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1. 发明申请

WO0191184A2 SEMICONDUCTOR COMPONENT COMPRISING A SURFACE METALLIZATION 审中-公开
标题翻译：与表面金属化半导体部件
公开(公告)号：WO0191184A2
公开(公告)日：2001-11-29
申请号：PCT/DE0101785
申请日：2001-05-10
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , BRUNNER HERBERT , HOEFER THOMAS , JAEGER HARALD
发明人： BRUNNER HERBERT , HOEFER THOMAS , JAEGER HARALD
IPC分类号： H01L23/12 , H01L23/04 , H01L23/08 , H01L23/498 , H05K1/02 , H05K3/34
CPC分类号： H01L23/49805 , H01L24/48 , H01L24/73 , H01L2224/05599 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2224/48464 , H01L2224/73265 , H01L2224/854 , H01L2924/00014 , H01L2924/12041 , H01L2924/12043 , H01L2924/181 , H05K1/0271 , H05K3/3442 , H05K2201/09181 , H05K2201/09381 , H05K2201/09472 , H05K2201/10727 , Y02P70/613 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： The invention relates to a semiconductor component comprising a surface metallization. Said component has at least one semiconductor body (3) and a housing base body (2), on whose surface conductor strip structures (7) are formed by means of surface metallization. A partial zone of the conductor strip structures (7) constitutes the solder connections (1) of the semiconductor element. Said solder connections (1) are combined to form rows, whereby the individual solder connection rows are separated from one another by short, predetermined intervals.
摘要翻译：本发明描述了一种具有半导体器件的金属化表面包括至少一个半导体主体（3）和（2）导体路径结构（7）的表面上由一表面金属化而形成的壳体基体上。导体轨道结构（7）的一部分形成该半导体器件的焊接端子（1）。焊料连接（1）被组合以Lötanschlussreihen，其中所述个体Lötanschlussreihen被布置在彼此一个小的，预定的距离。

2. 发明申请

WO2006089540A3 METHOD FOR PRODUCING AN OPTICAL, RADIATION-EMITTING COMPONENT AND OPTICAL, RADIATION-EMITTING COMPONENT 审中-公开
标题翻译：生产光学和辐射发射组件以及光学和辐射浸渍组件的方法
公开(公告)号：WO2006089540A3
公开(公告)日：2006-11-02
申请号：PCT/DE2006000361
申请日：2006-02-28
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , BRAUNE BERT , BRUNNER HERBERT , JAEGER HARALD , SORG JOERG
发明人： BRAUNE BERT , BRUNNER HERBERT , JAEGER HARALD , SORG JOERG
IPC分类号： G02B1/04 , B29C45/00 , H01L33/54
CPC分类号： C08G59/4215 , B29C45/0001 , B29C45/02 , B29K2083/00 , B29K2105/0005 , B29L2011/00 , C08G59/3245 , C08G77/06 , C08G77/42 , C08G77/455 , C08L63/00 , C08L83/00 , C08L83/04 , H01L33/54 , H01L33/56 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/12044 , C08L2666/14 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to a method for producing an optical, radiation-emitting component by means of a moulding process and to an optical, radiation-emitting component with a defined viscosity.
摘要翻译：本发明涉及一种通过模制工艺制造光学和辐射发射部件的方法以及具有确定粘度的光学和辐射发射部件。

3. 发明申请

WO2008125096A2 METHOD FOR PRODUCING AN OPTO-ELECTRONIC COMPONENT AND OPTO-ELECTRONIC COMPONENT 审中-公开
标题翻译：方法制造光电子器件和光电子器件
公开(公告)号：WO2008125096A2
公开(公告)日：2008-10-23
申请号：PCT/DE2008000626
申请日：2008-04-14
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , JAEGER HARALD , BRUNNER HERBERT , SCHNEIDER ALBERT , ZEILER THOMAS
发明人： JAEGER HARALD , BRUNNER HERBERT , SCHNEIDER ALBERT , ZEILER THOMAS
IPC分类号： B29C45/14 , H01L33/52
CPC分类号： B29C45/14655 , B29C33/0038 , B29C33/10 , B29C43/18 , B29C2045/14098 , B29C2045/14663 , B29C2045/14934 , B29K2083/00 , H01L21/565 , H01L24/97 , H01L33/52 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/12041 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2224/85 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to a method for producing an opto-electronic component, comprising the following steps: - Providing a substrate (1) having a first main surface (2) and a second main surface (3) opposite the first main surface (1), - fastening to the first main surface (2) of the substrate (1) a semiconductor body (4) that is suitable for emitting electromagnetic radiation from a front side (5), and - applying a cladding that is permeable to the radiation of the optoelectronic semiconductor body (4), at least over the front side (5) of the semiconductor body (4), the cladding being designed as an optical element (19) using a closed cavity (18) having the contour of the optical element (19). The invention further relates to an optoelectronic component.
摘要翻译：它公开了一种用于通过以下步骤制造光电子器件的方法包括： - 提供衬底（1），具有第一主面（2）和第二主面（3），相对的第一主表面（1）， - 附接的半导体本体（4），其适合于从一前侧（5）发射电磁辐射，所述第一主表面（2）上的基板（1），和 - 将鞘，其是可渗透的光电子半导体主体（4）的辐射，至少在半导体本体（4），其中所述外壳形成为使用具有所述光学元件（19）的轮廓的封闭的腔（18）的光学元件（19）的前侧（5）。此外，光电子器件进行说明。

