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1. 发明申请

WO2009031482A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：WO2009031482A1
公开(公告)日：2009-03-12
申请号：PCT/JP2008/065620
申请日：2008-08-25
申请人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD. , AOKI, Tomoyuki , TSURUME, Takuya , ADACHI, Hiroki , HORIKOSHI, Nozomi , OHTANI, Hisashi
发明人： AOKI, Tomoyuki , TSURUME, Takuya , ADACHI, Hiroki , HORIKOSHI, Nozomi , OHTANI, Hisashi
IPC分类号： H01L23/29 , G06K19/07 , G06K19/077 , H01L21/02 , H01L21/336 , H01L21/56 , H01L23/31 , H01L27/12 , H01L29/786
CPC分类号： H01L23/29 , G06K19/07749 , H01L21/563 , H01L23/145 , H01L23/295 , H01L23/3121 , H01L23/60 , H01L23/66 , H01L27/1214 , H01L27/1266 , H01L27/13 , H01L2223/6677 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/09701 , H01L2924/12032 , H01L2924/12044 , H01L2924/19041 , H01L2924/3025 , Y10T428/31522 , H01L2924/00
摘要： A separation layer and a semiconductor element layer including a thin film transistor are formed. A conductive resin electrically connected to the semiconductor element layer is formed. A first sealing layer including a fiber and an organic resin layer is formed over the semiconductor element layer and the conductive resin. A groove is formed in the first sealing layer, the semiconductor element layer, and the separation layer. A liquid is dropped into the groove to separate the separation layer and the semiconductor element layer. The first sealing layer over the conductive resin is removed to form an opening. A set of the first sealing layer and the semiconductor element layer is divided into a chip. The chip is bonded to an antenna formed over a base material. A second sealing layer including a fiber and an organic resin layer is formed so as to cover the antenna and the chip.
摘要翻译：形成包括薄膜晶体管的分离层和半导体元件层。形成与半导体元件层电连接的导电树脂。包含纤维和有机树脂层的第一密封层形成在半导体元件层和导电树脂上。在第一密封层，半导体元件层和分离层中形成凹槽。将液体滴入槽中以分离分离层和半导体元件层。去除导电树脂上的第一密封层以形成开口。一组第一密封层和半导体元件层被分成芯片。芯片结合到形成在基材上的天线。形成包括纤维和有机树脂层的第二密封层，以覆盖天线和芯片。

2. 发明申请

WO2006129741A1 SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件
公开(公告)号：WO2006129741A1
公开(公告)日：2006-12-07
申请号：PCT/JP2006/310945
申请日：2006-05-25
申请人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD. , TSURUME, Takuya , HORIKOSHI, Nozomi
发明人： TSURUME, Takuya , HORIKOSHI, Nozomi
IPC分类号： H01L29/786 , H01L21/336
CPC分类号： H01L27/1266 , H01L27/1214 , H01L29/78603 , H01L29/78645
摘要： A semiconductor device is provided, which includes a first insulating layer over a first substrate, a transistor over the first insulating layer, a second insulating layer over the transistor, a first conductive layer connected to a source region or a drain region of the transistor through an opening provided in the second insulating layer, a third insulating layer over the first conductive layer, and a second substrate over the third insulating layer. The transistor comprises a semiconductor layer, a second conductive layer, and a fourth insulating layer provided between the semiconductor layer and the second conductive layer. One or plural layers selected from the first insulating layer, the second insulating layer, the third insulating layer, and the fourth insulating layer have a step portion which is provided so as not to overlap with the transistor.
摘要翻译：提供了一种半导体器件，其包括在第一衬底上的第一绝缘层，在第一绝缘层上的晶体管，晶体管上的第二绝缘层，与晶体管的源极区或漏极区连接的第一导电层，设置在第二绝缘层中的开口，在第一导电层上方的第三绝缘层，以及位于第三绝缘层上的第二基板。晶体管包括半导体层，第二导电层和设置在半导体层和第二导电层之间的第四绝缘层。从第一绝缘层，第二绝缘层，第三绝缘层和第四绝缘层选择的一个或多个层具有设置成不与晶体管重叠的台阶部分。

