专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2011106751A8 ELECTRIC DISCHARGE PROTECTION FOR SURFACE MOUNTED AND EMBEDDED COMPONENTS 审中-公开
标题翻译：表面安装和嵌入式组件的电气放电保护
公开(公告)号：WO2011106751A8
公开(公告)日：2011-09-01
申请号：PCT/US2011/026389
申请日：2011-02-26
申请人： SHOCKING TECHNOLOGIES, INC. , KOSOWSKY, Lex , FLEMING, Robert , GRAYDON, Bhret , VASQUEZ, Daniel
发明人： KOSOWSKY, Lex , FLEMING, Robert , GRAYDON, Bhret , VASQUEZ, Daniel
IPC分类号： H05K1/09
摘要： Printed circuit boards including voltage switchable dielectric materials (VSDM) are disclosed. The VSDMs are used to protect electronic components, arranged on or embedded in printed circuit boards, against electric discharges, such as electrostatic discharges or electric overstresses. During an overvoltage event, a VSDM layer shunts excess currents to ground, thereby preventing electronic components from destruction or damage.
摘要翻译：公开了包括电压可切换介电材料（VSDM）的印刷电路板。 VSDM用于保护布置在印刷电路板上或嵌入印刷电路板中的电子元件，防止放电（如静电放电或电气超负荷）。在过压事件期间，VSDM层将过量电流分流到地，从而防止电子组件被破坏或损坏。

2. 发明申请

WO2009129188A1 SUBSTRATE DEVICE OR PACKAGE USING EMBEDDED LAYER OF VOLTAGE SWITCHABLE DIELECTRIC MATERIAL IN A VERTICAL SWITCHING CONFIGURATION 审中-公开
标题翻译：在垂直切换配置中使用电压可切换介质材料的嵌入层的衬底器件或封装
公开(公告)号：WO2009129188A1
公开(公告)日：2009-10-22
申请号：PCT/US2009/040384
申请日：2009-04-13
申请人： SHOCKING TECHNOLOGIES, INC. , KOSOWSKY, Lex , FLEMING, Robert , GRAYDON, Bhret
发明人： KOSOWSKY, Lex , FLEMING, Robert , GRAYDON, Bhret
IPC分类号： H05K1/02
CPC分类号： H05K1/0257 , H05K1/0259 , H05K1/0373 , H05K2201/0738 , H05K2203/105
摘要： A substrate device includes an embedded layer of VSD material (230) that overlays a conductive element or layer (240) to provide a ground. An electrode (210), connected to circuit elements that are to be protected, extends into the thickness of the substrate to make contact with the VSD layer. When the circuit elements are operated under normal voltages, the VSD layer is dielectric and not connected to ground. When a transient electrical event occurs on the circuit elements, the VSD layer switches instantly to a conductive state, so that the first electrode is connected to ground.
摘要翻译：衬底器件包括覆盖导电元件或层（240）以提供接地的VSD材料（230）的嵌入层。连接到要被保护的电路元件的电极（210）延伸到基板的厚度以与VSD层接触。当电路元件在正常电压下工作时，VSD层是电介质的，不连接到地。当在电路元件上发生瞬态电事件时，VSD层立即切换到导通状态，使得第一电极连接到地。

3. 发明申请

WO2010110909A1 COMPONENTS HAVING VOLTAGE SWITCHABLE DIELECTRIC MATERIALS 审中-公开
标题翻译：具有电压可切换介质材料的组件
公开(公告)号：WO2010110909A1
公开(公告)日：2010-09-30
申请号：PCT/US2010/000906
申请日：2010-03-25
申请人： SHOCKING TECHNOLOGIES, INC. , KOSOWSKY, Lex , FLEMING, Robert , GRAYDON, Bhret
发明人： KOSOWSKY, Lex , FLEMING, Robert , GRAYDON, Bhret
IPC分类号： H05K1/02 , H01C7/12 , H05K1/16
CPC分类号： H05K1/0257 , H01C1/142 , H01C1/148 , H01C7/1006 , H05K1/0259 , H05K1/0373 , H05K1/167 , H05K2201/0738
摘要： Various aspects provide for structures and devices to protect against spurious electrical events (e.g., electrostatic discharge). Some embodiments incorporate a voltage switchable dielectric material (VSDM) bridging a gap between two conductive pads. Normally insulating, the VSDM may conduct current from one pad to the other during a spurious electrical event (e.g,. shunting current to ground). Some aspects include gaps having a gap width that is greater than 50% of a spacing between electrical leads connected to the pads. Some devices include single layers of VSDM. Some devices include multiple layers of VSDM. Various devices may be designed to increase a ratio of active volume (of VSDM) to inactive volume.
摘要翻译：各种方面提供了用于防止假电气事件（例如静电放电）的结构和装置。一些实施例包括桥接两个导电焊盘之间的间隙的可开关电介质材料（VSDM）。通常绝缘，在寄生电气事件（例如，将电流分流到地）期间，VSDM可以将电流从一个焊盘传导到另一个焊盘。一些方面包括间隙宽度大于连接到焊盘的电引线间距的50％的间隙。一些设备包括VSDM的单层。一些设备包括多层VSDM。可以设计各种设备以增加活动体积（VSDM）与非活动体积的比率。

