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1. 发明申请

WO2015125046A1 LIGHT-EMITTING DEVICE AND PEELING METHOD 审中-公开
标题翻译：发光装置和剥离方法
公开(公告)号：WO2015125046A1
公开(公告)日：2015-08-27
申请号：PCT/IB2015/051007
申请日：2015-02-11
申请人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
发明人： SAKUISHI, Tatsuya , UCHIDA, Yutaka , ADACHI, Hiroki , EGUCHI, Saki , YANAKA, Junpei , KUMAKURA, Kayo , YASUMOTO, Seiji , YOKOYAMA, Kohei , CHIDA, Akihiro
IPC分类号： H01L21/02 , H01L27/12 , H01L51/50 , H05B33/02 , H05B33/04 , H05B33/10
CPC分类号： H01L51/0097 , B32B7/02 , B32B7/06 , B32B7/12 , B32B15/08 , B32B15/18 , B32B15/20 , B32B17/00 , B32B17/06 , B32B27/20 , B32B27/286 , B32B27/30 , B32B27/325 , B32B27/34 , B32B27/36 , B32B27/365 , B32B37/02 , B32B37/10 , B32B37/1292 , B32B37/18 , B32B38/10 , B32B2250/05 , B32B2255/20 , B32B2260/021 , B32B2260/046 , B32B2264/102 , B32B2307/202 , B32B2307/40 , B32B2307/50 , B32B2307/536 , B32B2307/558 , B32B2310/0843 , B32B2315/08 , B32B2457/20 , H01L51/003 , H01L51/5253 , H01L2251/5338 , Y02E10/549 , Y02P70/521
摘要： A flexible device is provided. The hardness of a bonding layer of the flexible device is set to be higher than Shore D of 70, or preferably higher than or equal to Shore D of 80. The coefficient of expansion of a flexible substrate of the flexible device is set to be less than 58 ppm/°C, or preferably less than or equal to 30 ppm/°C.
摘要翻译：提供了灵活的设备。柔性装置的粘合层的硬度设定为高于70°的肖氏D值，或优选高于或等于邵氏D的80°。挠性装置的柔性基板的膨胀系数设定得较小比58ppm /℃，或优选小于或等于30ppm /℃。

2. 发明申请

WO2015033944A1 BONDING APPARATUS AND STACK BODY MANUFACTURING APPARATUS 审中-公开
标题翻译：连接装置和堆叠体制造装置
公开(公告)号：WO2015033944A1
公开(公告)日：2015-03-12
申请号：PCT/JP2014/073117
申请日：2014-08-27
申请人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
发明人： OHNO, Masakatsu , HIRAKATA, Yoshiharu , EGUCHI, Shingo , JINBO, Yasuhiro , IKEDA, Hisao , YOKOYAMA, Kohei , ADACHI, Hiroki , IDOJIRI, Satoru
IPC分类号： H01L21/02 , G02F1/13 , H01L21/683 , H01L51/50 , H05B33/02 , H05B33/10
CPC分类号： B32B37/0046 , B32B17/10431 , B32B27/08 , B32B27/20 , B32B27/36 , B32B37/0015 , B32B37/003 , B32B37/1284 , B32B38/0008 , B32B38/18 , B32B38/1841 , B32B38/1858 , B32B2264/102 , B32B2264/105 , B32B2309/68 , B32B2457/14 , B32B2457/20 , H01L2224/01 , Y10T156/15 , Y10T156/1798
摘要： A yield in the step of bonding two members together is improved. A bonding apparatus includes a stage capable of supporting a first member having a sheet-like shape, a fixing mechanism capable of fixing one end portion of a second member having a sheet-like shape so that the second member overlaps with the first member, and a pressurizing mechanism capable of moving from a side of the one end portion of the second member to a side of the other end portion and spreading a bonding layer under pressure between the first member and the second member. The first member and the second member are bonded to each other.
摘要翻译：提高了将两个部件结合在一起的步骤中的产量。接合装置包括能够支撑具有片状形状的第一构件的台，能够固定具有片状形状的第二构件的一个端部以使第二构件与第一构件重叠的固定机构，以及加压机构能够从所述第二部件的一个端部的一侧移动到所述另一个端部的一侧，并且在所述第一部件和所述第二部件之间在压力下铺展粘合层。第一构件和第二构件彼此结合。

