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1. 发明申请

WO1995018461A1 METHOD AND PELLET FOR ENCAPSULATING LEAD FRAMES AND DEVICE FOR MANUFACTURING PELLETS 审中-公开
标题翻译：用于封装引线框架的方法和薄片和用于制造薄片的装置
公开(公告)号：WO1995018461A1
公开(公告)日：1995-07-06
申请号：PCT/NL1994000317
申请日：1994-12-13
申请人： FICO B.V. , DANNENBERG, Johannes, Lambertus, Martinus
发明人： FICO B.V.
IPC分类号： H01L21/56
CPC分类号： B29C45/462 , B29C45/14655 , B29C45/463 , H01L21/565 , H01L2924/0002 , Y10T428/23 , H01L2924/00
摘要： The invention relates to a method and pellet for encapsulating lead frames (5). Prior to applying pressure to a pellet (6) a plastic foil (11) is placed between the pellet (6) and a plunger (10). The pellet (6) is characterized in that it consists of a body of encapsulating material (e.g. epoxy) and a plastic layer connected thereto. The invention further relates to a device for manufacturing such a pellet (6).
摘要翻译：本发明涉及用于封装引线框架（5）的方法和沉积物。在对颗粒（6）施加压力之前，将塑料箔（11）放置在颗粒（6）和柱塞（10）之间。颗粒（6）的特征在于其由包封材料（例如环氧树脂）和与其连接的塑料层组成。本发明还涉及一种用于制造这种颗粒（6）的装置。

2. 发明申请

WO1997035703A1 MOULD ASSEMBLY AND METHOD FOR USE THEREOF 审中-公开
标题翻译：模具组装及其使用方法
公开(公告)号：WO1997035703A1
公开(公告)日：1997-10-02
申请号：PCT/NL1997000143
申请日：1997-03-19
申请人： FICO B.V. , HARMSEN, Wilhelmus, Hendrikus, Johannes , WEGGEN, Martin, Herman , DANNENBERG, Johannes, Lambertus, Martinus , VAN DRIEL, Albertus, Franciscus, Gerardus
发明人： FICO B.V.
IPC分类号： B29C45/02
CPC分类号： B29C45/2675 , B29C45/02 , B29C45/14655 , B29C45/2673
摘要： The invention relates to a mould assembly for encapsulating electronic components mounted on so-called lead frames, comprising: support elements which can be coupled to the sides of the two mould halves remote from the sides closing onto each other. The invention also comprises a method for placing at least a part of such a mould assembly in a pressing device. Another aspect of the invention relates to a mould assembly comprising a base in which can be placed a carriage having at least one mould cavity. Another aspect of the invention relates to a mould assembly wherein a plunger can be connected releasably to a plunger carrier.
摘要翻译：本发明涉及一种用于封装安装在所谓的引线框架上的电子部件的模具组件，包括：支撑元件，其可以耦合到远离彼此闭合的侧面的两个半模的侧面。本发明还包括用于将这种模具组件的至少一部分放置在压制装置中的方法。本发明的另一方面涉及一种包括基座的模具组件，其中可以放置具有至少一个模腔的托架。本发明的另一方面涉及一种模具组件，其中柱塞可以可拆卸地连接到柱塞架。

3. 发明申请

WO1997050110A1 DEVICE FOR SEPARATE REMOVAL FROM A HOLDER OR INTRODUCING INTO A HOLDER OF CARRIERS FOR ELECTRONICAL COMPONENTS 审中-公开
标题翻译：用于从持有人单独移除或引入电子部件运营商持有人的设备
公开(公告)号：WO1997050110A1
公开(公告)日：1997-12-31
申请号：PCT/NL1997000320
申请日：1997-06-06
申请人： FICO B.V. , HARMSEN, Wilhelmus, Hendrikus, Johannes , LEMMERS, Henricus, Jozephus, Marinus
发明人： FICO B.V.
IPC分类号： H01L21/00
CPC分类号： H01L21/67778
摘要： The invention relates to a device for separate removal from a holder filled with electronic components, in particular so-called lead frames, mounted on carriers or for introduction of the carriers into an at least partly empty holder. The device according to the invention comprises a frame with a feed position and a discharge position, a lift connected to the frame for moving a holder in indexed manner in vertical direction along removing means respectively along supply means, and transporting means for displacing a holder from a feed position to a lift and from the lift to the discharge position. The lift is also provided with at least one suction nozzle for positioning a cassette on the lift.
摘要翻译：本发明涉及一种用于从充满电子部件，特别是所谓的引线框架的保持器中分离地移除的装置，其安装在载体上或用于将载体引入至少部分空的容器中。根据本发明的装置包括具有进给位置和排放位置的框架，连接到框架的升降机，用于沿着沿着供应装置的拆卸装置沿垂直方向以分度方式移动保持架，以及用于将支架从进给位置到电梯和从电梯到排放位置。升降机还设置有至少一个用于在电梯上定位磁带的吸嘴。