3. 发明申请

WO2007055142A1 LAYER HAVING FUNCTIONALITY, METHOD FOR FORMING FLEXIBLE SUBSTRATE HAVING THE SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
标题翻译：具有功能的层，用于形成具有该功能的柔性基板的方法以及制造半导体器件的方法
公开(公告)号：WO2007055142A1
公开(公告)日：2007-05-18
申请号：PCT/JP2006/321928
申请日：2006-10-26
申请人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD. , AOKI, Tomoyuki , TSURUME, Takuya
发明人： AOKI, Tomoyuki , TSURUME, Takuya
IPC分类号： G02F1/1333 , G02F1/1335 , G02F1/1341 , G02F1/1343 , G02F1/1345 , G06K19/07 , G06K19/077 , H01Q13/08
CPC分类号： H01Q7/00 , G02F1/133305 , G02F1/1362 , G02F2001/13613 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/0106 , H01L2924/01067 , H01L2924/01068 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12044 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H01Q1/38 , H05K3/207 , H05K3/28 , H05K2203/016 , H05K2203/0531 , H01L2224/81 , H01L2924/00
摘要： It is an object of the present invention to provide a method for forming a layer having functionality including a conductive layer and a colored layer and a flexible substrate having a layer having functionality with a high yield. Further, it is an object of the present invention to provide a method for manufacturing a semiconductor device that is small-sized, thin, and lightweight. After coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, after attaching an adhesive to the layer having functionality, the layer having functionality is peeled from the substrate. Further, after coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, an adhesive is attached to the layer having functionality. Thereafter, the layer having functionality is peeled from the substrate, and a flexible substrate is attached to the layer having functionality.
摘要翻译：本发明的目的是提供一种形成具有包括导电层和着色层的功能的层的方法和具有具有高产率功能的层的柔性基板。此外，本发明的目的是提供一种小型，薄型和轻量化的半导体器件的制造方法。用硅烷偶联剂涂布具有耐热性的基材后，形成具有官能团的层。然后，在将粘合剂粘贴到具有官能团的层上之后，将具有官能团的层从基材上剥离。此外，在用硅烷偶联剂涂布具有耐热性的基材之后，形成具有官能团的层。然后，将粘合剂附着到具有功能性的层上。此后，具有功能性的层从基板剥离，并且柔性基板附着到具有功能的层。

4. 发明申请

WO2006051887A1 IC CHIP, ANTENNA, AND MANUFACTURING METHOD OF THE IC CHIP AND THE ANTENNA 审中-公开
标题翻译： IC芯片，天线和IC芯片和天线的制造方法
公开(公告)号：WO2006051887A1
公开(公告)日：2006-05-18
申请号：PCT/JP2005/020664
申请日：2005-11-04
申请人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD. , KUSUMOTO, Naoto , TSURUME, Takuya
发明人： KUSUMOTO, Naoto , TSURUME, Takuya
IPC分类号： H01L25/00 , H01L21/56 , G06K19/077 , G06K19/07
CPC分类号： H01Q1/2208 , G06K19/07749 , H01L23/49855 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/24226 , H01L2224/76155 , H01L2224/82102 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01057 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01082 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01Q7/00 , Y10T29/49016 , Y10T29/49018 , H01L2924/00
摘要： An antenna used for an ID chip or the like is disclosed with planarized antenna unevenness and an IC chip having such the antenna with a flat surface is disclosed. Manufacturing an integrated circuit mounted with an antenna is facilitated. A laminated body formed by stacking a conductive film 11, a resin film 13, an integrated circuit 12, and a resin film 14 are rolled so that the resin film 14 is outside. Then, the laminated body is integrated in a roll form by softening the resin films 13, 14 by applying heat. By slicing the rolled laminated body along with the direction in which the rolled conductive film 31 appears in the cross section, an IC chip with antenna formed by the rolled conductive film 11 is formed.
摘要翻译：公开了用于ID芯片等的天线，其具有平坦化的天线不均匀性，并且公开了具有平坦表面的天线的IC芯片。制造安装有天线的集成电路变得容易。通过层叠导电膜11，树脂膜13，集成电路12和树脂膜14而形成的层叠体被卷成树脂膜14的外侧。然后，通过施加热量使树脂膜13,14软化，将层叠体整合成卷状。通过将轧制的层压体与轧制导电膜31在横截面中出现的方向切片，形成由卷绕的导电膜11形成的具有天线的IC芯片。