3. 发明申请

WO2009031482A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：WO2009031482A1
公开(公告)日：2009-03-12
申请号：PCT/JP2008/065620
申请日：2008-08-25
申请人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD. , AOKI, Tomoyuki , TSURUME, Takuya , ADACHI, Hiroki , HORIKOSHI, Nozomi , OHTANI, Hisashi
发明人： AOKI, Tomoyuki , TSURUME, Takuya , ADACHI, Hiroki , HORIKOSHI, Nozomi , OHTANI, Hisashi
IPC分类号： H01L23/29 , G06K19/07 , G06K19/077 , H01L21/02 , H01L21/336 , H01L21/56 , H01L23/31 , H01L27/12 , H01L29/786
CPC分类号： H01L23/29 , G06K19/07749 , H01L21/563 , H01L23/145 , H01L23/295 , H01L23/3121 , H01L23/60 , H01L23/66 , H01L27/1214 , H01L27/1266 , H01L27/13 , H01L2223/6677 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/09701 , H01L2924/12032 , H01L2924/12044 , H01L2924/19041 , H01L2924/3025 , Y10T428/31522 , H01L2924/00
摘要： A separation layer and a semiconductor element layer including a thin film transistor are formed. A conductive resin electrically connected to the semiconductor element layer is formed. A first sealing layer including a fiber and an organic resin layer is formed over the semiconductor element layer and the conductive resin. A groove is formed in the first sealing layer, the semiconductor element layer, and the separation layer. A liquid is dropped into the groove to separate the separation layer and the semiconductor element layer. The first sealing layer over the conductive resin is removed to form an opening. A set of the first sealing layer and the semiconductor element layer is divided into a chip. The chip is bonded to an antenna formed over a base material. A second sealing layer including a fiber and an organic resin layer is formed so as to cover the antenna and the chip.
摘要翻译：形成包括薄膜晶体管的分离层和半导体元件层。形成与半导体元件层电连接的导电树脂。包含纤维和有机树脂层的第一密封层形成在半导体元件层和导电树脂上。在第一密封层，半导体元件层和分离层中形成凹槽。将液体滴入槽中以分离分离层和半导体元件层。去除导电树脂上的第一密封层以形成开口。一组第一密封层和半导体元件层被分成芯片。芯片结合到形成在基材上的天线。形成包括纤维和有机树脂层的第二密封层，以覆盖天线和芯片。

4. 发明申请

WO2017025836A1 DISPLAY PANEL, DATA PROCESSING DEVICE, AND METHOD FOR MANUFACTURING DISPLAY PANEL 审中-公开
标题翻译：显示面板，数据处理装置以及制造显示面板的方法
公开(公告)号：WO2017025836A1
公开(公告)日：2017-02-16
申请号：PCT/IB2016/054436
申请日：2016-07-26
申请人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
发明人： YASUMOTO, Seiji , ADACHI, Hiroki , SATO, Masataka , KUSUNOKI, Koji , HIRAKATA, Yoshiharu
IPC分类号： G09F9/46 , G02F1/1333 , G02F1/1335 , G02F1/1368 , G09F9/00 , G09F9/30 , H01L21/336 , H01L27/32 , H01L29/786
CPC分类号： H01L27/3267 , G02F1/133553 , G02F1/136227 , G02F1/136286 , G02F1/1368 , G06F3/01 , G09G3/2092 , G09G3/3648 , G09G5/34 , G09G2300/023 , G09G2300/046 , G09G2300/0465 , G09G2310/0205 , G09G2320/0242 , G09G2320/0626 , G09G2320/066 , G09G2320/0666 , G09G2320/103 , G09G2330/021 , G09G2340/0435 , G09G2360/144 , H01L27/1225 , H01L27/1237 , H01L27/124 , H01L27/1248 , H01L27/1255 , H01L27/1262 , H01L27/3258 , H01L27/3262 , H01L27/3276 , H01L29/78648 , H01L29/7869 , H01L29/78696 , H01L2227/323 , H01L2251/533
摘要： A novel display panel that is highly convenient or reliable is provided. A structure in invented which includes a first display element, a first conductive film, a second conductive film, a first insulating film, an intermediate film, a pixel circuit, and a second display element. The first conductive film is electrically connected to the first display element. The second conductive film includes a region overlapping with the first conductive film. The first insulating film includes a region located between the second conductive film and the first conductive film. The first conductive film is located between the second conductive film and part of the intermediate film. The pixel circuit is electrically connected to the second conductive film. The second display element is electrically connected to the pixel circuit. The first insulating film has an opening. The second conductive film is electrically connected to the first conductive film through the opening.
摘要翻译：提供了一种非常方便或可靠的新型显示面板。本发明的一种结构包括第一显示元件，第一导电膜，第二导电膜，第一绝缘膜，中间膜，像素电路和第二显示元件。第一导电膜电连接到第一显示元件。第二导电膜包括与第一导电膜重叠的区域。第一绝缘膜包括位于第二导电膜和第一导电膜之间的区域。第一导电膜位于第二导电膜和中间膜的一部分之间。像素电路与第二导电膜电连接。第二显示元件电连接到像素电路。第一绝缘膜具有开口。第二导电膜通过开口与第一导电膜电连接。