4. 发明申请

WO2011009677A3 OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN OPTICAL ELEMENT FOR AN OPTOELECTRONIC COMPONENT 审中-公开
标题翻译： OPTO电子元件和方法用于生产光学元件，用于光电组件
公开(公告)号：WO2011009677A3
公开(公告)日：2013-06-13
申请号：PCT/EP2010058084
申请日：2010-06-09
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , JAEGER HARALD , BRUNNER HERBERT , PREUSS STEPHAN
发明人： JAEGER HARALD , BRUNNER HERBERT , PREUSS STEPHAN
IPC分类号： B29C45/14 , H01L33/52 , H01L33/58
CPC分类号： H01L33/54 , B29C43/021 , B29C43/18 , B29C43/40 , B29C45/14639 , B29C45/14827 , B29L2011/00 , H01L2224/48091 , H01L2933/005 , H01L2924/00014
摘要： In at least one design form of the organic optoelectronic component (1) according to the invention, said component comprises a carrier (3) and at least one optoelectronic semiconductor chip (2) that is attached to the carrier (3). Furthermore, the optoelectronic component (1) comprises at least one optical element (45) that is likewise attached to the carrier (3). The optical element (45) has a base body (5) having a radiation-permeable form material. Said form material is a silicone, an epoxide or a silicone-epoxide hybrid material. Furthermore, the base body (5) is form-pressed, form-injected or form-cast. In addition, the optical element (45) comprises a film (4) that forms a bordering surface (7) of the optical element (45) that is turned away from the semiconductor chip (2). The film (4) is free of joining means and directly connected to the base body (5).
摘要翻译：在光电子器件中的至少一个实施例中（1）包括所述安装在所述支撑件（3）一种载体（3）和至少一个光电子半导体芯片（2）。此外，光电子器件（1）包括也安装在所述支撑件（3）至少一个光学元件（45）。在这种情况下，光学元件（45）具有基体（5）与辐射可透过的模具材料。在模制材料为硅树脂，环氧树脂或有机硅环氧树脂混合材料。此外，基体（5）是压塑，注塑或模制。此外，所述光学元件（45）包括膜（4），其形成面对从半导体芯片（2）中的边界表面（7）的光学元件（45）的。所述膜（4）是与直接连接到所述基体（5）自由连接。

5. 发明申请

WO2004081972A2 HOUSING BODY, OPTOELECTRONIC COMPONENT WITH A HOUSING BODY OF THIS TYPE, AND PLASTIC HOUSING MATERIAL 审中-公开
标题翻译：带有这种外壳和塑料外壳材料外壳亚光电子COMPONENT
公开(公告)号：WO2004081972A2
公开(公告)日：2004-09-23
申请号：PCT/DE2004000271
申请日：2004-02-13
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , BRUNNER HERBERT , HOEFER THOMAS , KRAEUTER GERTRUD , ZEILER MARKUS
发明人： BRUNNER HERBERT , HOEFER THOMAS , KRAEUTER GERTRUD
IPC分类号： H01L23/00 , H01L23/057 , H01L
CPC分类号： H01L23/564 , H01L23/057 , H01L24/48 , H01L25/167 , H01L31/0203 , H01L33/486 , H01L33/62 , H01L2224/05599 , H01L2224/32245 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/85439 , H01L2924/00014 , H01L2924/01004 , H01L2924/0102 , H01L2924/01046 , H01L2924/01067 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/181 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： The invention relates to a housing body (2) for an electronic component (1), which is manufactured, at least in part, from plastic material, and on or in which at least one first and at least one second electric supply conductor are arranged, between which an electric field (12) exists when the associated electronic component is in operation. According to the invention, the plastic material is mixed with filler particles (6), which prevent or at least highly impede a migration of metal and/or metal ions in the plastic material.
摘要翻译：在壳体本体（2）的电子部件（1），其至少部分地由塑料材料制成的，并在相关联的电子组件的操作设置在或在所述至少一个第一和至少一个第二电连接导体之间（电场 12）存在时，将塑料材料与填充材料（6），其防止金属和/或金属离子的迁移在塑料材料，或至少妨碍强混合。