5. 发明申请

WO2006080322A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：WO2006080322A1
公开(公告)日：2006-08-03
申请号：PCT/JP2006/301087
申请日：2006-01-18
申请人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD. , TSURUME, Takuya
发明人： TSURUME, Takuya
IPC分类号： H01L27/04
CPC分类号： H01L29/78 , H01L27/1214 , H01L27/1248 , H01L27/1255 , H01L27/1266 , H01L27/13 , H01L2221/68359 , H01L2224/32145 , H01L2224/48091 , H01L2224/48145 , H01L2224/48464 , H01L2224/73265 , H01L2924/01025 , H01L2924/01067 , H01L2924/01068 , H01L2924/01079 , H01L2924/09701 , H01L2924/12044 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An object of the prevent invention is to provide a semiconductor device having a conductive film, which sufficiently serves as an antenna, and a method for manufacturing thereof. The semiconductor device has an element formation layer including a transistor, which is provided over a substrate, an insulating film provided on the element formation layer, and a conductive film serving as an antenna, which is provided on the insulating film. The insulating film has a groove. The conductive film is provided along the surface of the insulating film and the groove. The groove of the insulating film may be provided to pass through the insulating film. Alternatively, a concave portion may be provided in the insulating film so as not to pass through the insulating film. A structure of the groove is not particularly limited, and for example, the groove can be provided to have a tapered shape, etc.
摘要翻译：本发明的目的是提供一种具有充分用作天线的导电膜的半导体器件及其制造方法。半导体器件具有包括设置在基板上的晶体管，设置在元件形成层上的绝缘膜和设置在绝缘膜上的用作天线的导电膜的元件形成层。绝缘膜具有凹槽。导电膜沿着绝缘膜和槽的表面设置。绝缘膜的槽可以设置成穿过绝缘膜。或者，可以在绝缘膜中设置凹部以不通过绝缘膜。槽的结构没有特别限制，例如可以将槽设置成具有锥形等。

6. 发明申请

WO2005091370A1 METHOD FOR MANUFACTURING INTEGRATED CIRCUIT 审中-公开
标题翻译：制造集成电路的方法
公开(公告)号：WO2005091370A1
公开(公告)日：2005-09-29
申请号：PCT/JP2005/005064
申请日：2005-03-15
申请人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD. , TSURUME, Takuya , MARUYAMA, Junya , DOZEN, Yoshitaka
发明人： TSURUME, Takuya , MARUYAMA, Junya , DOZEN, Yoshitaka
IPC分类号： H01L27/12
CPC分类号： H01L27/1266 , H01L21/76251 , H01L27/1214 , H05K3/20
摘要： A method for separating an integrated circuit formed by a thin film having a novel structure or a method for transferring the integrated circuit to another substrate, that is, so-called transposing method, has not been proposed. According to the present invention, in the case that an integrated circuit having a thin film having a novel structure formed over a substrate via a release layer is separated, the release layer is removed in the state that the thin film integrated circuit is fixated, the thin film integrated circuit is transposed to a supporting substrate having an adhesion surface, and the thin film integrated circuit is transposed
摘要翻译：用于将由具有新颖结构的薄膜形成的集成电路分离的方法或将集成电路转移到另一基板的方法，即所谓的转置方法尚未提出。根据本发明，在通过剥离层在基板上形成具有新颖结构的薄膜的集成电路被分离的情况下，在薄膜集成电路固定的状态下去除剥离层，薄膜集成电路被转置到具有粘合表面的支撑基板上，并且薄膜集成电路被转置

