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1. 发明申请

WO2006099582A3 MINI WAVE SOLDERING SYSTEM AND METHOD FOR SOLDERING WIRES AND PIN CONFIGURATIONS 审中-公开
标题翻译：微波焊接系统和焊接线和引脚配置的方法
公开(公告)号：WO2006099582A3
公开(公告)日：2009-04-16
申请号：PCT/US2006009778
申请日：2006-03-15
申请人： MEDCONX INC , KENT HAROLD B , LEVANTE JAMES J , FINE AARON T , LAYTON JOSEPH R , FOX SARAH
发明人： KENT HAROLD B , LEVANTE JAMES J , FINE AARON T , LAYTON JOSEPH R , FOX SARAH
IPC分类号： H05K3/32
CPC分类号： H05K3/3447 , B23K3/0653 , B23K2201/32 , H01R4/023 , H01R43/0242 , H01R43/0256 , H05K1/0212 , H05K1/116 , H05K3/3494 , H05K2201/09781 , H05K2203/0195
摘要： A mini wave solder system includes a dielectric substrate having a hole defined therethrough, a conductive heat transfer pad, and a conductive retention pad. The heat transfer pad and retention pad are disposed adjacent to the hole and the retention pad has a thermally activated conductive material positioned thereon. The heat transfer pad, retention pad, and hole are in thermal communication with each other. A method for coupling a component to a substrate utilizing this system is also described. A wire termination system includes a dielectric substrate having a surface, a conductive material disposed on the surface of the dielectric substrate comprising a retention pad and a heat transfer pad in thermal communication with each other, and a thermally activated conductive material positioned on the retention pad. When heat is applied to the heat transfer pad, thermal energy travels to the retention pad to melt the thermally activated conductive material.
摘要翻译：微型波峰焊系统包括具有通过其定义的孔的电介质基片，导电传热垫和导电保持垫。传热垫和保持垫邻近孔设置并且保持垫具有定位在其上的热活化导电材料。传热垫，保持垫和孔彼此热连通。还描述了使用该系统将组件耦合到衬底的方法。电线终端系统包括具有表面的电介质基板，设置在电介质基板的表面上的导电材料，其包括保持垫和彼此热连通的传热垫，以及定位在保持垫上的热活化导电材料。当热量传递到传热垫时，热能传递到保持垫以熔化热活化的导电材料。

2. 发明申请

WO2006099582A2 MINI WAVE SOLDERING SYSTEM AND METHOD FOR SOLDERING WIRES AND PIN CONFIGURATIONS 审中-公开
标题翻译：微波焊接系统和焊接线和引脚配置的方法
公开(公告)号：WO2006099582A2
公开(公告)日：2006-09-21
申请号：PCT/US2006009778
申请日：2006-03-15
申请人： MEDCONX INC , KENT HAROLD B , LEVANTE JAMES J , FINE AARON T , LAYTON JOSEPH R , FOX SARAH
发明人： KENT HAROLD B , LEVANTE JAMES J , FINE AARON T , LAYTON JOSEPH R , FOX SARAH
IPC分类号： G01R31/02
CPC分类号： H05K3/3447 , B23K3/0653 , B23K2201/32 , H01R4/023 , H01R43/0242 , H01R43/0256 , H05K1/0212 , H05K1/116 , H05K3/3494 , H05K2201/09781 , H05K2203/0195
摘要： A mini wave solder system includes a dielectric substrate having a hole defined therethrough, a conductive heat transfer pad, and a conductive retention pad. A conductive material is associated with the hole. The heat transfer pad and retention pad are disposed adjacent to the hole and the retention pad has a thermally activated conductive material positioned thereon. The heat transfer pad, retention pad, and hole are in thermal communication with each other. A method for coupling a component to a substrate utilizing this system is also described. A wire termination system includes a dielectric substrate having a surface, a conductive material disposed on the surface of the dielectric substrate comprising a retention pad and a heat transfer pad in thermal communication with each other, and a thermally activated conductive material positioned on the retention pad. When heat is applied to the heat transfer pad, thermal energy travels to the retention pad to melt the thermally activated conductive material in order to secure a component to the conductive material. A method for coupling a component to a dielectric substrate in a wire termination system is also described. A pin connection system for coupling a pin to a dielectric substrate is also described. The pin connection system includes a dielectric substrate having a hole and electrical traces defined on a surface of the substrate, a pin positioned in the hole, and a connection solder disposed on a top surface of the pin. The pin has at least one radial protrusion disposed on an outer periphery thereof for perpendicularly aligning the pin with the substrate and for retaining the pin in the substrate in a substantially immobile manner. The connection solder at least one of strengthens the mechanical connection of the pin to the substrate and electrically connects the pin to the traces on the substrate.
摘要翻译：微型波峰焊系统包括具有通过其定义的孔的电介质基片，导电传热垫和导电保持垫。导电材料与孔相关联。传热垫和保持垫邻近孔设置并且保持垫具有定位在其上的热活化导电材料。传热垫，保持垫和孔彼此热连通。还描述了使用该系统将组件耦合到衬底的方法。电线终端系统包括具有表面的电介质基板，设置在电介质基板的表面上的导电材料，其包括保持垫和彼此热连通的传热垫，以及定位在保持垫上的热活化导电材料。当将热量施加到传热垫时，热能传递到保持垫以熔化热活化的导电材料，以便将部件固定到导电材料上。还描述了用于在线端接系统中将部件耦合到电介质基板的方法。还描述了用于将引脚耦合到电介质基板的引脚连接系统。引脚连接系统包括具有孔和限定在基板的表面上的电迹线的介质基板，位于孔中的销和布置在销的顶表面上的连接焊料。销具有设置在其外周上的至少一个径向突起，用于使销与基板垂直对准并且以基本上不可移动的方式将销保持在基板中。连接焊料至少有一个可以加强销到基板的机械连接，并将引脚电连接到基板上的迹线上。

