专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2014131071A2 SEMI-FINISHED PRODUCT FOR THE PRODUCTION OF A PRINTED CIRCUIT BOARD AND METHOD FOR PRODUCING THE SAME 审中-公开
标题翻译：用于生产印刷电路板的半成品和生产该电路板的方法
公开(公告)号：WO2014131071A2
公开(公告)日：2014-09-04
申请号：PCT/AT2014/050044
申请日：2014-02-27
申请人： AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
发明人： STAHR, Johannes , TUOMINEN, Mikael
IPC分类号： H05K1/18
CPC分类号： H05K3/4611 , H05K1/185 , H05K1/188 , H05K3/30 , H05K3/323 , H05K3/46 , H05K2201/032 , H05K2203/063 , H05K2203/068
摘要： In a semi-finished product (1) for the production of a printed circuit board, the semi-finished product (1) comprising a plurality of insulating layers (3) of a prepreg material and conductive layers (2, 2') of a conductive material and further comprising at least one electronic component (4) embedded in at least one insulating layer (3) the at least one electronic component (4) is attached to a corresponding conductive layer (2) by the aid of an Anisotropic Conductive Film (6) and the Anisotropic Conductive Film (6) as well as the prepreg material are in an unprocessed state. The method for producing a printed circuit board comprises the following steps: Providing at least one conductive layer (2), Applying an Anisotropic Conductive Film (6) on the conductive layer (2), Affixing at least one electronic component (4) on the Anisotropic Conductive Film (6), Embedding the electronic component (4) in at least one insulating layer (3) of prepreg material to obtain a semi-finished product (1), Laminating the semi-finished product (1) to process the prepreg material and the Anisotropic Conductive Film (6).
摘要翻译：在用于制造印刷电路板的半成品（1）中，半成品（1）包括多个预浸材料的绝缘层（3）和导电层（2,2'）的导电材料并且还包括嵌入至少一个绝缘层（3）中的至少一个电子部件（4），所述至少一个电子部件（4）附接到相应的导电层（2）借助各向异性导电膜（6）和各向异性导电膜（6）以及预浸材料处于未加工状态。制造印刷电路板的方法包括以下步骤：提供至少一个导电层（2），在导电层（2）上施加各向异性导电膜（6），将至少一个电子元件（4）各向异性导电膜（6），将电子元件（4）嵌入至少一个预浸材料的绝缘层（3）中以获得半成品（1），层压半成品（1）以处理预浸料坯材料和各向异性导电膜（6）。

2. 发明申请

WO2014094020A1 PRINTED CIRCUIT BOARD 审中-公开
标题翻译：印刷电路板
公开(公告)号：WO2014094020A1
公开(公告)日：2014-06-26
申请号：PCT/AT2013/050248
申请日：2013-12-12
申请人： AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
发明人： FISCHENEDER, Martin , TUOMINEN, Mikael
IPC分类号： H05K1/02
CPC分类号： H05K1/0218 , H05K1/0298 , H05K1/0366 , H05K1/092 , H05K3/1216 , H05K2201/0723 , H05K2203/013
摘要： A printed circuit board (11) comprising conductive layers separated by insulation layers of dielectric material, at least one conductive layer (13) being patterned and having at least one signal line (14, 15) embedded in insulation material. The at least one signal line (14, 15) is covered by a dielectric film (20), followed by a thin conductive layer (21), whereby the dielectric film covers at least one surface (14s, 15s) and both sides (14a, 14b; 15a, 15b) of the at least one signal line and the thin conductive layer (21) extends, separated by the dielectric film, over the at least one surface of the signal line and at least partially over the height (h) of both sides of the signal line.
摘要翻译：一种印刷电路板（11），包括由介电材料的绝缘层隔开的导电层，图案化的至少一个导电层（13）和嵌入绝缘材料中的至少一个信号线（14,15）。所述至少一个信号线（14,15）由电介质膜（20）覆盖，之后是薄的导电层（21），由此所述电介质膜覆盖至少一个表面（14s，15s）和两侧（14a ，所述至少一个信号线和所述薄导电层（21）的所述至少一个信号线（14b; 15a，15b）在所述信号线的所述至少一个表面上延伸并且被所述电介质膜隔开，并且至少部分地超过所述高度（h）的信号线两侧。

