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    • 1. 发明申请
    • METHOD OF FORMING AN ELECTROMECHANICAL TRANSDUCER DEVICE
    • 形成机电传感器装置的方法
    • WO2011001293A2
    • 2011-01-06
    • PCT/IB2010001950
    • 2010-06-15
    • FREESCALE SEMICONDUCTOR INCCOMMISSARIAT ENERGIE ATOMIQUEPERRUCHOT FRANCOISLIU LIANJUNPACHECO SERGIODEFAY EMMANUELREY PATRICE
    • PERRUCHOT FRANCOISLIU LIANJUNPACHECO SERGIODEFAY EMMANUELREY PATRICE
    • H02N1/00
    • B81C1/00666B81B2203/0118B81C2201/0167B81C2201/0169
    • A method of forming an electromechanical transducer device (200) comprises forming (500) on a fixed structure (210) a movable structure (203) and an actuating structure of the electromechanical transducer device, wherein the movable structure (203) is arranged in operation of the electromechanical transducer device (200) to be movable in relation to the fixed structure in response to actuation of the actuating structure. The method further comprises providing (504) a stress trimming layer (216) on at least part of the movable structure (203), after providing the stress trimming layer (216), releasing (506) the movable structure (203) from the fixed structure (210) to provide a released electromechanical transducer device (200), and after releasing the movable structure (203), changing (508) stress in the stress trimming layer of the released electromechanical transducer device such that the movable structure (203) is deflected a predetermined amount relative to the fixed structure (210) when the electromechanical transducer device (200) is in an off state.
    • 一种形成机电换能器装置(200)的方法包括在固定结构(210)上形成(500)可移动结构(203)和机电换能器装置的致动结构,其中可移动结构(203)布置在操作中 所述机电换能器装置(200)响应于所述致动结构的致动而相对于所述固定结构可移动。 该方法还包括在提供应力修剪层(216)之后,在可移动结构(203)的至少一部分上提供(504)应力修剪层(216),将可移动结构(203)从固定 结构(210)以提供释放的机电换能器装置(200),并且在释放可移动结构(203)之后,改变(508)释放的机电换能器装置的应力修剪层中的应力,使得可移动结构(203) 当机电换能器装置(200)处于关闭状态时相对于固定结构(210)偏转预定量。
    • 4. 发明申请
    • PROCESS FOR FABRICATING AN ELECTRONIC COMPONENT COMBINING AN ELECTROMECHANICAL SYSTEM AND AN ELECTRONIC CIRCUIT
    • 制造电子元件组合电子系统和电子电路的方法
    • WO2011080409A3
    • 2011-09-09
    • PCT/FR2010000828
    • 2010-12-09
    • COMMISSARIAT ENERGIE ATOMIQUEPERRUCHOT FRANCOISDIEM BERNARDMOUREY BRUNOSILLON NICOLAS
    • PERRUCHOT FRANCOISDIEM BERNARDMOUREY BRUNOSILLON NICOLAS
    • B81C1/00
    • B81C1/00238B81C2201/019B81C2203/036
    • The invention relates to a process for fabricating an electronic component combining, starting from two different substrates, an electromechanical system and an electronic circuit, characterized in that it comprises: a) the production of a stack comprising first and second substrates separated by an intermediate layer (4), the first substrate comprising a mechanical layer (1, 3), the second substrate comprising an electronic circuit (10) consisting of localized (6) electrical contact regions (11) that are covered by the intermediate layer (4), the intermediate layer comprising a sacrificial layer (4) and a bonding layer (7), the sacrificial layer (4) being in contact with the first substrate (1, 3) and the intermediate layer being bonded to the second substrate via the bonding layer (7); b) the production through the mechanical layer (1), on the one hand, of first trenches (20), for structuring the mechanical layer (1), and, on the other hand, of second trenches (21) passing through the mechanical layer and the intermediate layer so as to define vias (25) extending as far as the electrical contact regions (1, 1) of the electronic circuit (10), the wall (23) and the bottom of each via (25), on the one hand, and a contact region (29) for each via on the surface of the mechanical layer (1), on the other hand, comprising an electrically conductive layer (26, 29); and c) the liberation of the electromechanical structure by etching all or part of the intermediate layer (4).
    • 本发明涉及一种用于制造电子部件的方法,该电子部件从两个不同的基板开始组合机电系统和电子电路,其特征在于,其包括:a)制造包括由中间层分隔的第一和第二基板的堆叠 (4),所述第一基板包括机械层(1,3),所述第二基板包括由中间层(4)覆盖的局部(6)电接触区域(11)组成的电子电路(10) 所述中间层包括牺牲层(4)和接合层(7),所述牺牲层(4)与所述第一衬底(1,3)接触,并且所述中间层经由所述接合层接合到所述第二衬底 (7); b)一方面通过第一沟槽(20)的机械层(1)的生产,用于构造机械层(1),另一方面通过穿过机械层(1)的第二沟槽(21) 层和中间层,以便限定延伸到电子电路(10)的电接触区域(1),壁(23)和每个通孔(25)的底部的通孔(25), 一方面,另一方面,在机械层(1)的表面上的每个通孔的接触区域(29)包括导电层(26,29); 以及c)通过蚀刻中间层(4)的全部或部分来解除机电结构。
    • 8. 发明申请
    • PLASMA STERILISATION SYSTEM
    • 等离子体灭菌系统
    • WO0222180A2
    • 2002-03-21
    • PCT/FR0102842
    • 2001-09-13
    • ABSYSPERRUCHOT FRANCOISJAFFREZIC MARIE PIERREDESTREZ PHILIPPEBOUSQUET SEVERINE
    • PERRUCHOT FRANCOISJAFFREZIC MARIE-PIERREDESTREZ PHILIPPEBOUSQUET SEVERINE
    • A23L3/32A61B1/12A61L2/14A61L2/20A61L2/24
    • A61L2/202A61B1/121A61L2/14A61L2/24
    • The invention concerns a plasma sterilisation system in the presence of humidity from a non-biocidal gas containing oxygen and nitrogen of at least an object placed outside the discharge in a sealed treatment chamber substantially subjected to atmospheric pressure, said method comprising the following steps: introducing the humidified non-biocidal gas into the treatment chamber, generating a first plasma discharge A for a specific duration ensuring the efficacy of the sterilising species generated during the following phase in the entire chamber; generating a second plasma discharge B for a specific duration ensuring sterilisation of said object and rinsing the treatment chamber for a specific duration to ensure a non-polluting atmosphere when the chamber is subsequently opened. Preferably, the first plasma discharge and the introduction of humidity are simultaneous and the first and second plasma discharges can overlap such that the generation of the second plasma starts before the end of the first plasma discharge. The invention also concerns various devices for implementing said method in particular for sterilising all types of medical objects.
    • 本发明涉及一种等离子体灭菌系统,该系统在来自包含氧和氮的非杀生物气体的湿气存在下,至少放置在基本承受大气压力的密封处理室中的物体外,所述方法包括以下步骤:引入 加湿的非杀生物气体进入处理室,在特定的持续时间内产生第一等离子体放电A,确保在整个室中的后续阶段期间产生的杀菌物质的功效; 在确定的持续时间内产生第二等离子体放电B,确保所述物体的消毒和漂洗处理室达特定的持续时间,以确保随后打开室时的无污染气氛。 优选地,第一等离子体放电和湿气的引入是同时的,并且第一和第二等离子体放电可以重叠,使得在第一等离子体放电结束之前开始第二等离子体的生成。 本发明还涉及用于实施所述方法的各种装置,特别是用于消毒所有类型的医用物品。