3. 发明申请

WO2006099571A3 MICRO SOLDER POT 审中-公开
公开(公告)号：WO2006099571A3
公开(公告)日：2007-12-06
申请号：PCT/US2006009669
申请日：2006-03-15
申请人： MEDCONX INC , KENT HAROLD B , LEVANTE JAMES J , FINE AARON T , LAYTON JOSEPH R
发明人： KENT HAROLD B , LEVANTE JAMES J , FINE AARON T , LAYTON JOSEPH R
IPC分类号： A21B1/00
CPC分类号： H05K3/3494 , H01L23/13 , H01L24/02 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/04042 , H01L2224/45015 , H01L2224/45139 , H01L2224/45147 , H01L2224/48 , H01L2224/78 , H01L2224/85 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/19043 , H01R43/0256 , H05K1/116 , H05K1/184 , H05K3/3405 , H05K3/3442 , H05K3/3447 , H05K3/403 , H05K2201/09181 , H05K2201/0949 , H05K2201/09781 , H05K2201/09845 , H05K2201/10446 , H05K2201/10636 , H05K2203/0195 , Y02P70/611 , Y02P70/613 , H01L2924/2075 , H01L2924/00014 , H01L2924/20754 , H01L2924/20755 , H01L2924/00015
摘要： A micro solder pot includes a dielectric substrate having at least one hole formed therein, a conductive coating coupled to the interior of the hole, and at least one heat transfer pad spaced from the hole in thermal communication with the conductive coating of the hole. When the heat transfer pad is exposed to a heat source, the conductive coating inside the hole is heated. The micro solder pot may also include a thermally activated conductive material disposed within the hole. When the heat transfer pad is exposed to a heat source, the thermally activated conductive material becomes liquidus such that a component can be inserted into the liquidus material. When the heat source is removed, the thermally activated conductive material cools to couple the component to the conductive coating in the hole.
摘要翻译：微焊料罐包括具有形成在其中的至少一个孔的电介质衬底，耦合到孔的内部的导电涂层以及与孔间隔开的与孔的导电涂层热连通的至少一个传热垫。当传热垫暴露于热源时，孔内的导电涂层被加热。微焊料罐还可以包括设置在孔内的热活化导电材料。当传热垫暴露于热源时，热活化的导电材料变成液相线，使得部件可以插入液相线材料中。当热源被去除时，热活化的导电材料冷却以将部件耦合到孔中的导电涂层。

