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    • 5. 发明申请
    • SYSTEMS FOR INSPECTION OF PATTERNED OR UNPATTERNED WAFERS AND OTHER SPECIMEN
    • 用于检查图案或未加掩模的其他样本的系统
    • WO2004111623B1
    • 2005-03-17
    • PCT/US2004017707
    • 2004-06-04
    • KLA TENCOR TECH CORPBEVIS CHRISTOPHER FKIRK MIKEVAEZ-IRAVANI MEHDI
    • BEVIS CHRISTOPHER FKIRK MIKEVAEZ-IRAVANI MEHDI
    • G01N21/47G01N21/94G01N21/95
    • G01N21/956G01N21/474G01N21/94G01N21/9501
    • Systems for inspection of patterned and unpatterned wafers are provided. One system includes an illumination system configured to illuminate the specimen. The system also includes a collector configured to collect light scattered from the specimen. In addition, the system includes a segmented detector configured to separately detect different portions of the light such that azimuthal and polar angular information about the different portions of light is preserved. The detector may also be configured to produce signals representative of the different portions of the light. The system may also include a processor configured to detect defects on the specimen from the signals. In another embodiment, the system may include a stage that is configured to rotate and translate the specimen. In one such embodiment, the system may also include an illumination system configured to scan the specimen in a wide scan path during rotation and translation of the specimen.
    • 提供了用于图案化和未图案化晶片检查的系统。 一个系统包括被配置为照亮样本的照明系统。 该系统还包括收集器,用于收集从样品散射的光。 此外,该系统包括分段检测器,其被配置为分别检测光的不同部分,使得保持关于光的不同部分的方位角和极坐标信息。 检测器还可以被配置为产生表示光的不同部分的信号。 该系统还可以包括处理器,其配置成从信号中检测样本上的缺陷。 在另一个实施例中,系统可以包括被配置为旋转和平移样本的台。 在一个这样的实施例中,系统还可以包括被配置为在样本的旋转和平移期间以宽扫描路径扫描样本的照明系统。
    • 9. 发明申请
    • SYSTEMS CONFIGURED TO INSPECT A WAFER
    • 系统配置检查波形
    • WO2009023154A3
    • 2009-04-23
    • PCT/US2008009571
    • 2008-08-11
    • KLA TENCOR CORPKADKLY AZMIBIELLAK STEPHENVAEZ-IRAVANI MEHDI
    • KADKLY AZMIBIELLAK STEPHENVAEZ-IRAVANI MEHDI
    • H01L21/66
    • G01N21/9501
    • Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to illuminate an area on the wafer by directing light to the wafer at an oblique angle of incidence. The system also includes a collection subsystem configured to simultaneously collect light scattered from different spots within the illuminated area and to focus the light collected from the different spots to corresponding positions in an image plane. In addition, the system includes a detection subsystem configured to separately detect the light focused to the corresponding positions in the image plane and to separately generate output responsive to the light focused to the corresponding positions in the image plane. The output can be used to detect defects on the wafer.
    • 提供了配置用于检查晶片的系统。 一个系统包括照明子系统,该照明子系统被配置为以倾斜的入射角将光引导到晶片上来照射晶片上的区域。 该系统还包括收集子系统,其被配置为同时收集从照明区域内的不同点散射的光并且将从不同点收集的光聚焦到图像平面中的相应位置。 另外,该系统包括检测子系统,该检测子系统被配置为分别检测聚焦到图像平面中的对应位置的光,并且响应于聚焦到图像平面中的对应位置的光单独产生输出。 该输出可用于检测晶圆上的缺陷。