7. 发明申请

WO2006043685A1 SEMICONDUCTOR DEVICE HAVING ANTENNA AND METHOD FOR MANUFACTURING THEREOF 审中-公开
标题翻译：具有天线的半导体器件及其制造方法
公开(公告)号：WO2006043685A1
公开(公告)日：2006-04-27
申请号：PCT/JP2005/019448
申请日：2005-10-18
申请人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD. , ITO, Kyosuke , MARUYAMA, Junya , TSURUME, Takuya , YAMAZAKI, Shunpei
发明人： ITO, Kyosuke , MARUYAMA, Junya , TSURUME, Takuya , YAMAZAKI, Shunpei
IPC分类号： H01L21/28 , G06K19/07 , H01Q7/00
CPC分类号： H01L27/1266 , G06K19/07749 , H01L27/1214 , H01L27/13 , H01L2224/95001 , H01Q1/2225 , H01Q7/00 , Y10T29/49018
摘要： The present invention provides an antenna in that the adhesive intensity of a conductive body formed on a base film is increased, and a semiconductor device including the antenna. The invention further provides a semiconductor device with high reliability that is formed by attaching an element formation layer and an antenna, wherein the element formation layer is not damaged due to a structure of the antenna. The semiconductor device includes the element formation layer provided over a substrate and the antenna provided over the element formation layer. The element formation layer and the antenna are electrically connected. The antenna has a base film and a conductive body, wherein at least a part of the conductive body is embedded in the base film. As a method for embedding the conductive body in the base film, a depression is formed in the base film and the conductive body is formed therein.
摘要翻译：本发明提供了一种天线，其特征在于，形成在基膜上的导电体的粘合强度增加，并且包括该天线的半导体器件。本发明还提供一种通过附着元件形成层和天线形成的具有高可靠性的半导体器件，其中元件形成层由于天线的结构而不被损坏。半导体器件包括设置在衬底上的元件形成层和设置在元件形成层上的天线。元件形成层和天线电连接。天线具有基膜和导电体，其中导电体的至少一部分嵌入基膜中。作为将导电体嵌入基膜中的方法，在基膜中形成凹部，在其中形成导电体。

8. 发明申请

WO2005119781A1 LAMINATING SYSTEM 审中-公开
标题翻译：层压系统
公开(公告)号：WO2005119781A1
公开(公告)日：2005-12-15
申请号：PCT/JP2005/010313
申请日：2005-05-31
申请人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD. , WATANABE, Ryosuke , TAKAHASHI, Hidekazu , TSURUME, Takuya
发明人： WATANABE, Ryosuke , TAKAHASHI, Hidekazu , TSURUME, Takuya
IPC分类号： H01L27/12
CPC分类号： H01L21/56 , B32B37/20 , B32B2305/342 , B42D25/45 , B42D2033/46 , G06K19/07718 , G06K19/07749 , G06K19/0775 , H01L21/67126 , H01L21/67132 , H01L21/67144 , H01L21/6835 , H01L27/1214 , H01L27/1266 , H01L2221/68318 , H01L2221/68354 , H01L2221/68363 , H01L2924/0002 , Y10T156/1089 , Y10T156/1093 , Y10T156/1712 , H01L2924/00
摘要： It is an object of the invention to improve the production efficiency in sealing a thin film integrated circuit and to prevent the damage and break. Further, it is another object of the invention to prevent a thin film integrated circuit from being damaged in shipment and to make it easier to handle the thin film integrated circuit. The invention provides a laminating system in which rollers are used for supplying a substrate for sealing, receiving IC chips, separating, and sealing. The separation, sealing, and reception of a plurality of thin film integrated circuits can be carried out continuously by rotating the rollers; thus, the production efficiency can be extremely improved. Further, the thin film integrated circuits can be easily sealed since a pair of rollers opposite to each other is used.
摘要翻译：本发明的目的是提高密封薄膜集成电路的生产效率并防止损坏和断裂。此外，本发明的另一个目的是防止薄膜集成电路在运输中受损，并且使得更容易处理薄膜集成电路。本发明提供了一种层压系统，其中辊子用于供应用于密封的基板，接收IC芯片，分离和密封。通过旋转辊可以连续地进行多个薄膜集成电路的分离，密封和接收; 从而可以极大地提高生产效率。此外，由于使用了彼此相对的一对辊，所以能够容易地密封薄膜集成电路。