4. 发明申请

WO1997048530A1 TRANSFER DEVICE AND ARRANGEMENT OF TRANSFER DEVICE AND HEATER 审中-公开
标题翻译：传输设备和传送设备和加热器的布置
公开(公告)号：WO1997048530A1
公开(公告)日：1997-12-24
申请号：PCT/NL1997000327
申请日：1997-06-10
申请人： FICO B.V. , HARMSEN, Wilhelmus, Hendrikus, Johannes , VAN DRIEL, Albertus, Franciscus, Gerardus
发明人： FICO B.V.
IPC分类号： B25J17/02
CPC分类号： B25J17/0208 , B25J9/10
摘要： The invention relates to a device (1) for transferring electronic components mounted on a carrier from a feed position to at least two lay-off positions (7). For this purpose the device comprises a manipulator (6) which is movable between a position close to the feed position and positions close to the lay-off positions, wherein the manipulator is provided with positioning means (43) and the feed position and lay-off positions are provided with counter-positioning means (47) for precise positioning of the manipulator close to the feed position and lay-off positions. These positioning means and counter-positioning means can preferably be formed by at least one protrusion and a recess which co-acts with the protrusion and in which the protrusion can be received in close-fitting manner.
摘要翻译：本发明涉及一种用于将安装在载体上的电子部件从进给位置传送到至少两个卸下位置（7）的装置（1）。为此，该装置包括操纵器（6），该操纵器可在靠近进给位置的位置和靠近卸载位置的位置之间移动，其中操纵器设置有定位装置（43）关闭位置设置有用于将机械手精确定位在靠近进给位置和裁切位置的对位定位装置（47）。这些定位装置和反向定位装置可以优选地由至少一个突出部和与突起共同作用的凹部形成，并且突起可以以紧密配合的方式容纳在该凹部中。

5. 发明申请

WO1997048125A1 DEVICE FOR SIMULTANEOUS TRANSPORT AND CHANGE OF ORIENTATION OF AT LEAST ONE CARRIER FOR ELECTRONIC COMPONENTS 审中-公开
标题翻译：用于同时运输和更改电子组件最少一个运输方向的设备
公开(公告)号：WO1997048125A1
公开(公告)日：1997-12-18
申请号：PCT/NL1997000317
申请日：1997-06-05
申请人： FICO B.V. , HARMSEN, Wilhelmus, Hendrikus, Johannes , ZOETHOUT, Stijn, Klaas, Tjeerd
发明人： FICO B.V.
IPC分类号： H01L21/00
CPC分类号： H01L21/67706 , H01L21/67718 , H01L21/67721 , H01L21/6838
摘要： The invention relates to a device for simultaneously displacing and changing the orientation of at least one carrier for electronic components, in particular a lead frame. Such a device comprises at least one gripper for engaging the carrier, height adjusting means connected to the gripper for causing the gripper to move perpendicular to the carrier, displacing means for moving the gripper between the feed and discharge position with which the orientation of the gripper is also changed, and a frame to which the height adjusting means and the gripper are connected with interposing of the displacing means.
摘要翻译：本发明涉及用于同时移位和改变用于电子部件，特别是引线框架的至少一个载体的取向的装置。这种装置包括用于接合托架的至少一个夹持器，连接到夹具的高度调节装置，用于使夹持器垂直于托架移动;移位装置，用于使夹持器在进给位置和排出位置之间移动，夹持器并且高度调节装置和夹持器通过移位装置的插入而连接的框架。

