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1. 发明申请

WO2013032725A2 GLASS AS A SUBSTRATE MATERIAL AND A FINAL PACKAGE FOR MEMS AND IC DEVICES 审中-公开
标题翻译：作为基板材料的玻璃和用于MEMS和IC器件的最终封装
公开(公告)号：WO2013032725A2
公开(公告)日：2013-03-07
申请号：PCT/US2012/051183
申请日：2012-08-16
申请人： QUALCOMM MEMS TECHNOLOGIES, INC. , PETERSEN, Kurt Edward , SHENOY, Ravindra V. , BLACK, Justin Phelps , BURNS, David William , GANAPATHI, Srinivasan Kodaganallur , STEPHANOU, Philip Jason , BUCHAN, Nicholas, Ian
发明人： PETERSEN, Kurt Edward , SHENOY, Ravindra V. , BLACK, Justin Phelps , BURNS, David William , GANAPATHI, Srinivasan Kodaganallur , STEPHANOU, Philip Jason , BUCHAN, Nicholas, Ian
IPC分类号： H01L23/053 , H01L23/055 , H01L23/057 , H01L23/08 , H01L23/10 , H01L23/15 , H01L25/065 , H01L25/10 , H01L27/146 , H01L31/048 , H05K3/42 , B81C1/00
CPC分类号： H01L23/10 , B81B7/007 , B81B2201/047 , B81B2207/012 , B81B2207/095 , B81B2207/096 , B81B2207/097 , B81C2203/0118 , B81C2203/0792 , H01L23/053 , H01L23/055 , H01L23/057 , H01L23/08 , H01L23/15 , H01L23/49827 , H01L24/73 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/01322 , H01L2924/01327 , H01L2924/10253 , H01L2924/12044 , H01L2924/13091 , H01L2924/1461 , H01L2924/3025 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, a glass package may include a glass substrate, a cover glass and one or more devices encapsulated between the glass substrate and the cover glass. The cover glass may be bonded to the glass substrate with an adhesive such as an epoxy, or a metal bond ring. The glass package also may include one or more signal transmission pathways between the one or more devices and the package exterior. In some implementations, a glass package including an EMS and/or IC device is configured to be directly attached to a printed circuit board (PCB) or other integration substrate by surface mount technology.
摘要翻译：本公开提供了用于集成电路（IC）和机电系统（EMS）装置的玻璃封装的系统，方法和装置。在一个方面，玻璃包装可以包括玻璃基板，玻璃盖和一个或多个封装在玻璃基板和盖玻璃之间的装置。覆盖玻璃可以用诸如环氧树脂或金属粘结环的粘合剂结合到玻璃基板上。玻璃包装还可以包括在一个或多个装置和包装外部之间的一个或多个信号传输路径。在一些实施方案中，包括EMS和/或IC器件的玻璃封装被配置为通过表面贴装技术直接附接到印刷电路板（PCB）或其它集成基板。

2. 发明申请

WO2013032728A2 GLASS AS A SUBSTRATE MATERIAL AND A FINAL PACKAGE FOR MEMS AND IC DEVICES 审中-公开
标题翻译：作为基板材料的玻璃和用于MEMS和IC器件的最终封装
公开(公告)号：WO2013032728A2
公开(公告)日：2013-03-07
申请号：PCT/US2012/051216
申请日：2012-08-16
申请人： QUALCOMM MEMS TECHNOLOGIES, INC. , PETERSEN, Kurt Edward , SHENOY, Ravindra V. , BLACK, Justin Phelps , BURNS, David William , GANAPATHI, Srinivasan Kodaganallur , STEPHANOU, Philip Jason , BUCHAN, Nicholas Ian
发明人： PETERSEN, Kurt Edward , SHENOY, Ravindra V. , BLACK, Justin Phelps , BURNS, David William , GANAPATHI, Srinivasan Kodaganallur , STEPHANOU, Philip Jason , BUCHAN, Nicholas Ian
IPC分类号： B81B7/00
CPC分类号： B81B7/0067 , B81B2207/095 , B81B2207/096 , B81B2207/097 , B81C2203/0109 , H01L2224/16 , H01L2224/48091 , H01L2224/73204 , H01L2924/12044 , H01L2924/13091 , H01L2924/1461 , H01L2924/3025 , Y10T29/5313 , H01L2924/00014 , H01L2924/00
摘要： This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, a glass package may include a glass substrate, a cover glass, one or more devices encapsulated between the glass substrate and the cover glass, and bond pads configured to attach to a flexible connector and in electrical communication with an encapsulated device. In some implementations, a flexible connector may be used to electrically connect a device within the glass package to an electrical component, such as an integrated circuit (IC) device or PCB, outside the glass package.
摘要翻译：本公开提供了用于集成电路（IC）和机电系统（EMS）装置的玻璃封装的系统，方法和装置。在一个方面，玻璃包装可以包括玻璃基板，玻璃盖，一个或多个封装在玻璃基板和盖玻璃之间的装置，以及被配置成连接到柔性连接器并与封装装置电连通的接合垫。在一些实施方案中，柔性连接器可以用于将玻璃封装内的器件电连接到玻璃封装外部的诸如集成电路（IC）器件或PCB之类的电气元件。