4. 发明申请

WO2011149989A1 CIRCUIT ELEMENTS COMPRISING FERROIC MATERIALS 审中-公开
标题翻译：包含耐火材料的电路元件
公开(公告)号：WO2011149989A1
公开(公告)日：2011-12-01
申请号：PCT/US2011/037813
申请日：2011-05-24
申请人： SHOCKING TECHNOLOGIES, INC. , FLEMING, Robert , GRAYDON, Bhret , VASQUEZ, Daniel , WU, Junjun , RAZAVI, Farhad
发明人： FLEMING, Robert , GRAYDON, Bhret , VASQUEZ, Daniel , WU, Junjun , RAZAVI, Farhad
IPC分类号： H01L21/28
CPC分类号： H01L28/10 , H01L45/00
摘要： Ferroic circuit elements that include a set of conductive structures that are at least partially embedded within a ferroic medium are disclosed. The ferroic medium may be a voltage switched dielectric material that includes ferroic particles in accordance with various embodiments. A ferroic circuit element may be at least partially embedded within a substrate in accordance with embodiments of the current invention as an embedded ferroic circuit element. An embedded ferroic circuit element that is an inductor in accordance with embodiments of the current invention may be denoted as an embedded ferroic inductor. An embedded ferroic circuit element that is a capacitor in accordance with embodiments of the current invention may be denoted as an embedded ferroic capacitor.
摘要翻译：公开了包括至少部分地嵌入在铁介质内的一组导电结构的铁电回路元件。铁介质可以是根据各种实施方案的包括铁粉的电压切换电介质材料。根据本发明的实施例，铁电电路元件可以至少部分地嵌入衬底内，作为嵌入式铁电元件。根据本发明的实施例的作为电感器的嵌入式铁电元件可以表示为嵌入式铁电感器。根据本发明的实施例的作为电容器的嵌入式铁电元件可以表示为嵌入式铁电容器。

5. 发明申请

WO2013044096A2 VERTICAL SWITCHING FORMATIONS FOR ESD PROTECTION 审中-公开
标题翻译：用于ESD保护的垂直切换形式
公开(公告)号：WO2013044096A2
公开(公告)日：2013-03-28
申请号：PCT/US2012/056663
申请日：2012-09-21
申请人： SHOCKING TECHNOLOGIES, INC. , FLEMING, Robert , GLICKMAN, Michael , GRAYDON, Bhret , WU, Junjun , VASQUEZ, Daniel
发明人： FLEMING, Robert , GLICKMAN, Michael , GRAYDON, Bhret , WU, Junjun , VASQUEZ, Daniel
IPC分类号： H01L27/04
CPC分类号： H01L27/0288 , H01L23/5252 , H01L23/60 , H01L2924/0002 , H05K1/0257 , H05K1/0259 , H05K1/16 , H05K2201/0738 , H01L2924/00
摘要： Embodiments disclosed herein generally relate to structures, methods and devices employing a voltage switchable dielectric material to achieve vertical and/or dual switching protection against ESD and other overvoltage events.
摘要翻译：本文公开的实施例一般涉及采用可切换电介质材料以实现ESD和其它过电压事件的垂直和/或双重开关保护的结构，方法和装置。

6. 发明申请

WO2007130870A2 CONDUCTIVE STIFFENER FOR A FLEXIBLE SUBSTRATE 审中-公开
标题翻译：柔性基板的导电性强化剂
公开(公告)号：WO2007130870A2
公开(公告)日：2007-11-15
申请号：PCT/US2007/067674
申请日：2007-04-27
申请人： FLEXTRONICS AP, LLC , GRAYDON, Bhret , FRANDRUP, Steve
发明人： GRAYDON, Bhret , FRANDRUP, Steve
IPC分类号： B32B37/12 , B31B45/00
CPC分类号： H05K1/118 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H05K1/0218 , H05K1/0393 , H05K3/0061 , H05K3/321 , H05K3/386 , H05K2201/09554 , H05K2201/10977 , H05K2201/2009 , Y10T428/13 , Y10T428/28 , H01L2924/00
摘要： A structure is disclosed for connecting an electrically-connectable metal stiffener to a ground connection within a flexible substrate, the stiffener comprising nickel-gold plated stainless steel. In one embodiment the stiffener is secured to the flexible substrate by a non-conducting adhesive which includes an opening over a ground connection, the adhesive opening being filled by a conductive epoxy. A sequence for applying the disclosed materials discloses a method for attaching the stiffening structure to the flexible substrate.
摘要翻译：公开了用于将可电连接的金属加强件连接到柔性基板内的接地连接件的结构，该加强件包括镀镍的不锈钢。在一个实施例中，加强件通过非导电粘合剂固定到柔性基底上，该非导电粘合剂包括在接地连接上的开口，粘合剂开口由导电环氧树脂填充。用于应用所公开的材料的顺序公开了一种将加强结构附接到柔性基底的方法。