4. 发明申请

WO2006099571A9 MICRO SOLDER POT 审中-公开
公开(公告)号：WO2006099571A9
公开(公告)日：2006-11-09
申请号：PCT/US2006009669
申请日：2006-03-15
申请人： MEDCONX INC , KENT HAROLD B , LEVANTE JAMES J , FINE AARON T , LAYTON JOSEPH R
发明人： KENT HAROLD B , LEVANTE JAMES J , FINE AARON T , LAYTON JOSEPH R
IPC分类号： H01L23/28
CPC分类号： H05K3/3494 , H01L23/13 , H01L24/02 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/04042 , H01L2224/45015 , H01L2224/45139 , H01L2224/45147 , H01L2224/48 , H01L2224/78 , H01L2224/85 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/19043 , H01R43/0256 , H05K1/116 , H05K1/184 , H05K3/3405 , H05K3/3442 , H05K3/3447 , H05K3/403 , H05K2201/09181 , H05K2201/0949 , H05K2201/09781 , H05K2201/09845 , H05K2201/10446 , H05K2201/10636 , H05K2203/0195 , Y02P70/611 , Y02P70/613 , H01L2924/2075 , H01L2924/00014 , H01L2924/20754 , H01L2924/20755 , H01L2924/00015
摘要： A micro solder pot includes a dielectric substrate having at least one hole formed therein, a conductive coating coupled to the interior of the hole, and at least one heat transfer pad spaced from the hole in thermal communication with the conductive coating of the hole. When the heat transfer pad is exposed to a heat source, the conductive coating inside the hole is heated. The micro solder pot may also include a thermally activated conductive material disposed within the hole. When the heat transfer pad is exposed to a heat source, the thermally activated conductive material becomes liquidus such that a component can be inserted into the liquidus material. When the heat source is removed, the thermally activated conductive material cools to couple the component to the conductive coating in the hole.
摘要翻译：微型焊料坩埚包括其中形成有至少一个孔的电介质基底，与孔的内部连接的导电涂层，以及至少一个传热焊盘，该传热焊盘与孔间隔开，并与孔的导电涂层热连通。当传热垫暴露于热源时，孔内的导电涂层被加热。微型焊料罐也可以包括设置在孔内的热活化导电材料。当传热垫暴露于热源时，热激活的导电材料变成液态，使得可将组分插入液相线材料中。当去除热源时，热激活的导电材料冷却以将组件耦合到孔中的导电涂层。

5. 发明申请

WO2006012591A3 INTELLIGENT CONNECTOR ASSEMBLY FOR USE IN MEDICAL DEVICE CABLES 审中-公开
标题翻译：用于医疗设备电缆的智能连接器总成
公开(公告)号：WO2006012591A3
公开(公告)日：2006-03-23
申请号：PCT/US2005026239
申请日：2005-07-22
申请人： MEDCONX INC , KENT HAROLD B , LEVANTE JAMES J , FINE AARON T , LAYTON JOSEPH R
发明人： KENT HAROLD B , LEVANTE JAMES J , FINE AARON T , LAYTON JOSEPH R
IPC分类号： H01R13/66
CPC分类号： H05K1/02 , H01R9/032 , H01R13/502 , H01R13/5224 , H01R13/6658 , H05K3/0052 , H05K2201/09027 , H05K2201/09063 , H05K2201/09145 , H05K2201/10189 , H05K2203/167 , H05K2203/168 , Y10T29/49117 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165 , Y10T29/49204 , Y10T29/49222
摘要： An intelligent connector assembly for use in an interface between a device and a cable, including: a block having a circuit thereon, the block being configured to be received onto a housing, with alignment features on the housing and the block such that the block is receivable in only one orientation into the housing, and a plurality of external interfaces on the block. A method of simultaneously fabricating a plurality of circuit blocks for aligned positioning onto the housing of individual connectors, by: simultaneously fabricating a plurality of blocks on a single sheet of material; cutting a repeating pattern of holes across the single sheet; and separating the single sheet into sections such that each individual block is disposed on an identically shaped section of the single sheet.
摘要翻译：一种用于在设备和电缆之间的接口中使用的智能连接器组件，包括：其上具有电路的块，所述块被配置为被接收到壳体上，其具有壳体和块上的对准特征，使得块是在一个方向上可接收到壳体中，以及多个外部接口。一种同时制造多个电路块的方法，用于通过以下步骤同时制造多个电路块，所述多个电路块用于对准定位在各个连接器的壳体上：同时在单个材料片上制造多个块; 在单张纸上切割重复的孔图案; 并将单个片材分离成各个部分，使得每个单独的块被布置在单个片材的相同形状的部分上。

