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1. 发明申请

WO2014065939A1 COMPOSITE DILATION MODE RESONATORS 审中-公开
标题翻译：组合式模拟谐振器
公开(公告)号：WO2014065939A1
公开(公告)日：2014-05-01
申请号：PCT/US2013/056614
申请日：2013-08-26
申请人： QUALCOMM MEMS TECHNOLOGIES, INC.
发明人： ZUO, Chengjie , KIM, Jonghae , YUN, Changhan, Hobie , PARK, Sang-June , STEPHANOU, Philip, Jason , LO, Chi, Shun , MIKULKA, Robert, Paul , VELEZ, Mario, Francisco , SHENOY, Ravindra, V. , NOWAK, Matthew, Michael
IPC分类号： H03H9/24 , H03H9/205 , H03H9/02
CPC分类号： H03H9/02157 , H03H9/02574 , H03H9/205 , H03H9/2405 , H03H2009/02503 , H03H2009/02527 , H03H2009/241
摘要： This disclosure provides systems, methods and apparatus related to acoustic resonators that include composite transduction layers (116, 118) for enabling selective tuning of one or more acoustic or electromechanical properties. In one aspect, a resonator structure includes one or more first electrodes (142), one or more second electrodes (144), and a transduction layer (116, 118) arranged between the first and second electrodes. The transduction layer includes a plurality of constituent layers. In some implementations, the constituent layers include one or more first piezoelectric layers and one or more second piezoelectric layers. The transduction layer is configured to, responsive to signals provided to the first and second electrodes, provide at least a first mode of vibration of the transduction layer with a displacement component along the z axis and at least a second mode of vibration of the transduction layer with a displacement component _ along the plane of the x axis and the y axis.
摘要翻译：本公开提供了涉及声谐振器的系统，方法和装置，其包括用于使得能够选择性地调谐一个或多个声学或机电特性的复合转导层（116,118）。在一个方面，谐振器结构包括一个或多个第一电极（142），一个或多个第二电极（144）和布置在第一和第二电极之间的换能层（116,118）。换能层包括多个构成层。在一些实施方式中，构成层包括一个或多个第一压电层和一个或多个第二压电层。转导层被配置为响应于提供给第一和第二电极的信号，提供至少第一传感模式的振动，沿着z轴的位移分量和换能层的至少第二振动模式沿着x轴和y轴的平面具有位移分量。

2. 发明申请

WO2014022099A1 COMPLEX PASSIVE DESIGN WITH SPECIAL VIA IMPLEMENTATION 审中-公开
标题翻译：复杂的被动设计，特别是通过实施
公开(公告)号：WO2014022099A1
公开(公告)日：2014-02-06
申请号：PCT/US2013/050874
申请日：2013-07-17
申请人： QUALCOMM MEMS TECHNOLOGIES, INC.
发明人： LO, Chi Shun , LAN, Je-Hsiung Jeffrey , VELEZ, Mario Francisco , MIKULKA, Robert Paul , ZUO, Chengjie , YUN, Changhan Hobie , KIM, Jonghae
IPC分类号： H01F17/00 , H01L23/522 , H01L49/02 , G02B26/00
CPC分类号： H01F17/0006 , G02B26/001 , H01F27/2804 , H01L23/5227 , H01L28/10 , H01L2924/00 , H01L2924/0002
摘要： This disclosure provides systems, methods and apparatus for vias in an integrated circuit structure such as a passive device. In one aspect, an integrated passive device includes a first conductive trace and a second conductive trace over the first conductive trace with an interlayer dielectric between a portion of the first conductive trace and the second conductive trace. One or more vias are provided within the interlayer dielectric to provide electrical connection between the first conductive trace and the second conductive trace. A width of the vias is greater than a width of at least one of the conductive traces.
摘要翻译：本公开提供了诸如无源器件的集成电路结构中的通孔的系统，方法和装置。一方面，集成无源器件包括在第一导电迹线上的第一导电迹线和第二导电迹线，在第一导电迹线的一部分和第二导电迹线之间具有层间电介质。在层间电介质中提供一个或多个通孔以提供第一导电迹线和第二导电迹线之间的电连接。通孔的宽度大于至少一个导电迹线的宽度。