7. 发明申请

WO2008105980A1 ATTACHING PASSIVE COMPONENTS BETWEEN LAYERS OF A PCB 审中-公开
标题翻译：连接PCB层之间的被动组件
公开(公告)号：WO2008105980A1
公开(公告)日：2008-09-04
申请号：PCT/US2007/088951
申请日：2007-12-27
申请人： FLEXTRONICS AP, LLC , GRAYDON, Bhret , SHU, William Kuang-hue
发明人： GRAYDON, Bhret , SHU, William Kuang-hue
IPC分类号： H01L23/58
CPC分类号： H05K1/184 , H05K1/113 , H05K1/186 , H05K3/3442 , H05K3/4046 , H05K2201/10583 , H05K2201/10636 , Y02P70/611 , Y10T29/49126 , Y10T29/4913
摘要： A pre-drilled hole, providing a passageway between an upper and a lower surface of a printed circuit board layer, receives a passive component, for example a resistor or a capacitor. In one embodiment the component is cylindrical, with an electrically conductive contact point at each end. The hole diameter is approximately the same as the diameter of the cylindrical component. The hole is similar to a via in a printed circuit board, except that the hole is not plated through (such would cause an electrical short). Electrically conductive lines are provided to the openings of the hole on the upper and the lower surfaces of the PCB. The area of the exposed end of the cylindrical component and the termination of the conducting line is less than the area of a surface mounted component equivalent to the cylindrical component. In some embodiments the hole and inserted component are located directly below a pin pad for a surface mounted device, for example an integrated circuit, providing the equivalent of zero wire and line lengths with no net increase in printed circuit board area.
摘要翻译：在印刷电路板层的上表面和下表面之间提供通道的预钻孔接收无源部件，例如电阻器或电容器。在一个实施例中，部件是圆柱形的，在每个端部具有导电接触点。孔直径与圆柱形部件的直径大致相同。该孔与印刷电路板中的通孔类似，不同之处在于孔不通电（这将导致电气短路）。导电线设置在PCB的上表面和下表面上的孔的开口处。圆柱形部件的露出端的面积和导线的终端小于与圆柱形部件相当的表面安装部件的面积。在一些实施例中，孔和插入部件直接位于用于表面安装器件（例如集成电路）的针焊盘的正下方，提供零线和线长度的等效线，而印刷电路板面积没有增加。

8. 发明申请

WO2008105979A1 ATTACHING PASSIVE COMPONENTS TO A SEMICONDUCTOR DIE 审中-公开
标题翻译：将被动元件连接到半导体芯片上
公开(公告)号：WO2008105979A1
公开(公告)日：2008-09-04
申请号：PCT/US2007/088949
申请日：2007-12-27
申请人： FLEXTRONICS AP, LLC , GRAYDON, Bhret , SHU, William Kuang-hue
发明人： GRAYDON, Bhret , SHU, William Kuang-hue
IPC分类号： H01L23/00
CPC分类号： H01L23/647 , H01L23/642 , H01L24/29 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/83 , H01L25/50 , H01L2224/05554 , H01L2224/0603 , H01L2224/29101 , H01L2224/2919 , H01L2224/48091 , H01L2224/48227 , H01L2224/48265 , H01L2224/48465 , H01L2224/4911 , H01L2224/49429 , H01L2224/81205 , H01L2224/81801 , H01L2224/838 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01029 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19104 , H01L2924/30105 , H01L2924/30107 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： An external component, typically a surface mount passive, is attached to a semiconductor die. In some embodiments the passive is placed directly over exposed pads on the semiconductor die and attached using conductive tape or conductive epoxy. In some embodiments the passive is attached to the semiconductor die using non-conductive adhesive and wire bonded to bond pads on the semiconductor die and / or to pads on a substrate to which the semiconductor die is attached.
摘要翻译：通常是表面安装无源的外部组件附接到半导体管芯。在一些实施例中，将被动物直接放置在半导体管芯上的暴露焊盘上，并使用导电带或导电环氧树脂附着。在一些实施例中，使用非导电粘合剂和引线键合到半导体管芯上的接合焊盘和/或连接到半导体管芯的衬底上的焊盘，将被动附接到半导体管芯。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式