6. 发明申请

WO2010025694A9 OPTOELECTRONIC COMPONENT 审中-公开
标题翻译：光电子器件
公开(公告)号：WO2010025694A9
公开(公告)日：2010-10-28
申请号：PCT/DE2009001103
申请日：2009-08-04
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , GUENTHER EWALD KARL MICHAEL , HERRMANN SIEGFRIED , ZEHNDER ULRICH , BRUNNER HERBERT
发明人： GUENTHER EWALD KARL MICHAEL , HERRMANN SIEGFRIED , ZEHNDER ULRICH , BRUNNER HERBERT
IPC分类号： H01L33/62 , H01L25/075
CPC分类号： H01L33/62 , H01L25/0753 , H01L25/167 , H01L33/486 , H01L33/645 , H01L2924/0002 , H05B33/0803 , H01L2924/00
摘要： In at least one embodiment of the optoelectronic component (1), it comprises a carrier (2) having an installation side (20) and at least one functional element (3). The optoelectronic component (1) further comprises at least one substrateless optoelectronic semiconductor chip (4) having a top side (44) and a bottom side (45) opposite thereof, wherein electric contacting of the semiconductor chip (4) takes place via the top side (44) and the bottom side (45), and wherein the bottom side (45) faces the installation side (20) of the carrier (2). The at least one semiconductor chip (4) is applied to the installation side (20). The optoelectronic component (1) further comprises at least one electric contact film (5) on the top side (44) of the semiconductor chip (1), wherein the contact film (5) is structured. Such an optoelectronic component (1) has a compact design and good thermal properties.
摘要翻译：在光电子器件（1）中的至少一个实施例具有这种在载体（2）具有安装侧（20）和具有至少一个功能元件（3）。此外，光电子器件（1）包括至少一个无基材，所述光电子半导体芯片（4），其具有一个顶部（44）和相对的底部表面（45），所述上侧（44）和底部上的半导体芯片（4）的电接触（45），并且其中载体（2）的安装侧（20）的下侧（45）面向。该至少一个半导体芯片（4）被施加到安装侧（20）。此外，光电子器件（1）包括至少一个电接触膜（5）上的半导体芯片（1）的上侧（44），其中，所述接触膜（5）被构造。这种光电子部件（1）具有紧凑的结构并具有良好的热性能。

7. 发明申请

WO2004040661A3 METHOD FOR PRODUCING A LIGHT SOURCE PROVIDED WITH ELECTROLUMINESCENT DIODES AND COMPRISING A LUMINESCENCE CONVERSION ELEMENT 审中-公开
标题翻译：工艺生产具有发光转换元件一个个LED光源
公开(公告)号：WO2004040661A3
公开(公告)日：2004-09-10
申请号：PCT/DE0303493
申请日：2003-10-21
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , BRAUNE BERT , BRUNNER HERBERT
发明人： BRAUNE BERT , BRUNNER HERBERT
IPC分类号： H01L33/38 , H01L33/50 , H01L33/00
CPC分类号： H01L33/505 , H01L33/38 , H01L2224/11 , H01L2933/0016 , H01L2933/0041
摘要： The invention relates to a method for producing a light source provided with electroluminescent diodes, in particular mixed colour diodes. The inventive method consists in transforming at least one part of primary radiation emitted a chip by means of luminescence conversion. The inventive chip comprises a front electric contact (in terms of a surface oriented towards a radiation emission) and a luminescence conversion material applied thereto in the form of a thin film. Prior to coating, the front electric contact is made higher by the application of a conductive material to the surface thereof. The inventive method makes it possible to adjust in a target manner a defined chromatic localisation controlling said chromatic localisation (IEC chromaticity diagram) and reducing the layer of the luminescence conversion material. Said method is convenient, in particular for simultaneously producing several light sources provided with electrolumeniscent diodes from the plurality of similar chips in a section composite substrate.
摘要翻译：本发明描述了一种生产特定混合色LED光源的方法，至少从一个芯片初级辐射发射的光的一部分通过在发光装置转换。这是具有前侧（即，被hingewandt于辐射的侧）的发光转换材料的表面上的电接触被施加为薄层的芯片。为了这个目的，在涂覆之前的前侧电触点被增加在所述的电接触表面施加导电材料。该方法允许由色彩映射（IEC色度图）和发光转换材料的层变薄的控制是一个特定的颜色映射的一个特定的调整。此外，该方法是特别适合用于同时生产的在晶片组件的多个相同的码片的数的发光二极管光源。

