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1. 发明申请

WO03038912A2 OPTOELECTRONIC COMPONENT 审中-公开
标题翻译：光电组件
公开(公告)号：WO03038912A2
公开(公告)日：2003-05-08
申请号：PCT/DE0204025
申请日：2002-10-28
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , BOGNER GEORG , BRUNNER HERBERT , KRAEUTER GERTRUD , WAITL GUENTER
发明人： BOGNER GEORG , BRUNNER HERBERT , KRAEUTER GERTRUD , WAITL GUENTER
IPC分类号： H01L33/48 , H01L33/60 , H01L33/00
CPC分类号： H01L33/486 , H01L33/483 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： The invention concerns an optoelectronic component, in particular an optoelectronic component adapted to be surface-mounted, comprising a housing body (2), an optoelectronic semiconductor chip (3) arranged in particular in a recess (6) of the housing body, and electrical connections (1A, 1B), the semiconductor chip being in electroconductive connection with the electrical connections of the conductor network. The housing body (2) is made of a sheathing material, in particular a plastic material, filled with a filler material having a high degree of reflection in a wavelength range less than about 500 nm.
摘要翻译：光电子器件，特别是表面安装的光电器件具有一个壳体（2），特别是在凹部（6）的外壳主体设置光电子半导体芯片（3）和具有电端子（1A，1B），其中，半导体芯片与引线框架的电端子导电连接。壳体（2）由一包装材料，与具有高反射率的填料的波长区域低于约500nm形成特别是塑料材料制成。

2. 发明申请

WO02084749A3 CONDUCTOR FRAME AND HOUSING FOR A RADIATION-EMITTING COMPONENT, RADIATION EMITTING COMPONENT AND METHOD FOR PRODUCING THE SAME 审中-公开
标题翻译：梯形车架和住房用于生产天线的辐射组件，辐射分量和方法
公开(公告)号：WO02084749A3
公开(公告)日：2003-03-13
申请号：PCT/DE0201306
申请日：2002-04-09
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , BOGNER GEORG , BRUNNER HERBERT , HIEGLER MICHAEL , WAITL GUENTER
发明人： BOGNER GEORG , BRUNNER HERBERT , HIEGLER MICHAEL , WAITL GUENTER
IPC分类号： H01L33/48 , H01L33/62 , H01L33/64 , H01L33/00
CPC分类号： H01L33/62 , H01L33/486 , H01L33/60 , H01L33/642 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01057 , H01L2924/01079 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to a conductor frame (2) and a housing, in addition to a radiation-emitting component formed therewith and a method for the production thereof. The conductor frame has a support part with at least one binding wire connecting area (10) and at least one electric soldered connecting strip (3a,b), in which a separately built thermal connecting part (4) having a chip assembly area (11) is attached. In order to form the housing, the conductor frame (2) is enveloped with a molded material, wherein the thermal connecting part is embedded in such a way that it can be thermally connected from the outside.
摘要翻译：本发明涉及一种引线框架（2）和一个壳体，和一个这样形成的发射辐射的装置和用于其生产的方法。在这种情况下，引线框架具有承载部分与至少一个键合线的连接区域（10）和至少一个电Lötanschlussstreifen部（3a，b）转化为其中一个单独制造的热连接部分（4）连接，其包括芯片安装区域（11）。为了形成所述引线框架的一个壳体（2）优选地覆盖有模制材料，其特征在于，所述热连接器被嵌入，以便它是从外部热连接。

3. 发明申请

WO2004004017A2 SURFACE-MOUNTABLE MINIATURE LIGHT-EMITTING DIODE AND/OR PHOTODIODE AND METHOD FOR THE PRODUCTION THEREOF 审中-公开
标题翻译：表层嵌微型发光和/或光电二极管和方法及其
公开(公告)号：WO2004004017A2
公开(公告)日：2004-01-08
申请号：PCT/DE0301831
申请日：2003-06-04
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , SORG JOERG , BOGNER GEORG , WAITL GUENTER , BRUNNER REINHOLD
发明人： SORG JOERG , BOGNER GEORG , WAITL GUENTER , BRUNNER REINHOLD
IPC分类号： H01L31/02 , H01L31/0203 , H01L33/48 , H01L33/62 , H05K1/02 , H05K3/34 , H01L33/00
CPC分类号： H01L33/62 , H01L31/0203 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2924/12041 , H05K1/0203 , H05K3/3442 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to a surface-mountable miniature light-emitting diode, comprising a chip housing, which has a lead frame (16) and a semiconductor chip (22). This semiconductor chip is situated on the lead frame (16) while in electrical contact therewith and contains an active radiation-emitting region. According to the invention, the lead frame (16) is formed by a flexible layer (12, 14) consisting of multiple layers.
摘要翻译：在与具有引线框（16）和一个布置在引线框（16）上的芯片封装的表面安装的微型发光二极管和与电接触半导体芯片（22），其含有的活性，发射辐射的区域，根据本发明，引线框架这个属性（16）由柔性多层片材（12，14）形成。

