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    • 5. 发明申请
    • METHOD FOR THE PRODUCTION OF A CIRCUIT BOARD INVOLVING THE REMOVAL OF A SUBREGION THEREOF, AND USE OF SUCH A METHOD
    • 一种用于生产电路板的拆卸同一地区,这种程序使用下列的一部分
    • WO2013082638A3
    • 2013-11-07
    • PCT/AT2012000303
    • 2012-12-03
    • AUSTRIA TECH & SYSTEM TECH
    • LEITGEB MARKUSWEIDINGER GERALDLANGER GREGORKARPOVYCH VOLODYMYR
    • H05K3/46B32B38/10
    • H05K3/46H05K3/0044H05K3/4691H05K2201/09127H05K2203/0191H05K2203/0264H05K2203/107Y10T29/49156
    • The invention relates to a method for producing a circuit board involving the removal of a subregion thereof. In said method, at least two layers or plies of the circuit board (1) are interconnected, the subregion (6) to be removed is prevented from being connected to an adjacent ply of the circuit board by providing a layer (7) of adhesion-preventing or bonding-preventing material, and peripheral zones (8) of the subregion (6) to be removed are separated from adjoining zones of the circuit board (1). According to the invention, a fissure formation and/or a detachment from the subregion (6) of the circuit board (1) to be removed is initiated in a subregion in or on the layer (7) of adhesion-preventing or bonding-preventing material, and the subregion (6) to be removed is then removed, thus making it possible to remove a subregion (6) to be removed from a circuit board (1) in a simple and reliable, and if necessary automated, manner. Also disclosed is a use of such a method for producing a multilayer circuit board (1) and especially for creating voids in such a circuit board (1).
    • 在用于通过除去其一部分,其中至少两个层或所述电路板(1)的层片被连接到彼此和要除去部分的连接制造印刷电路板的方法(6)与由规定的层(PCB的位于相邻的层 7)从粘合或粘结防止材料和(6)的电路板(1)被分离的邻接区域的,它提供了(在或层上的要被去除的部分的边缘区域(8)防止7) 从粘合或粘着防止材料在要被去除的部分的裂纹和/或分离的形成的一部分被诱导(6)的电路板(1),并随后将被去除的部分(6)被除去,从而容易地且以 可靠和任选地,以自动的方式被移除的印刷电路板的部分(6)(1)N 可以ERNT。 此外,用于在这样的印刷电路板(1)的多层印刷电路板(1),特别是对于空洞的产生制造使用这样的方法的建议。