6. 发明申请

WO1997035701A1 PRESS FOR ENCAPSULATING ELECTRONIC COMPONENTS AND METHODS FOR USE OF THE PRESS 审中-公开
标题翻译：用于封装电子元件的压力和使用压力的方法
公开(公告)号：WO1997035701A1
公开(公告)日：1997-10-02
申请号：PCT/NL1997000142
申请日：1997-03-19
申请人： FICO B.V. , HARMSEN, Wilhelmus, Hendrikus, Johannes , VAN HAREN, Lambertus, Franciscus, Wilhelmus , VENROOIJ, Johannes, Lambertus, Gerardus, Maria
发明人： FICO B.V.
IPC分类号： B29C33/22
CPC分类号： H01L21/67126 , B29C33/22 , B29C45/021 , B29C45/661
摘要： The invention relates to a device for encapsulating electronic components, mounted on so-called lead frames, in a mould assembled from two mould halves (2, 3) movable relative to each other and closable onto each other. The means for causing the mould halves to move and to close are formed by a rotatable eccentric which can be coupled to one of the mould halves with interposing of at least one connecting rod (11). The invention also relates to a method for driving such a device. Another aspect of the invention relates to an encapsulating device wherein a one mould half (3) is connectable to the means for causing the mould halves to move and close and the second mould half (2) is connectable to a counter-plate (21) which forms part of the device, which counter-plate is displaceable between two end positions. Yet another aspect of the invention relates to an encapsulating device with a counter-plate (21), which counter-plate comprises: a plurality of stacked, substantially plate-like parts (27, 28), between which parts at least one shaft (29, 30) is placed. Finally, a last aspect of the invention is formed by means for exerting pressure on encapsulating material comprising at least two screw spindles (32, 33, 34, 35).
摘要翻译：本发明涉及一种用于将安装在所谓的引线框架上的电子元件封装在由相对于彼此可相对移动并相互封闭的两个半模（2,3）组装的模具中的封装装置。用于使半模移动和关闭的装置由可旋转的偏心轮形成，其可以通过插入至少一个连杆（11）而联接到一个半模。本发明还涉及一种用于驱动这种装置的方法。本发明的另一方面涉及一种封装装置，其中一个半模（3）可连接到用于使半模移动和关闭的装置，并且第二半模（2）可连接到对置板（21）其形成装置的一部分，该对置板可在两个端部位置之间移位。本发明的另一方面涉及一种具有反平板（21）的封装装置，该对置板包括：多个堆叠的基本上板状的部件（27,28），其间至少有一个轴（ 29，30）。最后，本发明的最后一个方面是通过对包含至少两个螺杆心轴（32,33,34,35）的包封材料施加压力的方式形成的。

7. 发明申请

WO1996001495A1 METHOD, CARRIER AND MOULD PARTS FOR ENCAPSULATING A CHIP 审中-公开
标题翻译：方法，用于包封芯片的载体和模具部件
公开(公告)号：WO1996001495A1
公开(公告)日：1996-01-18
申请号：PCT/NL1995000232
申请日：1995-07-03
申请人： FICO B.V. , GIESEN, Henricus, Bernardus, Antonius
发明人： FICO B.V.
IPC分类号： H01L21/56
CPC分类号： H01L21/565 , B23K2101/04 , H01L23/3121 , H01L2924/0002 , H01L2924/1815 , H01L2924/00
摘要： The invention relates to a method for encapsulating a chip placed on a flat carrier (1), on one side of which is arranged the chip for encapsulating and on the other side of which are arranged the connection points distributed in a grid structure over the carrier (1), by: placing the carrier between two mould halves (9, 10) movable between an opened and a closed position and bounding a mould cavity in the closed position, and transporting encapsulating material (3) from a supply device to a mould cavity through a channel (7, 15) arranged in the carrier (1).
摘要翻译：本发明涉及一种用于封装放置在平坦载体（1）上的芯片的方法，该芯片的一侧布置有用于封装的芯片，并且在另一侧上布置有以载体形式分布在网格结构中的连接点（1），通过以下步骤：将所述载体放置在可在打开和关闭位置之间移动的两个半模（9,10）之间，并将模腔限定在关闭位置，以及将封装材料（3）从供给装置传送到模具通过布置在载体（1）中的通道（7,15）。