4. 发明申请

WO2004051757A3 OPTOELECTRONIC COMPONENT 审中-公开
标题翻译：光电子器件
公开(公告)号：WO2004051757A3
公开(公告)日：2004-12-23
申请号：PCT/DE0303923
申请日：2003-11-27
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , ARNDT KARLHEINZ , BOGNER GEORG , WAITL GUENTER , WINTER MATTHIAS
发明人： ARNDT KARLHEINZ , BOGNER GEORG , WAITL GUENTER , WINTER MATTHIAS
IPC分类号： H01L33/48 , H01L33/62 , H01L33/00 , H01L31/0203
CPC分类号： H01L33/62 , H01L33/486 , H01L2224/48247 , H01L2224/48465 , H01L2924/00
摘要： The invention relates to an optoelectronic component containing an optoelectronic chip (1), a chip carrier (2) with a central region (3), on which the chip is fixed and terminals (41, 42, 43, 44), which run from the central region of the chip carrier (2) to the exterior of said chip. The chip and sections of the chip carrier are surrounded by a body (5). The respective projection of the body, in addition to that of the longitudinal axes of the terminals on the contact plane between the chip and the chip carrier are essentially point-symmetrical in relation to the central point of the chip. The invention also relates to an assembly comprising said component. The advantage of the symmetrical configuration of the component is that the risk of thermomechanically induced malfunctions of the components is reduced.
摘要翻译：本发明涉及一种包括光电芯片（1），一个芯片载体的光电元件（2），其具有一个中心区域（3），在其上的芯片被固定，并用连接件（41，42，43，44）从中心区点对称-从向外的芯片载体（2），其中由主体（5）的芯片和芯片载体的部分是有包膜的延伸，并且其中所述主体的所述突起和在芯片和芯片载体之间的接触面的连接器的纵向轴线各自基本上到芯片的中心。此外，本发明涉及具有该部件的布置。由于设备的对称设计，这具有减小设备的热机械故障的风险的优点。

5. 发明申请

WO2006002603A2 LIGHT-EMITTING DIODE ASSEMBLY 审中-公开
标题翻译： LED的配置
公开(公告)号：WO2006002603A2
公开(公告)日：2006-01-12
申请号：PCT/DE2005000904
申请日：2005-05-18
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , BOGNER GEORG , GROETSCH STEFAN , WAITL GUENTER , WANNINGER MARIO
发明人： BOGNER GEORG , GROETSCH STEFAN , WAITL GUENTER , WANNINGER MARIO
IPC分类号： H01L33/58 , H01L33/60 , H01L33/00
CPC分类号： H01L33/62 , H01L33/58 , H01L33/60 , H01L33/64 , H01L2924/0002 , H01L2924/00
摘要： The invention relates to a light-emitting diode assembly comprising at least one light-emitting chip (1) with a radiation disengaging surface (2), via which the greater part of the electromagnetic radiation (13) that is generated in said chip emerges in a primary emission direction, a housing (5), which laterally surrounds the light-emitting chip (1) and a reflective lens (6), which is situated downstream of the disengaging surface (2) in the primary emission direction. The light-emitting diode assembly is particularly suitable for use in equipment such as camera mobile phones, digital cameras or video cameras.
摘要翻译：它是指定一个发光二极管阵列，包括（1）具有一个辐射输出的至少一个发光二极管芯片（2），通过该多数在LED芯片中产生的电磁辐射（13）在主发射方向射出，壳体（5）（LED芯片包围1）侧，并布置在所述主辐射方向的辐射（2）的下游的反射光学系统（6）。 LED布置是特别适合于在设备如照相手机，数码相机或视频相机。