3. 发明申请

WO2013074254A1 COMBINED RESONATORS AND PASSIVE CIRCUIT COMPONENTS FOR FILTER PASSBAND FLATTENING 审中-公开
标题翻译：组合式谐振器和无源电路组件，用于滤波器平滑
公开(公告)号：WO2013074254A1
公开(公告)日：2013-05-23
申请号：PCT/US2012/061485
申请日：2012-10-23
申请人： QUALCOMM MEMS TECHNOLOGIES, INC.
发明人： ZUO, Chengjie , LO, Chi Shun , JOO, Sanghoon , YUN, Changhan , KIM, Jonghae
IPC分类号： H03H9/02 , H03H9/54 , H03H9/56
CPC分类号： H03H9/542 , H03H9/02228 , H03H9/564
摘要： This disclosure provides implementations of electromechanical systems combined resonator and passive circuit component structures, devices, apparatus, systems, and related processes. In one aspect, passband flattened filter apparatus includes a resonator structure, an input passband flattening component, and an output passband flattening component. The resonator structure has a first input, a second input coupled to a ground terminal, a first output, and a second output coupled to the ground terminal. The input passband flattening component includes a first inductor having an input and an output coupled to the first input of the resonator structure, and a second inductor having an input coupled to the first input of the resonator structure and an output coupled to the ground terminal. The output passband flattening component includes a first inductor having an input coupled to the first output of the resonator structure and an output, and a second inductor having an input coupled to the first output of the resonator structure and an output coupled to the ground terminal.
摘要翻译：本公开提供机电系统组合谐振器和无源电路组件结构，设备，装置，系统和相关过程的实现。一方面，通带扁平滤波器装置包括谐振器结构，输入通带平坦化部分和输出通带平坦化部件。谐振器结构具有耦合到接地端子的第一输入端，第二输入端，第一输出端和耦合到接地端子的第二输出端。输入通带平坦化部件包括具有耦合到谐振器结构的第一输入的输入和输出的第一电感器，以及耦合到谐振器结构的第一输入的输入端和耦合到接地端子的输出的第二电感器。输出通带平坦化部件包括具有耦合到谐振器结构的第一输出的输入端和输出端的第一电感器，以及耦合到谐振器结构的第一输出端的输入端和耦合到接地端子的输出端的第二电感器。

4. 发明申请

WO2013048845A1 CROSS-SECTIONAL DILATION MODE RESONATORS AND RESONATOR-BASED LADDER FILTERS 审中-公开
标题翻译：交叉分段模式谐振器和基于谐振器的梯形滤波器
公开(公告)号：WO2013048845A1
公开(公告)日：2013-04-04
申请号：PCT/US2012/056204
申请日：2012-09-20
申请人： QUALCOMM MEMS TECHNOLOGIES, INC. , ZUO, Chengjie , YUN, Changhan , LO, Chi Shun , ALLEN, Wesley Nathaniel , VELEZ, Mario Francisco , KIM, Jonghae , JOO, Sanghoon
发明人： ZUO, Chengjie , YUN, Changhan , LO, Chi Shun , ALLEN, Wesley Nathaniel , VELEZ, Mario Francisco , KIM, Jonghae , JOO, Sanghoon
IPC分类号： H03H9/46 , H03H9/02 , H03H9/24
CPC分类号： H03H9/462 , H03H9/02228 , H03H9/2405 , H03H9/2426 , H03H2009/02503 , H03H2009/241
摘要： Electromechanical systems dilation mode resonator (DMR) structures are disclosed. The DMR includes a first electrode layer, a second electrode layer, and a piezoelectric layer formed of a piezoelectric material. The piezoelectric layer has dimensions including a lateral distance (D), in a plane of an X axis and a Y axis perpendicular to the X axis, and a thickness (T), along a Z axis perpendicular to the X axis and the Y axis. A numerical ratio of the thickness and the lateral distance, T/D, is configured to provide a mode of vibration of the piezoelectric layer with displacement along the Z axis and along the plane of the X axis and the Y axis responsive to a signal provided to one or more of the electrodes. Ladder filter circuits can be constructed with DMRs as series and/or shunt elements, and the resonators can have spiral configurations.
摘要翻译：公开了机电系统扩张模式谐振器（DMR）结构。 DMR包括第一电极层，第二电极层和由压电材料形成的压电层。压电体层具有在与X轴正交的X轴和Y轴的平面内的横向距离（D）和与X轴正交的Z轴的厚度（T）。厚度和横向距离T / D的数值比被配置为提供压电层的振动模式，其具有沿Z轴的位移并且沿着X轴和Y轴的平面响应所提供的信号到一个或多个电极。梯形滤波器电路可以用DMR构造为串联和/或分流元件，并且谐振器可以具有螺旋配置。