8. 发明申请

WO1995031004A1 APPARATUS FOR ENCAPSULATING WITH PLASTIC A LEAD FRAME WITH CHIPS 审中-公开
标题翻译：用塑料制成的铅框架的装置
公开(公告)号：WO1995031004A1
公开(公告)日：1995-11-16
申请号：PCT/NL1995000163
申请日：1995-05-04
申请人： FICO B.V. , PETERS, Hendrikus, Johannes, Bernardus
发明人： FICO B.V.
IPC分类号： H01L21/56
CPC分类号： H01L21/565 , B29C45/02 , B29C45/586 , H01L23/3121 , H01L23/49816 , H01L23/49827 , H01L2924/0002 , H01L2924/00
摘要： The invention relates to an apparatus for encapsulating with plastic lead frames carrying chips, comprising mutually movable mould halves (102, 103) which in the closed position bound a mould cavity for receiving a lead frame, a feed runner connecting onto the mould cavity for supplying encapsulating material and a plunger-cylinder (175) connected onto this feed runner for carrying up encapsulating material under pressure, characterized in that at a distance from the head end of the plunger (175) a peripheral groove (170) is arranged which is connected to the head end by means of at least one flow channel (171).
摘要翻译：本发明涉及一种用于将塑料引线框架封装在一起的装置，该装置包括相互移动的半模（102,103），该半模在闭合位置处限定用于接收引线框架的模腔，连接到模腔上的进料流道封装材料和连接到该进料流道上的柱塞缸（175），用于在压力下承载密封材料，其特征在于，在距离柱塞（175）的头端一定距离处，连接有周向槽（170），其连接通过至少一个流动通道（171）到头端。

9. 发明申请

WO1998009322A1 METHOD AND DEVICE FOR FORMING A LEAD FRAME 审中-公开
标题翻译：用于形成引线框架的方法和装置
公开(公告)号：WO1998009322A1
公开(公告)日：1998-03-05
申请号：PCT/NL1997000496
申请日：1997-08-29
申请人： FICO B.V. , VAN DALEN, Adrianus, Wilhelmus
发明人： FICO B.V.
IPC分类号： H01L21/48
CPC分类号： H05K13/0092 , H01L21/4842
摘要： The principle of the method and device focuses on engaging a lead (5) with engaging means (10) and subsequently displacing these engaging means (10) so that the lead (5) is bent without the engaging member displacing relative to the lead. The surface of the lead (5), which is usually provided with a costly and sensitive metal film, is thus prevented from being damaged as a result of a mutual movement of lead and engaging member (10).
摘要翻译：该方法和装置的原理着重于将引线（5）与接合装置（10）接合并随后使这些接合装置（10）移位，使得引线（5）弯曲，而接合构件相对于引线移位。因此，由于引线和接合构件（10）的相互移动，防止了引线（5）的通常设有成本高且敏感的金属膜的表面损坏。

10. 发明申请

WO1998002903A1 DEVICE FOR SEPARATE REMOVAL FROM A HOLDER OR PLACING INTO A HOLDER OF STACKABLE CARRIERS OF ELECTRONIC COMPONENTS 审中-公开
标题翻译：用于从持有人单独移除或放入电子组件的可堆叠运载器的持有人的设备
公开(公告)号：WO1998002903A1
公开(公告)日：1998-01-22
申请号：PCT/NL1997000321
申请日：1997-06-06
申请人： FICO B.V. , DERDE, Wilhelmus, Geertruda, Richardus, Maria , HARMSEN, Wilhelmus, Hendrikus, Johannes , LEMMERS, Henricus, Jozephus, Marinus
发明人： FICO B.V.
IPC分类号： H01L21/00
CPC分类号： H01L21/67778 , H05K13/021
摘要： The invention relates to a device for separate removal from a holder or placing into a holder of stackable carriers of electronic components, also known as lead frames, comprising: a frame, a gripper for displacing at least one carrier, a displaceable support element which is movable in the holder, a buffer holder and drive means for causing displacement of gripper, support element and buffer holder.
摘要翻译：本发明涉及一种用于从保持器单独移除或放置到电子部件（也称为引线框架）的可堆叠载体的保持器中的装置，其包括：框架，用于移动至少一个托架的夹持器，可移位的支撑元件，可移动在保持器中，缓冲保持器和用于引起夹持器，支撑元件和缓冲器保持器的移位的驱动装置。

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