6. 发明申请

WO0213231A3 RADIATION SOURCE AND METHOD FOR PRODUCING A LENS MOULD 审中-公开
标题翻译：辐射源和生产镜片表格的方法
公开(公告)号：WO0213231A3
公开(公告)日：2002-06-20
申请号：PCT/DE0102874
申请日：2001-07-30
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , BOGNER GEORG , GRAMANN WOLFGANG , KROMOTIS PATRICK , MARCHL WERNER , SPAETH WERNER , WAITL GUENTER
发明人： BOGNER GEORG , GRAMANN WOLFGANG , KROMOTIS PATRICK , MARCHL WERNER , SPAETH WERNER , WAITL GUENTER
IPC分类号： B29C39/02 , B29D11/00 , B29L11/00 , F21V5/04 , G02B3/00 , H01L25/075 , H01L33/00 , F21V5/00
CPC分类号： G02B3/0031 , B29D11/00278 , B29D11/00365 , F21V5/04 , F21Y2115/10 , G02B3/0056 , H01L25/0753 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2924/01019 , H01L2924/12041 , H01L2924/1815 , H01L2924/19041 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to a radiation source, which has an assembly of semiconductor chips that are positioned beneath a field of micro-lenses (8) arranged in a hexagonal lattice structure. The radiation source is characterised by a high radiation output and a high radiation density.
摘要翻译：辐射源包括布置在以六边形格子结构布置的微透镜（8）的场下方的半导体芯片阵列。辐射源具有高辐射功率和辐射率的特点。

7. 发明申请

WO2004097946A3 LIGHT SOURCE 审中-公开
标题翻译：光源
公开(公告)号：WO2004097946A3
公开(公告)日：2005-08-25
申请号：PCT/DE2004000800
申请日：2004-04-15
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , BOGNER GEORG , GROETSCH STEFAN
发明人： BOGNER GEORG , GROETSCH STEFAN
IPC分类号： H01L33/58 , G02B27/14 , G02F1/13
CPC分类号： H01L33/58 , G03B21/2033 , G03B21/208 , H04N9/3152 , H04N9/3164
摘要： The invention relates to a light source, particularly a projection light source for a projection system, comprising a multitude of semiconductor chips and at least two, preferably three different electromagnetic radiation-emitting types of chips with different emission spectra. Each semiconductor chip has a chip extraction surface via which the radiation is extracted. The light source also a multitude of primary optics elements, and a primary optics element is assigned to each semiconductor chip. Each primary optics element has a light input and a light output and reduces the divergence of at least one portion of the radiation emitted by the semiconductor chip during the operation thereof. The semiconductor chips are arranged with the primary optics elements in at least two interspaced groups so that the groups emit separate cones of light when the semiconductor chips are in operation. The separate cones of lights of the groups are superimposed by means of secondary optics to form a combined cone of light.
摘要翻译：本发明涉及一种光源，特别是投影光源的投影系统具有至少两个，优选三个多个半导体芯片，并且电磁辐射发射具有不同发射光谱，其中，每个半导体芯片具有芯片输出芯片位置，被辐射耦合输出。此外，所述光源中的各种主光学元件，其中每个半导体芯片被分配一个主光学元件，其每一个具有光输入端和光输出，并通过它们的辐射的操作期间从半导体芯片发射的光的至少一部分的发散减小。半导体芯片被布置成在至少两个局部地分开的组的主光学元件，使得该组中的半导体芯片的工作期间发射单独的光锥。组的单独的光锥被叠加由二次光学器件的装置，以形成光的一个共同的光束。