6. 发明申请

WO2004075349A2 MALE MEDICAL DEVICE ELECTRICAL CONNECTOR WITH ENGINEERED FRICTION FIT 审中-公开
标题翻译：带医疗器械的男性医疗器械电气连接器
公开(公告)号：WO2004075349A2
公开(公告)日：2004-09-02
申请号：PCT/US2004004814
申请日：2004-02-18
申请人： MEDCONX INC , KENT HAROLD B , LEVANTE JAMES J , ROFF THOR , LAYTON JOSEPH R , FINE AARON T
发明人： KENT HAROLD B , LEVANTE JAMES J , ROFF THOR , LAYTON JOSEPH R , FINE AARON T
IPC分类号： H01R13/52 , H01R
CPC分类号： H01R13/508 , H01R13/5202 , H01R13/5219 , H01R13/5224 , H01R13/641 , H01R27/00 , H01R2107/00 , H01R2201/12
摘要： A male connector, including: a body having a proximal end and a distal end; and an elastomeric member disposed around an outer surface of the distal end of the body, wherein the distal end of the body is configured to be received into a female connector interface in a medical device, and wherein the proximal end of the body is configured to receive an electronic block connector therein.
摘要翻译：一种阳连接器，包括：具有近端和远端的主体; 以及弹性体构件，其围绕所述主体的远端的外表面设置，其中所述主体的远端被配置为容纳在医疗装置中的阴连接器接口中，并且其中所述主体的近端被配置为在其中接收电子块连接器。

7. 发明申请

WO2005060401A3 DIRECT CONTACT POWER TRANSFER PAD AND METHOD OF MAKING SAME 审中-公开
标题翻译：直接接触力传递垫及其制造方法
公开(公告)号：WO2005060401A3
公开(公告)日：2007-03-15
申请号：PCT/US2004030857
申请日：2004-09-20
申请人： MEDCONX INC , KENT HAROLD B , LEVANTE JAMES J
发明人： KENT HAROLD B , LEVANTE JAMES J
IPC分类号： H01R12/04 , H05K1/11 , H05K3/06 , H05K3/24 , H05K3/28 , H05K3/42
CPC分类号： H02J7/0045 , H05K1/11 , H05K3/061 , H05K3/243 , H05K3/28 , H05K3/427 , H05K2201/0373 , H05K2201/0949 , H05K2201/09736 , H05K2201/09881 , H05K2203/072
摘要： A power transfer pad, having; an non-conductive (30) board having a top and a bottom plurality conductive substrates sections (32) disposed across the top of the non-conductive board (30); at least one conducting element disposed on each of the conductive substrate sections (32); a plurality of electrical contacts on the bottom the non-conductive board, wherein each of the electrical contacts on the bottom of the non-conductive board (30) are in electrical communication with one of the conductive substrate sections (32) on the top of non-conductive board (30).
摘要翻译：电力传输垫，具有; 非导电板（30），其具有横跨所述非导电板（30）的顶部设置的顶部和底部多个导电基板部分（32）; 至少一个导电元件设置在每个导电衬底部分（32）上; 在非导电板的底部上的多个电触点，其中非导电板（30）的底部上的每个电触点与导电基板部分（32）的顶部上的导电基板部分（32）电连通非导电板（30）。

8. 发明申请

WO2005060401A9 DIRECT CONTACT POWER TRANSFER PAD AND METHOD OF MAKING SAME 审中-公开
标题翻译：直接接触式动力传递垫及其制造方法
公开(公告)号：WO2005060401A9
公开(公告)日：2005-08-18
申请号：PCT/US2004030857
申请日：2004-09-20
申请人： MEDCONX INC , KENT HAROLD B , LEVANTE JAMES J
发明人： KENT HAROLD B , LEVANTE JAMES J
IPC分类号： H05K1/11 , H05K3/06 , H05K3/24 , H05K3/28 , H05K3/42
CPC分类号： H02J7/0045 , H05K1/11 , H05K3/061 , H05K3/243 , H05K3/28 , H05K3/427 , H05K2201/0373 , H05K2201/0949 , H05K2201/09736 , H05K2201/09881 , H05K2203/072
摘要： A power transfer pad, having: a non-conductive board having a top and a bottom; a plurality of conductive substrate sections disposed across the top of the non-conductive board; at least one conducting element disposed on each of the conductive substrate sections; a plurality of electrical contacts on the bottom of the non-conductive board, wherein each of the electrical contacts on the bottom of the non-conductive board are in electrical communication with one of the conductive substrate sections on the top of the non-conductive board.
摘要翻译：一种功率传输垫，具有：具有顶部和底部的非导电板; 多个导电基底部分，设置在所述不导电板的顶部上; 至少一个导电元件，设置在每个导电衬底部分上; 在所述非导电板的底部上的多个电触点，其中所述非导电板的底部上的每个电触点与所述非导电板的顶部上的所述导电衬底部分中的一个电导通。