5. 发明申请

WO2012108366A1 LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF, LIGHTING DEVICE, AND DISPLAY DEVICE 审中-公开
标题翻译：发光装置及其制造方法，照明装置和显示装置
公开(公告)号：WO2012108366A1
公开(公告)日：2012-08-16
申请号：PCT/JP2012/052568
申请日：2012-01-30
申请人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD. , TANADA, Yoshifumi , SAKAMOTO, Naoya , ADACHI, Hiroki , EGUCHI, Shingo , ONO, Koji , YOSHIZUMI, Kensuke , SHINODA, Hiroto
发明人： TANADA, Yoshifumi , SAKAMOTO, Naoya , ADACHI, Hiroki , EGUCHI, Shingo , ONO, Koji , YOSHIZUMI, Kensuke , SHINODA, Hiroto
IPC分类号： H05B33/26 , G09F9/30 , H01L27/32 , H01L51/50 , H05B33/10 , H05B33/12 , H05B33/22
CPC分类号： H01L51/5212 , H01L27/3279 , H01L51/5228 , H01L2251/5361
摘要： The present invention focuses on a structure in which an auxiliary wiring for increasing the conductivity of an upper electrode is provided on the substrate side. The conductive auxiliary wiring of a light-emitting device is provided over a substrate, and an upper portion of the auxiliary wiring protrudes in a direction parallel to the substrate. Further, an EL layer formed in a region including a lower electrode layer and the auxiliary wiring is physically divided by the auxiliary wiring. An upper electrode layer formed in a manner similar to that of the lower electrode layer may be electrically connected to at least part of a side surface of the auxiliary wiring. Such an auxiliary wiring may be used in a lighting device and a display device.
摘要翻译：本发明的重点是在基板侧设置用于提高上部电极的导电性的辅助布线的结构。发光装置的导电辅助布线设置在基板上，并且辅助布线的上部在平行于基板的方向上突出。此外，在包括下电极层和辅助布线的区域中形成的EL层在物理上被辅助布线分开。以类似于下电极层的方式形成的上电极层可以电连接到辅助布线的侧表面的至少一部分。这种辅助布线可以用在照明装置和显示装置中。

6. 发明申请

WO2017064587A1 DISPLAY PANEL, INPUT/OUTPUT DEVICE, DATA PROCESSOR, AND METHOD FOR MANUFACTURING DISPLAY PANEL 审中-公开
标题翻译：显示面板，输入/输出设备，数据处理器和用于制造显示面板的方法
公开(公告)号：WO2017064587A1
公开(公告)日：2017-04-20
申请号：PCT/IB2016/055898
申请日：2016-10-03
申请人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
发明人： NAKADA, Masataka , KATAYAMA, Masahiro , YASUMOTO, Seiji , ADACHI, Hiroki , SATO, Masataka , KUSUNOKI, Koji , HIRAKATA, Yoshiharu
IPC分类号： G09F9/30 , G06F3/041 , G06F3/044 , G09F9/00
CPC分类号： G02F1/136286 , G02F1/13338 , G06F3/0412 , G06F2203/04103 , H01L27/1225 , H01L27/124 , H01L27/1255
摘要： Provided is a novel display panel that is highly convenient or highly reliable, a novel input/output device that is highly convenient or highly reliable, or a method for manufacturing a novel display panel that is highly convenient or highly reliable. The present inventors conceived a structure including a first intermediate film, a first electrode including a region in contact with the first intermediate film, a pixel that includes a first display element including the first electrode and a pixel circuit electrically connected to the first display element, a signal line electrically connected to the pixel, and a terminal that includes a third conductive film electrically connected to the signal line and a second intermediate film including a region in contact with the third conductive film.
摘要翻译：本发明提供一种高度方便或高度可靠的新型显示面板，非常方便或高度可靠的新型输入/输出装置，或者用于制造高度便利的新型显示面板的方法，或者高度可靠。本发明人构思了包括第一中间膜，包括与第一中间膜接触的区域的第一电极，包括包含第一电极的第一显示元件和电连接至第一显示元件的像素电路的像素的结构，与像素电连接的信号线，以及包括电连接到信号线的第三导电膜的端子和包括与第三导电膜接触的区域的第二中间膜的端子。