8. 发明申请

WO2008083672A3 HOUSING FOR AN OPTOELECTRONIC COMPONENT AND ARRANGEMENT OF AN OPTOELECTRONIC COMPONENT IN A HOUSING 审中-公开
标题翻译：住房在外壳的光电子器件和装置光电子器件
公开(公告)号：WO2008083672A3
公开(公告)日：2008-12-18
申请号：PCT/DE2008000029
申请日：2008-01-09
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , BOGNER GEORG , GRUBER STEFAN , ZEILER THOMAS , KIRSCH MARKUS
发明人： BOGNER GEORG , GRUBER STEFAN , ZEILER THOMAS , KIRSCH MARKUS
IPC分类号： H01L25/16 , H01L33/48 , H01L33/60
CPC分类号： H01L33/483 , H01L25/0753 , H01L25/167 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/73265 , H01L2924/00014
摘要： A plastic housing (2) is disposed on a support element (1) and comprises a recess (3) in which an optoelectronic component (12) is arranged. The recess (3) has an opening to the exterior (9) on the side facing away from the support element (1), which can be provided with a transparent cover. One or several structures (5, 6) can be provided at the plastic housing (2) in order to align the cover and/or the optical components relative to the optoelectronic component.
摘要翻译：塑料外壳（2）布置在承载元件（1）上，并且设置有凹部（3），在该光电器件（12）布置。在载体元件的从所述凹部（3）背向（1）侧具有到外部，其可以设置有透明盖的开口（9）。一个或多个结构（5,6）可被设置在塑料外壳（2）上以对准相对于所述光电子器件的覆盖物和/或光学部件。

9. 发明申请

WO2006012842A3 OPTOELECTRONIC COMPONENT THAT EMITS ELECTROMAGNETIC RADIATION AND ILLUMINATION MODULE 审中-公开
标题翻译：电磁辐射发射的光电子器件和灯模块
公开(公告)号：WO2006012842A3
公开(公告)日：2006-05-11
申请号：PCT/DE2005001283
申请日：2005-07-21
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , BOGNER GEORG , ENGL MORITZ , GROETSCH STEFAN , KROMOTIS PATRICK
发明人： BOGNER GEORG , ENGL MORITZ , GROETSCH STEFAN , KROMOTIS PATRICK
IPC分类号： H01L25/075 , H01L33/60
CPC分类号： H01L33/60 , F21S41/143 , F21Y2115/10 , H01L25/0753 , H01L2224/48091 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to an optoelectronic component that emits electromagnetic radiation. Said component comprises a housing body with a cavity that is configured as a trench, a plurality of semiconductor chips being arranged in a line in the cavity. Two neighbouring semiconductor chips are spaced at a distance from one another, which is less than or equal to one and a half lateral edge lengths of the semiconductor chip and greater than or equal to 0 µm. The invention also relates to an illumination module comprising a component of this type.
摘要翻译：本发明涉及一种电磁辐射发射的光电子器件，其包括具有空腔的壳体主体，其特征在于，所述空腔被等严重和多个半导体芯片被布置在所述腔中的线性排列构成。两个相邻的半导体芯片彼此具有其是小于或等于1，并且半导体芯片的一半侧向边缘长度和大于或等于0微米的间距。此外，光模块与这样的装置指定。

10. 发明申请

WO2006128416A3 HOUSING BODY AND METHOD FOR PRODUCTION THEREOF 审中-公开
标题翻译：住房和工艺及其
公开(公告)号：WO2006128416A3
公开(公告)日：2007-08-09
申请号：PCT/DE2006000778
申请日：2006-05-05
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , BOGNER GEORG , ARNDT KARLHEINZ
发明人： BOGNER GEORG , ARNDT KARLHEINZ
IPC分类号： H01L23/498 , H01L33/48 , H01L33/62
CPC分类号： H01L33/62 , H01L23/49805 , H01L24/48 , H01L31/0203 , H01L33/486 , H01L2224/48091 , H01L2924/00014 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/12044 , H01L2924/181 , H01L2924/3025 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： The invention relates to a housing body (1), comprising an upper side (2), a lower side (22), opposite the upper side (2) and lateral faces connecting the upper side (2) and the lower side (22) provided as assembly faces (19), whereby the housing body (1) comprises a number of layers (8) containing a ceramic material and a principal extension direction for the layers (23, 24, 25) runs perpendicular to the assembly faces (19). The invention further relates to a method for production of a housing body (1).
摘要翻译：本发明描述了一个壳体（1），其具有顶部（2），与所述上侧（2）的底部（22）相反的一个并具有一个顶面（2）和所述侧面连接作为安装面的底部（22）（19）设置，其中，所述外壳体（1），具有多个（8）含有陶瓷材料层，并且所述层（23，24，25）的主延伸方向横向于所述安装表面（19）。此外，被指定用于制造外壳体（1）的方法。

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