3. 发明申请

WO2013138029A1 HIGH CAPACITANCE DENSITY METAL-INSULATOR-METAL CAPACITORS 审中-公开
标题翻译：高电容密度金属绝缘体 - 金属电容器
公开(公告)号：WO2013138029A1
公开(公告)日：2013-09-19
申请号：PCT/US2013/026882
申请日：2013-02-20
申请人： QUALCOMM MEMS TECHNOLOGIES, INC.
发明人： LASITER, Jon Bradley , SHENOY, Ravindra V. , BLACK, Justin Phelps , KIDWELL, Donald William
IPC分类号： H01L49/02 , H01L23/64 , H01L23/522
CPC分类号： H01L28/40 , H01G4/1209 , H01G4/33 , H01L23/642 , H01L28/60 , H01L2924/0002 , Y10T29/49124 , H01L2924/00
摘要： This disclosure provides systems, methods and apparatus comprising high capacitance density metal-insulator-metal capacitors. In one aspect, an apparatus includes a first base metal layer (1004) on a first side of a substrate (1002). A first polymer layer (1012) is disposed on the first base metal layer and on the first side of the substrate. The first polymer layer defines a first plurality of vias (1014) though the first polymer layer, the first plurality of vias exposing portions of the first base metal layer. A first electrode layer (1016) is disposed on the first polymer layer. The first electrode layer contacts the portions of the first base metal layer. A first dielectric layer (1020) is disposed on the first electrode layer. A second electrode layer (1024) is disposed on the first dielectric layer. The first dielectric layer electrically isolates the first electrode layer from the second electrode layer.
摘要翻译：本公开提供包括高电容密度金属 - 绝缘体 - 金属电容器的系统，方法和装置。在一个方面，一种装置包括在基底（1002）的第一侧上的第一基底金属层（1004）。第一聚合物层（1012）设置在第一基底金属层上和衬底的第一侧上。第一聚合物层通过第一聚合物层限定第一多个通孔（1014），第一多个通孔暴露第一基底金属层的部分。第一电极层（1016）设置在第一聚合物层上。第一电极层与第一基底金属层的部分接触。第一电介质层（1020）设置在第一电极层上。第二电极层（1024）设置在第一电介质层上。第一电介质层将第一电极层与第二电极层电隔离。

4. 发明申请

WO2013166016A1 HIGH QUALITY FACTOR PLANAR INDUCTORS 审中-公开
标题翻译：高质量因子平面电感器
公开(公告)号：WO2013166016A1
公开(公告)日：2013-11-07
申请号：PCT/US2013/038869
申请日：2013-04-30
申请人： QUALCOMM MEMS TECHNOLOGIES, INC.
发明人： LO, Chi Shun , ALLEN, Wesley Nathaniel , KIM, Jonghae , LAN, Je-Hsiung Jeffrey , SHENOY, Ravindra V. , BLACK, Justin Phelps , ZUO, Chengjie , YUN, Changhan Hobie
IPC分类号： H01F5/00 , H01F17/00 , H01F27/28
CPC分类号： H01F5/003 , H01F41/041 , Y10T29/4902
摘要： This disclosure provides systems, methods, and apparatus related to inductors. In one aspect, a planar inductor may include a substrate with a spacer in the shape of a planar spiral coil on a surface of the substrate. Disposed on the spacer may be a line of metal formed as a planar inductor in the shape of the planar spiral coil. The spacer may be between the line of metal and the surface of the substrate. The spacer may elevate the line of metal above the surface of the substrate.
摘要翻译：本公开提供了与电感器相关的系统，方法和装置。一方面，平面电感器可以包括在衬底的表面上具有平面螺旋线圈形状的间隔物的衬底。设置在间隔件上的金属线可以是形成为平面螺旋线圈形状的平面电感器的金属线。间隔物可以在金属线和基底的表面之间。间隔物可以将衬底上的金属线提升。