5. 发明申请

WO2013012638A1 PIEZOELECTRIC LATERALLY VIBRATING RESONATOR STRUCTURE GEOMETRIES FOR SPURIOUS FREQUENCY SUPPRESSION 审中-公开
标题翻译：压电式横向振动谐振器结构几何形状的频率抑制
公开(公告)号：WO2013012638A1
公开(公告)日：2013-01-24
申请号：PCT/US2012/046293
申请日：2012-07-11
申请人： QUALCOMM MEMS TECHNOLOGIES, INC. , ZUO, Chengjie , YUN, Changhan , LO, Chi Shun , KIM, Jonghae
发明人： ZUO, Chengjie , YUN, Changhan , LO, Chi Shun , KIM, Jonghae
IPC分类号： H03H9/02 , H03H9/17 , H03H3/02
CPC分类号： H03H9/02228 , H03H3/02 , H03H9/02055 , H03H9/173 , H03H2003/021 , Y10T29/42
摘要： This disclosure provides implementations of electromechanical systems resonator structures, devices, apparatus, systems, and related processes. In one aspect, a resonator structure includes a first conductive layer of electrodes and a second conductive layer of electrodes. A piezoelectric layer including a piezoelectric material is disposed between the first conductive layer and the second conductive layer. One or more trenches can be formed in the piezoelectric layer on one or both sides in space regions between the electrodes. In some implementations, a process for forming the resonator structure includes removing an exposed portion of the piezoelectric layer to define a trench, for instance, by partial etching or performing an isotropic release etch using a XeF2 gas or SF6 plasma. In some other implementations, a portion of a sacrificial layer is removed to define a trench in the piezoelectric layer.
摘要翻译：本公开提供了机电系统谐振器结构，设备，装置，系统和相关过程的实现。一方面，谐振器结构包括电极的第一导电层和电极的第二导电层。包括压电材料的压电层设置在第一导电层和第二导电层之间。一个或多个沟槽可以在电极之间的空间区域的一侧或两侧的压电层中形成。在一些实施方案中，用于形成谐振器结构的工艺包括去除压电层的暴露部分以限定沟槽，例如通过部分蚀刻或使用XeF 2气体或SF 6等离子体进行各向同性释放蚀刻。在一些其他实施方案中，去除牺牲层的一部分以在压电层中限定沟槽。

6. 发明申请

WO2013074261A1 COMBINED RESONATORS AND PASSIVE CIRCUIT COMPONENTS ON A SHARED SUBSTRATE 审中-公开
标题翻译：组合式谐振器和被共享的基板上的被动电路组件
公开(公告)号：WO2013074261A1
公开(公告)日：2013-05-23
申请号：PCT/US2012/061678
申请日：2012-10-24
申请人： QUALCOMM MEMS TECHNOLOGIES, INC.
发明人： ZUO, Chengjie , LO, Chi Shun , JOO, Sanghoon , YUN, Changhan , KIM, Jonghae
IPC分类号： H03H3/02 , H03H9/02
CPC分类号： H03H9/02228 , H03H3/02 , H03H2003/021
摘要： This disclosure provides implementations of electromechanical systems combined resonator and passive circuit component structures, devices, apparatus, systems, and related processes. In one aspect, the device includes a piezoelectric resonator structure formed over an insulating substrate. A portion of the piezoelectric resonator structure is spaced apart from the substrate by a first gap. A passive circuit component structure such as an inductor or a capacitor is formed over the insulating substrate. A portion of the passive circuit component structure is spaced apart from the substrate by a second gap. The first gap and the second gap are defined by removal of a sacrificial (SAC) layer.
摘要翻译：本公开提供机电系统组合谐振器和无源电路组件结构，设备，装置，系统和相关过程的实现。一方面，该装置包括形成在绝缘基板上的压电谐振器结构。压电谐振器结构的一部分与衬底间隔开第一间隙。在绝缘基板上形成诸如电感器或电容器的无源电路部件结构。无源电路部件结构的一部分通过第二间隙与衬底间隔开。通过去除牺牲（SAC）层来限定第一间隙和第二间隙。