8. 发明申请

WO02084749A3 CONDUCTOR FRAME AND HOUSING FOR A RADIATION-EMITTING COMPONENT, RADIATION EMITTING COMPONENT AND METHOD FOR PRODUCING THE SAME 审中-公开
标题翻译：梯形车架和住房用于生产天线的辐射组件，辐射分量和方法
公开(公告)号：WO02084749A3
公开(公告)日：2003-03-13
申请号：PCT/DE0201306
申请日：2002-04-09
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , BOGNER GEORG , BRUNNER HERBERT , HIEGLER MICHAEL , WAITL GUENTER
发明人： BOGNER GEORG , BRUNNER HERBERT , HIEGLER MICHAEL , WAITL GUENTER
IPC分类号： H01L33/48 , H01L33/62 , H01L33/64 , H01L33/00
CPC分类号： H01L33/62 , H01L33/486 , H01L33/60 , H01L33/642 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01057 , H01L2924/01079 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to a conductor frame (2) and a housing, in addition to a radiation-emitting component formed therewith and a method for the production thereof. The conductor frame has a support part with at least one binding wire connecting area (10) and at least one electric soldered connecting strip (3a,b), in which a separately built thermal connecting part (4) having a chip assembly area (11) is attached. In order to form the housing, the conductor frame (2) is enveloped with a molded material, wherein the thermal connecting part is embedded in such a way that it can be thermally connected from the outside.
摘要翻译：本发明涉及一种引线框架（2）和一个壳体，和一个这样形成的发射辐射的装置和用于其生产的方法。在这种情况下，引线框架具有承载部分与至少一个键合线的连接区域（10）和至少一个电Lötanschlussstreifen部（3a，b）转化为其中一个单独制造的热连接部分（4）连接，其包括芯片安装区域（11）。为了形成所述引线框架的一个壳体（2）优选地覆盖有模制材料，其特征在于，所述热连接器被嵌入，以便它是从外部热连接。

9. 发明申请

WO02091478A3 HOUSING FOR AN OPTOELECTRONIC COMPONENT AND OPTOELECTRONIC COMPONENT 审中-公开
标题翻译：住房的光电子器件和光电子器件
公开(公告)号：WO02091478A3
公开(公告)日：2003-02-20
申请号：PCT/DE0201645
申请日：2002-05-07
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , BRUNNER HERBERT , HARTL ALFRED , MARCHL WERNER
发明人： BRUNNER HERBERT , HARTL ALFRED , MARCHL WERNER
IPC分类号： H01L31/0203 , H01L31/0232 , H01L33/48 , H01L33/60 , H01L33/62 , H01L33/00
CPC分类号： H01L33/486 , H01L31/0203 , H01L31/02325 , H01L33/60 , H01L33/62 , H01L2224/48247 , H01L2224/73265 , H01L2924/10158 , H01L2224/48091 , H01L2924/00014
摘要： The invention relates to a housing for a component which emits and/or absorbs a radiation, comprising a housing base body (1) with a recess. An annular body (5) is fixed in the recess, surrounding a mounting surface for an element which emits and/or absorbs a radiation, which is embodied such that an inner surface of the annular aperture serves, at least partly, as a reflector for said radiation. The invention further relates to a component provided with such a housing.
摘要翻译：本发明描述了一种用于具有壳体基体（1）用的凹部，其中所述凹部为环状体（5）是固定的，发光的安装面用于辐射和/或接收发射辐射的和/或接收设备的壳体部件包围并且被形成为使得所述环孔的内表面至少部分地用作反射器的辐射。此外，本发明描述了配备有这样的外壳的装置。

10. 发明申请

WO03038912A2 OPTOELECTRONIC COMPONENT 审中-公开
标题翻译：光电组件
公开(公告)号：WO03038912A2
公开(公告)日：2003-05-08
申请号：PCT/DE0204025
申请日：2002-10-28
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , BOGNER GEORG , BRUNNER HERBERT , KRAEUTER GERTRUD , WAITL GUENTER
发明人： BOGNER GEORG , BRUNNER HERBERT , KRAEUTER GERTRUD , WAITL GUENTER
IPC分类号： H01L33/48 , H01L33/60 , H01L33/00
CPC分类号： H01L33/486 , H01L33/483 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： The invention concerns an optoelectronic component, in particular an optoelectronic component adapted to be surface-mounted, comprising a housing body (2), an optoelectronic semiconductor chip (3) arranged in particular in a recess (6) of the housing body, and electrical connections (1A, 1B), the semiconductor chip being in electroconductive connection with the electrical connections of the conductor network. The housing body (2) is made of a sheathing material, in particular a plastic material, filled with a filler material having a high degree of reflection in a wavelength range less than about 500 nm.
摘要翻译：光电子器件，特别是表面安装的光电器件具有一个壳体（2），特别是在凹部（6）的外壳主体设置光电子半导体芯片（3）和具有电端子（1A，1B），其中，半导体芯片与引线框架的电端子导电连接。壳体（2）由一包装材料，与具有高反射率的填料的波长区域低于约500nm形成特别是塑料材料制成。

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