5. 发明申请

WO2014022114A1 HYBRID FILTER INCLUDING LC- AND MEMS-BASED RESONATORS 审中-公开
标题翻译：混合滤波器，包括基于LC和MEMS的谐振器
公开(公告)号：WO2014022114A1
公开(公告)日：2014-02-06
申请号：PCT/US2013/051127
申请日：2013-07-18
申请人： QUALCOMM MEMS TECHNOLOGIES, INC.
发明人： BLACK, Justin Phelps , STEPHANOU, Philip Jason , KIM, Jonghae , LAN, Je-Hsiung Jeffrey , PARK, Sang-June , YUN, Changhan Hobie , LO, Chi Shun , ZUO, Chengjie
IPC分类号： H03H7/075 , H03H9/46 , H03H7/00
CPC分类号： H03H7/075 , H03H9/465 , H03H2007/006
摘要： This disclosure provides implementations of filters and filter topologies, circuits, structures, devices, apparatus, systems, and related processes. In one aspect, a device includes one or more LC resonant circuit stages (702, 704). In some implementations, each LC stage (702, 704) includes an inductor (706) and a capacitor (708). Each LC stage (702, 704) also has a corresponding resonant frequency. The one or more LC stages (702, 704) are arranged to produce an unmodified passband over a range of frequencies having a corresponding bandwidth. One or more microelectromechanical systems (MEMS) resonators (710, 712) are arranged with the one or more LC stages (702, 704) so as to modify characteristics of the unmodified passband such that the hybrid filter produces a modified passband having a modified bandwidth or one or more other modified band characteristics.
摘要翻译：本公开提供了滤波器和滤波器拓扑，电路，结构，设备，装置，系统和相关过程的实现。一方面，一种器件包括一个或多个LC谐振电路级（702,704）。在一些实现中，每个LC级（702,704）包括电感器（706）和电容器（708）。每个LC级（702,704）也具有对应的谐振频率。一个或多个LC级（702,704）被布置成在具有相应带宽的频率范围上产生未修改的通带。一个或多个微机电系统（MEMS）谐振器（710,712）与一个或多个LC级（702,704）一起布置，以便修改未修改的通带的特性，使得混合滤波器产生具有修改带宽的修改的通带或一个或多个其它修改的带特征。

6. 发明申请

WO2013082044A1 MULTILAYER PIEZOELECTRIC RESONATOR STRUCTURE 审中-公开
标题翻译：多层压电谐振器结构
公开(公告)号：WO2013082044A1
公开(公告)日：2013-06-06
申请号：PCT/US2012/066675
申请日：2012-11-27
申请人： QUALCOMM MEMS TECHNOLOGIES, INC.
发明人： BLACK, Justin Phelps
IPC分类号： H03H9/02 , H03H9/17
CPC分类号： H03H9/02228 , H03H9/173 , H03H9/178
摘要： This disclosure provides implementations of electromechanical systems resonator structures, devices, apparatus and related processes. In one aspect, a resonator structure includes a first conductive layer of electrodes, a second conductive layer of electrodes, and a third conductive layer of electrodes. The resonator structure also includes a first piezoelectric layer disposed between the first and second conductive layers and a second piezoelectric layer disposed between the first and third conductive layers. A first arrangement of the electrodes is located at a first position along the structure and includes a first-type drive electrode in each of the second and third conductive layers, and a second-type drive electrode in the first conductive layer. A second arrangement of the electrodes is located at a second position along the structure and includes a second-type drive electrode in each of the second and third conductive layers, and a first-type drive electrode in the first conductive layer.
摘要翻译：本公开提供了机电系统谐振器结构，装置，装置和相关过程的实现。一方面，谐振器结构包括电极的第一导电层，电极的第二导电层和电极的第三导电层。谐振器结构还包括设置在第一和第二导电层之间的第一压电层和设置在第一和第三导电层之间的第二压电层。电极的第一布置位于沿着结构的第一位置处，并且在第二和第三导电层中的每一个中包括第一类型的驱动电极和第一导电层中的第二类型的驱动电极。电极的第二布置位于沿着结构的第二位置处，并且在第二和第三导电层中的每一个中包括第二类型的驱动电极以及第一导电层中的第一类型的驱动电极。

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