7. 发明申请

WO2014137646A1 HIGH DENSITY, LOW LOSS 3-D THROUGH-GLASS INDUCTOR WITH MAGNETIC CORE 审中-公开
标题翻译：高密度，低损耗3-D透光玻璃电感器
公开(公告)号：WO2014137646A1
公开(公告)日：2014-09-12
申请号：PCT/US2014/018068
申请日：2014-02-24
申请人： QUALCOMM MEMS TECHNOLOGIES, INC.
发明人： BERDY, David Francis , KIM, Jonghae , ZUO, Chengjie , KIM, Daeik Daniel , YUN, Changhan Hobie , VELEZ, Mario Francisco , LAN, Je-Hsiung Jeffrey
IPC分类号： H01F17/00 , H01F1/24 , H01F41/04 , H01L21/00 , H05K1/00
CPC分类号： H01F17/0006 , G06T1/00 , H01F1/24 , H01F1/37 , H01F17/0033 , H01F41/046 , H01L28/10 , H01L2924/0002 , H05K1/0306 , H05K1/165 , H05K3/4046 , H05K2201/086 , H05K2201/09063 , H05K2201/097 , H05K2201/10242 , H01L2924/00
摘要： This disclosure provides systems, methods and apparatus for three-dimensional (3-D) through-glass via inductors. In one aspect, the through-glass via inductor includes a glass substrate with a first cavity, a second cavity, and at least two through-glass vias. The through-glass vias include metal bars that are connected by a metal trace. The metal bars and the metal trace define the inductor, and each cavity is at least partially filled with magnetic material. The magnetic material can include a plurality of particles having an average diameter of less than about 20 nm. The first cavity can be inside the inductor and the second cavity can be outside inductor. In some implementations, the first and the second cavity can be vias that extend only partially through the glass substrate.
摘要翻译：本公开提供用于三维（3-D）透玻璃通孔电感器的系统，方法和装置。一方面，透玻璃通孔电感器包括具有第一空腔，第二空腔和至少两个透玻璃通孔的玻璃基板。透玻璃通孔包括通过金属迹线连接的金属棒。金属棒和金属迹线限定电感器，并且每个空腔至少部分地填充有磁性材料。磁性材料可以包括平均直径小于约20nm的多个颗粒。第一个腔可以在电感内部，第二个腔可以是外部电感。在一些实施方案中，第一和第二腔可以是仅部分延伸穿过玻璃基底的通孔。

8. 发明申请

WO2013166016A1 HIGH QUALITY FACTOR PLANAR INDUCTORS 审中-公开
标题翻译：高质量因子平面电感器
公开(公告)号：WO2013166016A1
公开(公告)日：2013-11-07
申请号：PCT/US2013/038869
申请日：2013-04-30
申请人： QUALCOMM MEMS TECHNOLOGIES, INC.
发明人： LO, Chi Shun , ALLEN, Wesley Nathaniel , KIM, Jonghae , LAN, Je-Hsiung Jeffrey , SHENOY, Ravindra V. , BLACK, Justin Phelps , ZUO, Chengjie , YUN, Changhan Hobie
IPC分类号： H01F5/00 , H01F17/00 , H01F27/28
CPC分类号： H01F5/003 , H01F41/041 , Y10T29/4902
摘要： This disclosure provides systems, methods, and apparatus related to inductors. In one aspect, a planar inductor may include a substrate with a spacer in the shape of a planar spiral coil on a surface of the substrate. Disposed on the spacer may be a line of metal formed as a planar inductor in the shape of the planar spiral coil. The spacer may be between the line of metal and the surface of the substrate. The spacer may elevate the line of metal above the surface of the substrate.
摘要翻译：本公开提供了与电感器相关的系统，方法和装置。一方面，平面电感器可以包括在衬底的表面上具有平面螺旋线圈形状的间隔物的衬底。设置在间隔件上的金属线可以是形成为平面螺旋线圈形状的平面电感器的金属线。间隔物可以在金属线和基底的表面之间。间隔物可以将衬底上的金属线提升。