7. 发明申请

WO2009093623A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件及制造半导体器件的方法
公开(公告)号：WO2009093623A1
公开(公告)日：2009-07-30
申请号：PCT/JP2009/050911
申请日：2009-01-15
申请人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD. , TAKAHASHI, Hidekazu , YAMADA, Daiki , MONMA, Yohei , ADACHI, Hiroki , YAMAZAKI, Shunpei
发明人： TAKAHASHI, Hidekazu , YAMADA, Daiki , MONMA, Yohei , ADACHI, Hiroki , YAMAZAKI, Shunpei
IPC分类号： H01L27/146 , H01L21/301 , H01L23/12 , H01L27/14 , H01L29/786 , H01L31/10
CPC分类号： H01L31/0232 , H01L27/1214 , H01L27/1266 , H01L27/1277 , H01L27/1462 , H01L31/02162 , H01L2224/11
摘要： A semiconductor device in which the damage such as cracks, chinks, or dents caused by external stress is reduced is provided. In addition, the yield of a semiconductor device having a small thickness is increased. The semiconductor device includes a light-transmitting substrate having a stepped side surface, the width of which in a portion above the step and closer to one surface is smaller than that in a portion below the step, a semiconductor element layer provided over the other surface of the light-transmitting substrate, and a stack of a first light-transmitting resin layer and a second light-transmitting resin layer, which covers the one surface and part of the side surface of the light-transmitting substrate. One of the first light-transmitting resin layer and the second light-transmitting resin layer has a chromatic color.
摘要翻译：提供了其中由外部应力引起的诸如裂纹，凹陷或凹痕的损伤减小的半导体器件。此外，具有小厚度的半导体器件的产量增加。该半导体器件包括具有台阶侧表面的透光衬底，其宽度在台阶之上的部分中并且更靠近一个表面的透光衬底小于在该台阶下方的部分的透光衬底;设置在另一表面上的半导体元件层以及覆盖透光性基板的一侧面和一部分的第一透光性树脂层和第二透光性树脂层的层叠体。第一透光树脂层和第二透光树脂层中的一个具有彩色。

8. 发明申请

WO2018020333A1 SEPARATION METHOD, DISPLAY DEVICE, DISPLAY MODULE, AND ELECTRONIC DEVICE 审中-公开
标题翻译：分离方法，显示装置，显示模块和电子装置
公开(公告)号：WO2018020333A1
公开(公告)日：2018-02-01
申请号：PCT/IB2017/052918
申请日：2017-05-18
申请人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
发明人： OHNO, Masakatsu , KUMAKURA, Kayo , WATANABE, Hiroyuki , YASUMOTO, Seiji , IDOJIRI, Satoru , ADACHI, Hiroki
IPC分类号： H01L21/02 , G02F1/1368 , G09F9/00 , G09F9/30 , H01L21/336 , H01L27/12 , H01L29/786 , H01L51/50 , H05B33/10
摘要： The yield of a separation process is improved. The mass productivity of a display device which is formed through a separation process is improved. A layer is formed over a substrate with use of a material including a resin or a resin precursor. Next, a resin layer is formed by performing heat treatment on the layer. Next, a layer to be separated is formed over the resin layer. Then, the layer to be separated and the substrate are separated from each other. The heat treatment is performed in an atmosphere containing oxygen or while supplying a gas containing oxygen.
摘要翻译：
分离过程的产量得到改善。通过分离处理形成的显示装置的批量生产率得到改善。使用包含树脂或树脂前体的材料在基板上形成层。接下来，通过对层进行热处理来形成树脂层。接着，在树脂层上形成要分离的层。然后，要分离的层和基底彼此分离。热处理在含氧的气氛中或在供应含氧气体的同时进行。

