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    • 3. 发明申请
    • CONNECTION AND ADDRESSING OF MULTI-PLANE CROSSPOINT DEVICES
    • 多平面装置的连接和寻址
    • WO2011136795A1
    • 2011-11-03
    • PCT/US2010/033141
    • 2010-04-30
    • HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.PERNER, Frederick
    • PERNER, Frederick
    • H01L21/8239
    • H01L27/101H01L27/2481H01L45/08H01L45/1233H01L45/146
    • A multi-plane circuit structure has at least a first circuit plane and a second circuit plane, and each circuit plane has a plurality of row wire segments, a plurality of column wire segments, and a plurality of crosspoint devices formed at intersections of the row wire segments and the column wire segments. The row and column wire segments have a segment length for forming a preselected number of crosspoint devices thereon. Each row wire segment in the second circuit plane is connected to a row wire segment in the first circuit plane with no offset in a row direction and in a column direction, and each column wire segment in the second circuit plane is connected to a column wire segment in the first circuit plane with an offset length in both the row direction and the column direction. The offset length corresponds to half of the preselected number of crosspoint devices.
    • 多平面电路结构至少具有第一电路平面和第二电路平面,并且每个电路平面具有多个行线段,多个列线段以及形成在该行的交叉处的多个交叉点设备 线段和列线段。 行和列线段具有用于在其上形成预选数量的交叉点设备的段长度。 第二电路平面中的每行线段在第一电路平面中与行方向和列方向上没有偏移连接到行线段,并且第二电路平面中的每列线段连接到列线 在行方向和列方向上具有偏移长度的第一电路平面中的段。 偏移长度对应于预选数量的交叉点设备的一半。
    • 4. 发明申请
    • DUAL-PLANE MEMORY ARRAY
    • 双平面内存阵列
    • WO2012134450A1
    • 2012-10-04
    • PCT/US2011/030337
    • 2011-03-29
    • HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.PERNER, Frederick
    • PERNER, Frederick
    • H01L27/115H01L21/8247
    • H01L45/12H01L27/2481H01L45/08H01L45/1233H01L45/146
    • A memory array has a plurality of conductor structures. Each conductor structure has a top wire segment extending in a first direction, a middle wire segment extending in a second direction at an angle from the first direction, a bottom wire segment extending in a direction opposite to the first direction, and a via connecting the top, middle, and bottom wire segments. A plurality of memory cells in an upper plane of the memory array are formed at intersections of the middle wire segment of each conductor structure with the top wire segments of neighboring conductor structures, and a plurality of memory cells in a lower plane are formed at intersections of the middle wire segment of each conductor structure with the bottom wire segments of neighboring conductor structures.
    • 存储器阵列具有多个导体结构。 每个导体结构具有沿第一方向延伸的顶部线段,沿着与第一方向成一定角度的第二方向延伸的中间线段,沿与第一方向相反的方向延伸的底部线段,以及连接 顶部,中间和底部线段。 存储器阵列的上平面中的多个存储单元形成在每个导体结构的中间线段与相邻导体结构的顶部线段的交点处,并且下部平面中的多个存储单元形成在相交处 每个导体结构的中间线段与相邻导体结构的底部线段。
    • 7. 发明申请
    • CIRCUIT AND METHOD FOR READING A RESISTIVE SWITCHING DEVICE IN AN ARRAY
    • 用于读取阵列中的电阻式切换装置的电路和方法
    • WO2013032424A1
    • 2013-03-07
    • PCT/US2011/049337
    • 2011-08-26
    • HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.PERNER, Frederick
    • PERNER, Frederick
    • G11C13/00G11C16/26G11C7/10G11C7/06
    • G11C13/004G11C11/15G11C11/16G11C13/0007G11C2013/0054
    • A read circuit for sensing a resistance state of a resistive switching device in a crosspoint array utilizes a transimpedance equipotential preamplifier connected to a selected column line of the resistive switching device in the array. The equipotential preamplifier delivers a sense current while maintaining the selected column line at a reference voltage near a biasing voltage applied to unselected row lines of the array. A reference resistor is selectively connected to the equipotential preamplifier for setting a reference current, wherein the equipotential preamplifier is set to produce a preamplifier output voltage having a magnitude depending on whether the sense current is smaller or greater than the reference current. A voltage comparator is 10 connected to the equipotential preamplifier to compare the preamplifier output voltage with a setup reference voltage and generate a comparator output voltage indicative of the resistance state of the resistive switching device.
    • 用于感测交叉点阵列中的电阻式开关装置的电阻状态的读取电路利用连接到阵列中的电阻式开关装置的所选列线的跨阻抗等电位前置放大器。 等电位前置放大器提供感测电流,同时将选定的列线保持在靠近施加到阵列的未选行行的偏置电压的参考电压。 参考电阻器选择性地连接到等电位前置放大器以设置参考电流,其中等电位前置放大器被设置为产生具有取决于感测电流是小于还是大于参考电流的幅度的前置放大器输出电压。 电压比较器10连接到等电位前置放大器,以将前置放大器输出电压与设置参考电压进行比较,并生成表示电阻开关器件的电阻状态的比较器输出电压。
    • 9. 发明申请
    • INTERCONNECTION ARCHITECTURE FOR MEMORY STRUCTURES
    • 内存结构互连架构
    • WO2011112198A1
    • 2011-09-15
    • PCT/US2010/027188
    • 2010-03-12
    • HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.PERNER, Frederick
    • PERNER, Frederick
    • H01L21/8239H01L29/417
    • H01L27/0207H01L27/105H01L27/24
    • An interconnect architecture for connecting read/write circuitry (804) to a memory structure (200), the interconnect architecture includes a switching layer (222) comprising a number of access switches (310) arranged in at least one set of two offset switch blocks (312, 314), the access switches (310) being connected to a first set of parallel wire tracks (502) and a second set of parallel wire tracks (602) intersecting the first set of parallel wire tracks (502); and a routing layer (214) connecting the access switches (310) to a number of access vias (208, 210) of the memory structure (200); in which four wire tracks (502, 602) are used to select a programmable device (206) of the memory structure (200).
    • 一种用于将读/写电路(804)连接到存储器结构(200)的互连架构,所述互连架构包括切换层(222),其包括布置在至少一组两个偏移开关块中的多个访问开关(310) (312,314),所述接入开关(310)连接到与所述第一组平行线轨道(502)相交的第一组平行线轨道(502)和第二组平行线轨道(602); 以及将所述接入交换机(310)连接到所述存储器结构(200)的多个接入通路(208,210)的路由层(214); 其中四条电线轨道(502,602)用于选择存储器结构(200)的可编程设备(206)。