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1. 发明申请

WO2013082638A3 METHOD FOR THE PRODUCTION OF A CIRCUIT BOARD INVOLVING THE REMOVAL OF A SUBREGION THEREOF, AND USE OF SUCH A METHOD 审中-公开
标题翻译：一种用于生产电路板的拆卸同一地区，这种程序使用下列的一部分
公开(公告)号：WO2013082638A3
公开(公告)日：2013-11-07
申请号：PCT/AT2012000303
申请日：2012-12-03
申请人： AUSTRIA TECH & SYSTEM TECH
发明人： LEITGEB MARKUS , WEIDINGER GERALD , LANGER GREGOR , KARPOVYCH VOLODYMYR
IPC分类号： H05K3/46 , B32B38/10
CPC分类号： H05K3/46 , H05K3/0044 , H05K3/4691 , H05K2201/09127 , H05K2203/0191 , H05K2203/0264 , H05K2203/107 , Y10T29/49156
摘要： The invention relates to a method for producing a circuit board involving the removal of a subregion thereof. In said method, at least two layers or plies of the circuit board (1) are interconnected, the subregion (6) to be removed is prevented from being connected to an adjacent ply of the circuit board by providing a layer (7) of adhesion-preventing or bonding-preventing material, and peripheral zones (8) of the subregion (6) to be removed are separated from adjoining zones of the circuit board (1). According to the invention, a fissure formation and/or a detachment from the subregion (6) of the circuit board (1) to be removed is initiated in a subregion in or on the layer (7) of adhesion-preventing or bonding-preventing material, and the subregion (6) to be removed is then removed, thus making it possible to remove a subregion (6) to be removed from a circuit board (1) in a simple and reliable, and if necessary automated, manner. Also disclosed is a use of such a method for producing a multilayer circuit board (1) and especially for creating voids in such a circuit board (1).
摘要翻译：在用于通过除去其一部分，其中至少两个层或所述电路板（1）的层片被连接到彼此和要除去部分的连接制造印刷电路板的方法（6）与由规定的层（PCB的位于相邻的层 7）从粘合或粘结防止材料和（6）的电路板（1）被分离的邻接区域的，它提供了（在或层上的要被去除的部分的边缘区域（8）防止7）从粘合或粘着防止材料在要被去除的部分的裂纹和/或分离的形成的一部分被诱导（6）的电路板（1），并随后将被去除的部分（6）被除去，从而容易地且以可靠和任选地，以自动的方式被移除的印刷电路板的部分（6）（1）N 可以ERNT。此外，用于在这样的印刷电路板（1）的多层印刷电路板（1），特别是对于空洞的产生制造使用这样的方法的建议。

2. 发明申请

WO2013082637A3 METHOD FOR THE PRODUCTION OF A CIRCUIT BOARD INVOLVING THE REMOVAL OF A SUBREGION THEREOF, AND USE OF SUCH A METHOD 审中-公开
标题翻译：制造PCB的方法以及使用这种方法去除PCB的材料
公开(公告)号：WO2013082637A3
公开(公告)日：2013-09-06
申请号：PCT/AT2012000302
申请日：2012-12-03
申请人： AUSTRIA TECH & SYSTEM TECH
发明人： LEITGEB MARKUS , WEIDINGER GERALD , SCHMID GERHARD , MARELJIC LJUBOMIR
IPC分类号： H05K3/00 , H05K3/46
CPC分类号： H05K3/4697 , H05K3/0044 , H05K3/4691 , H05K2201/09127 , H05K2203/0191 , H05K2203/0264 , Y10T29/49156
摘要： The invention relates to a method for producing a circuit board (1) involving the removal of a subregion (6) thereof. In said method, at least two layers or plies (2, 3, 4, 5) of the circuit board (1) are interconnected, the subregion (6) to be removed is prevented from being connected to an adjacent ply (4) of the circuit board (1) by providing or applying an adhesion-preventing material (7), and peripheral zones (8) of the subregion (6) to be removed are separated from adjoining zones of the circuit board (1). According to the invention, once the peripheral zones (8) have been separated or entirely cut off, an outer surface (9) of the subregion (6) to be removed is coupled or connected to an external element (11), and the subregion (6) to be removed is separated from the adjacent ply (4) of the circuit board (1) by lifting or displacing the external element (11), thus making it possible to remove a subregion (6) to be removed from a circuit board (1) in an easy and reliable, and if necessary automated, manner. Also disclosed is a use of such a method for producing a multilayer circuit board (1) and especially for creating voids (14) in such a circuit board (1).
摘要翻译：在用于制造印刷电路板（1）以除去的部分（6）它们，其中至少两个层或层片（2，3，4，5）的印刷电路板（1）被连接到彼此和的一个连接到被除去部分的方法（6）配有一个位于相邻的层（4）的电路板（1）通过提供或施加防止（7）的防粘连材料，和边缘区域（8）要被去除的部分（6）的印刷电路板的邻接区域的（ 1）中规定，待分离的部分区域（6）的外表面（9）在分离或横切边缘区域（8）之后与外部元件（11）耦合或连接，并且通过将外部元件（11）从电路板（1）的相邻层（4）上提起或移开而将移除部分（6）分开，从而简化并且更可靠并且给定可以从印刷电路板（1）上去除部分区域（6）的自动移除。此外，提出了这种用于制造多层印刷电路板（1）的方法，特别是用于在这种印刷电路板（1）中制造空腔（14）的方法。

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