9. 发明申请

WO2017182909A1 SEPARATION METHOD AND MANUFACTURING METHOD OF FLEXIBLE DEVICE 审中-公开
标题翻译：柔性装置的分离方法和制造方法
公开(公告)号：WO2017182909A1
公开(公告)日：2017-10-26
申请号：PCT/IB2017/052070
申请日：2017-04-11
申请人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
发明人： YAMAZAKI, Shunpei , YANAKA, Junpei , YASUMOTO, Seiji , OHNO, Masakatsu , ADACHI, Hiroki
IPC分类号： H01L21/336 , H01L21/02 , H01L27/12 , H01L29/786 , H01L51/50 , H05B33/10
摘要： A low-cost separation method with high mass productivity is provided. A first layer with a thickness of 0.1 micro meter or more and 3 micro meter or less can be formed by using a photosensitive and thermosetting material over the formation substrate, a resin layer comprising an opening is formed by forming an opening in the first layer by using a photolithography method, a silicon layer or an oxide layer is formed so as to overlap with the opening of the resin layer, a transistor including a metal oxide is formed over the resin layer, a conductive layer formed in the same manufacturing steps as the source or drain of the transistor is formed over the silicon layer or the oxide layer, the resin layer and one of the silicon layer and the oxide layer are irradiated with the laser light, and the transistor and the conductive layer are separated from the formation substrate.
摘要翻译：提供了具有高批量生产率的低成本分离方法。可以通过在形成基底上使用光敏和热固性材料形成厚度为0.1微米或更大并且3微米或更小的第一层，通过在第一层中形成开口，形成包括开口的树脂层使用光刻法形成与硅树脂层的开口部重叠的硅层或氧化物层，在该树脂层上形成由金属氧化物构成的晶体管，在与该树脂层相同的制造工序中形成的导电层在硅层或氧化物层上形成晶体管的源极或漏极，用激光照射树脂层和硅层以及氧化物层中的一个，并且将晶体管和导电层从形成衬底分离

10. 发明申请

WO2017115225A2 FLEXIBLE DEVICE, DISPLAY DEVICE, AND MANUFACTURING METHODS THEREOF 审中-公开
标题翻译：柔性装置，显示装置及其制造方法
公开(公告)号：WO2017115225A2
公开(公告)日：2017-07-06
申请号：PCT/IB2016/057852
申请日：2016-12-21
申请人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
发明人： YAMAZAKI, Shunpei , ADACHI, Hiroki , IDOJIRI, Satoru , YOSHIZUMI, Kensuke
IPC分类号： H01L21/02
CPC分类号： H01L27/3262 , H01L27/1218 , H01L27/1225 , H01L27/1259 , H01L27/3258 , H01L29/24 , H01L29/66969 , H01L29/7869 , H01L51/0024 , H01L51/003 , H01L51/0097 , H01L51/5253 , H01L2227/323 , H01L2227/326 , H01L2251/5338 , H01L2251/556 , Y02E10/549
摘要： A flexible device is manufactured at low temperatures. A second substrate is bonded to a first substrate by a first adhesive layer. A first insulating layer, a transistor, and a second insulating layer are formed over the second substrate. Then, the first substrate and the second substrate are separated from each other while being heated at a first temperature. The heat resistant temperatures of the first substrate, the second substrate, and the first adhesive layer are a second temperature, a third temperature, and a fourth temperature, respectively. Each of the first insulating layer, the second insulating layer, and the transistor is formed at a temperature higher than or equal to room temperature and lower than the fourth temperature. The third temperature is higher than the fourth temperature and lower than the second temperature. The first temperature is higher than the fourth temperature and lower than the third temperature.
摘要翻译：柔性器件在低温下制造。第二基板通过第一粘合层粘合到第一基板。第一绝缘层，晶体管和第二绝缘层形成在第二衬底上。然后，第一基板和第二基板在第一温度下被加热的同时彼此分离。第一基板，第二基板和第一粘合层的耐热温度分别为第二温度，第三温度和第四温度。第一绝缘层，第二绝缘层和晶体管中的每一个都在高于或等于室温且低于第四温度的温度下形成。第三温度高于第四温度且低于第二温度。第一个温度高于第四个温度，低于第三个温度。

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