9. 发明申请

WO2006011664A1 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
标题翻译：制造半导体器件的方法
公开(公告)号：WO2006011664A1
公开(公告)日：2006-02-02
申请号：PCT/JP2005/014253
申请日：2005-07-28
申请人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD. , SUGIYAMA, Eiji , TAMURA, Tomoko , DOZEN, Yoshitaka , DAIRIKI, Koji , TSURUME, Takuya
发明人： SUGIYAMA, Eiji , TAMURA, Tomoko , DOZEN, Yoshitaka , DAIRIKI, Koji , TSURUME, Takuya
IPC分类号： H01L21/02 , H01L27/12
CPC分类号： H01L21/02381 , H01L21/84 , H01L27/1214 , H01L27/1266 , H01L27/13 , H01L2221/68359 , H01L2221/68368 , H01L2224/81001
摘要： A release layer formed over a substrate; at least one of thin film integrated circuits is formed over the release layer; a film is formed over each of the at least one of thin film integrated circuits; and the release layer is removed by using an etchant; thus, the at least one of thin film integrated circuits is peeled from the substrate. A semiconductor device is formed by sealing the peeled thin film integrated circuit by lamination or the like.
摘要翻译：形成在衬底上的释放层; 在剥离层上形成薄膜集成电路中的至少一个; 在薄膜集成电路中的至少一个上形成膜; 并通过使用蚀刻剂除去释放层; 因此，薄膜集成电路中的至少一个从基板剥离。半导体器件通过层压等密封剥离的薄膜集成电路而形成。

10. 发明申请

WO2006001287A1 METHOD FOR MANUFACTURING THIN FILM INTEGRATED CIRCUIT 审中-公开
标题翻译：制造薄膜集成电路的方法
公开(公告)号：WO2006001287A1
公开(公告)日：2006-01-05
申请号：PCT/JP2005/011398
申请日：2005-06-15
申请人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD. , TSURUME, Takuya , DAIRIKI, Koji
发明人： TSURUME, Takuya , DAIRIKI, Koji
IPC分类号： H01L27/12
CPC分类号： H01L27/1266 , H01L27/1214 , H01L2221/68363 , H01L2221/68368
摘要： An object of the present invention is to prevent a thin film integrate circuit from peeling off during the process of transferring to a base material. By a manufacturing method of the present invention, a separation layer is formed selectively on a surface of a substrate; thus, a first region where the separation layer is provided and a second region where the separation layer is not provided are formed. A thin film integrated circuit is formed over the separation layer. Then, an opening portion for exposing the separation layer is formed, en etching agent is introduced into the opening portion to remove the separation layer. Thus, a space is generated in the region provided with the separation layer, whereas a space is not generated in the region without the separation layer. Therefore, the thin film integrated circuit can be prevented from peeling off even after the separation layer is removed, by providing the region where the space is not generated after that.
摘要翻译：本发明的目的是在转印到基材的过程中防止薄膜集成电路剥离。通过本发明的制造方法，在基板的表面上选择性地形成分离层，因此，形成了设置分离层的第一区域和不设置分离层的第二区域。在分离层上形成薄膜集成电路。然后，形成用于暴露分离层的开口部分，将蚀刻剂引入开口部分以除去分离层。因此，在设置有分离层的区域中产生空间，而在没有分离层的区域中不产生空间。因此，即使在分离层被去除之后，也可以防止薄膜集成电路剥离，通过在其之后提供不产生空间的区域。

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