G05B2219/50252 , Y10S33/21 , Y10T29/5107 , Y10T409/303864
摘要： In order to process a work and then determine the shape thereof according to a conventional method, two machines, i.e. a machining tool and a three-dimensional measuring apparatus are required. In order to eliminate this drawback, a machining center of the present invention is provided with a length measuring machine (16) and a probe unit (3) for use in determining the shape of a work (W) on a table (15). The probe unit (3) and work (W) are moved relatively by first to third driving means (31, 30, 24). After the work (W) has been processed with a tool, the shape of the work (W) is determined with the probe unit (3).

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