9. 发明申请

WO2004075210A3 AN IMPROVED ELECTRICAL WIRE AND METHOD OF STRIPPING THE INSULATION THEREOF 审中-公开
标题翻译：改进的电线和剥离绝缘的方法
公开(公告)号：WO2004075210A3
公开(公告)日：2004-12-23
申请号：PCT/US2004004813
申请日：2004-02-18
申请人： MEDCONX INC , KENT HAROLD B , VIGUERIE MICHAEL C
发明人： KENT HAROLD B , VIGUERIE MICHAEL C
IPC分类号： H01B7/02 , H02G1/12 , H01B7/34 , H01B7/00
CPC分类号： H02G1/128 , H01B7/02 , H02G1/1287 , Y10T29/514
摘要： An electrical wire (10) has a central electrically conductive member (12) such as copper, aluminum, gold or silver or admixtures or alloys thereof, which is coated by a photoreisistive insulator (14), preferably of a negative photoresistive material such as polyimide. A non-mechanical method of stripping a desired portion of the length (16) of the insulator (14) from the electrical wire (10) comprises exposing the desired length (16) of the electrical wire (10) to a source of UV light (20). The UV light (20) then hardens a portion of the insulator (14). The non-exposed portion (16) of the insulator (14) can be dissolved by immersing it in a solvent.
摘要翻译：电线（10）具有中央导电构件（12），例如铜，铝，金或银或其混合物或合金，其由光电绝缘体（14）涂覆，优选为负光致抗蚀剂材料，例如聚酰亚胺。从电线（10）剥离绝缘体（14）的长度（16）的期望部分的非机械方法包括将电线（10）的期望长度（16）暴露于UV光源（20）。 UV光（20）然后硬化绝缘体（14）的一部分。通过将绝缘体（14）的非暴露部分（16）浸入溶剂中可以溶解。

10. 发明申请

WO2006099572A3 SYSTEM AND METHOD FOR ATTACHING A SUBSTANTIALLY THREE DIMENSIONAL STRUCTURE TO A SUBSTANTIALLY TWO DIMENSIONAL STRUCTURE 审中-公开
标题翻译：将主要三维结构连接到主要二维结构的系统和方法
公开(公告)号：WO2006099572A3
公开(公告)日：2008-12-04
申请号：PCT/US2006009670
申请日：2006-03-15
申请人： CATH INC E , KENT HAROLD B , KENT STEVEN T
发明人： KENT HAROLD B , KENT STEVEN T
IPC分类号： H01R9/00
CPC分类号： H05K7/06 , A61M25/0021 , A61M25/0023 , A61M25/0043 , A61M25/0045 , A61M25/005 , A61M2025/0037 , A61M2025/004 , B01L3/5027 , B81B2201/058 , B81C3/008 , H05K1/0272 , H05K1/182 , H05K1/183 , H05K3/341 , H05K3/3447 , H05K3/368 , H05K3/4046 , H05K2201/10265 , Y02P70/613 , Y10T29/4902 , Y10T29/49117 , Y10T137/0318 , Y10T137/8593
摘要： A method and system for transporting a fluid, gas, semi-solid, cryogen, or particulate matter, or combination thereof, between a three-dimensional structure and a substantially two-dimensional structure is disclosed. A system and method for electrically coupling a three-dimensional structure to a substantially two dimensional structure is also disclosed.
摘要翻译：公开了一种用于在三维结构和基本上二维结构之间输送流体，气体，半固体，低温或颗粒物质或其组合的方法和系统。还公开了一种将三维结构电耦合到基本二维结构的系统和方法。

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