9. 发明申请

WO2013165699A1 THREE-DIMENSIONAL MULTILAYER SOLENOID TRANSFORMER 审中-公开
标题翻译：三维多层电磁变压器
公开(公告)号：WO2013165699A1
公开(公告)日：2013-11-07
申请号：PCT/US2013/037173
申请日：2013-04-18
申请人： QUALCOMM MEMS TECHNOLOGIES, INC.
发明人： LO, Chi Shun , KIM, Jonghae , ZUO, Chengjie , YUN, Changhan Hobie
IPC分类号： H01F27/28 , H01F17/00
CPC分类号： H05K3/465 , H01F27/2804 , H01F2017/002 , H01F2017/004
摘要： This disclosure provides implementations of inductors, transformers, and related processes. In one aspect, a device includes a substrate having first and second surfaces. A first inducting arrangement includes a first set of vias, a second set of vias, a first set of traces arranged over the first surface connecting the first and second vias, and a second set of traces arranged over the second surface connecting the first and second vias. A second inducting arrangement is inductively-coupled and interleaved with the first inducting arrangement and includes a third set of vias, a fourth set of vias, a third set of traces arranged over the first surface connecting the third and fourth vias, and a fourth set of traces arranged over the second surface connecting the third and fourth vias. One or more sets of dielectric layers insulate portions of the traces from one another.
摘要翻译：本公开提供了电感器，变压器和相关过程的实现。一方面，一种装置包括具有第一表面和第二表面的基底。第一感应装置包括第一组通孔，第二组通孔，布置在连接第一和第二通孔的第一表面上的第一组迹线，以及布置在第二表面上的第二组迹线，该第二组迹线连接第一和第二通孔孔。第二感应装置与第一感应装置电感耦合和交错，并且包括第三组通孔，第四组通孔，布置在连接第三和第四通孔的第一表面上的第三组迹线和第四组布置在连接第三和第四通孔的第二表面上的迹线。一组或多组电介质层将迹线的一部分彼此绝缘。

10. 发明申请

WO2013134077A1 PIEZOELECTRIC RESONATOR WITH AIRGAP 审中-公开
标题翻译：带气动压电谐振器
公开(公告)号：WO2013134077A1
公开(公告)日：2013-09-12
申请号：PCT/US2013/028732
申请日：2013-03-01
申请人： QUALCOMM MEMS TECHNOLOGIES, INC.
发明人： YUN, Changhan Hobie , LAN, Je-Hsiung Jeffrey , ZUO, Chengjie , LO, Chi Shun , KIM, Jonghae
IPC分类号： H03H9/17 , H03H3/02 , H03H9/15
CPC分类号： H03H9/173 , H03H3/02 , H03H2003/021 , H03H2009/155 , Y10T29/42
摘要： This disclosure provides implementations of electromechanical systems (EMS) piezoelectric resonator structures, transformers, devices, apparatus, systems, and related processes. In one aspect, a piezoelectric resonator structure includes a first conductive electrode layer, a second conductive electrode layer, and a piezoelectric layer arranged between the first and second conductive layers. In some implementations, the surface of the piezoelectric layer adjacent to the first conductive layer is separated from the first conductive layer by a first gap, and the surface of the piezoelectric layer adjacent to the second conductive layer is separated from the second conductive layer by a second gap. In some implementations, the resonator structure further includes an encapsulation layer arranged over the second conductive layer and providing physical support to the second conductive layer.
摘要翻译：本公开提供了机电系统（EMS）压电谐振器结构，变压器，设备，装置，系统和相关过程的实现。一方面，压电谐振器结构包括第一导电电极层，第二导电电极层和布置在第一和第二导电层之间的压电层。在一些实施方案中，与第一导电层相邻的压电层的表面通过第一间隙与第一导电层分离，并且与第二导电层相邻的压电层的表面与第二导电层相隔一个第二个差距。在一些实施方案中，谐振器结构还包括布置在第二导电层上的封装层，并为第二导电层提供物理支撑。

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