3. 发明申请

WO2014094028A1 SEMI-FINISHED PRODUCT FOR THE PRODUCTION OF A PRINTED CIRCUIT BOARD, METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD 审中-公开
标题翻译：印刷电路板的制造用半成品，印刷电路板和印刷电路板的制造方法
公开(公告)号：WO2014094028A1
公开(公告)日：2014-06-26
申请号：PCT/AT2013/050262
申请日：2013-12-20
申请人： AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
发明人： TUOMINEN, Mikael
IPC分类号： H05K1/11 , H05K3/00 , H05K3/46 , H05K3/24
CPC分类号： H05K3/387 , H05K1/0298 , H05K1/034 , H05K1/0346 , H05K1/09 , H05K1/111 , H05K1/117 , H05K3/244 , H05K3/4611 , H05K3/4632 , H05K2201/015 , H05K2201/0154 , H05K2201/09127 , H05K2201/0919 , H05K2201/09845 , H05K2203/0228 , H05K2203/068
摘要： A semi-finished product for the production of a printed circuit board having a plurality of alternately arranged insulating layers (11) and conductive layers (12) and at least one hard gold-plated edge connector (5) is characterised by the hard gold-plated edge connector (5) being arranged on an inner conductive layer (1) of the semi-finished product and being fully covered by at least one group of an insulating layer (11) and a conductive layer (12). The inventive Method for producing a printed circuit board having a plurality of alternately arranged insulating layers (11) and conductive layers (12) and at least one hard gold-plated edge connector (5), where an outer conductive layer is surface treated, is characterised by the steps of providing a hard gold-plated edge connector (5) on a group of an insulating layer (1) and a conductive layer (2), covering the conductive layer (2) and the hard gold-plated edge connector (5) with at least one group of an insulating layer (11) and a conductive layer (12), surface-treating an outer conductive layer (12) to form connector pads (13) for wire bonding of electronic components, cutting the insulating layers (11) and the conductive layers (12) down to the conductive layer (2) forming the hard gold-plated edge connector, removing the insulating layers (11) and conductive layers (12) from the hard gold-plated edge connector (5). The inventive printed circuit board comprised of a plurality of alternately arranged insulating layers and conductive layers and at least one hard gold-plated edge connector is characterised by the hard gold-plated edge connector (5) being arranged on an inner conductive layer (2) of the printed circuit board, and the inner conductive layer (2) forming the hard gold-plated edge connector (5) protruding from the plurality of insulating layers (11) and conductive layers (2).
摘要翻译：用于制造具有多个交替布置的绝缘层（11）和导电层（12）和至少一个硬镀金边缘连接器（5）的印刷电路板的半成品的特征在于，硬金 - 电镀边缘连接器（5）布置在半成品的内导电层（1）上并且被至少一组绝缘层（11）和导电层（12）完全覆盖。本发明的用于制造具有多个交替布置的绝缘层（11）和导电层（12）的印刷电路板和至少一个硬镀金边缘连接器（5）的方法，其中外部导电层被表面处理，其特征在于以下步骤：在绝缘层（1）和导电层（2）的一组上提供硬镀金边缘连接器（5），覆盖导电层（2）和硬镀金边缘连接器 5）具有至少一组绝缘层（11）和导电层（12），对外部导电层（12）进行表面处理以形成用于电子部件引线接合的连接器焊盘（13），切割绝缘层（11）和导电层（12）下降到形成硬镀金边缘连接器的导电层（2），从硬镀金边缘连接器（5）去除绝缘层（11）和导电层（12））。本发明的印刷电路板由多个交替布置的绝缘层和导电层和至少一个硬镀金边缘连接器组成，其特征在于，硬镀金边缘连接器（5）布置在内导电层（2）上，和形成从多个绝缘层（11）和导电层（2）突出的硬金镀边缘连接器（5）的内导电层（2）。

4. 发明申请

WO2017093281A1 ELECTRONIC COMPONENT PACKAGED IN COMPONENT CARRIER SERVING AS SHIELDING CAGE 审中-公开
标题翻译：电子元件包装在元件载体中作为屏蔽笼
公开(公告)号：WO2017093281A1
公开(公告)日：2017-06-08
申请号：PCT/EP2016/079207
申请日：2016-11-30
申请人： AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
发明人： TUOMINEN, Mikael , VOCKENBERGER, Christian , SCHRITTWIESER, Wolfgang
IPC分类号： H01L23/31 , H01L23/552
CPC分类号： H01L23/552 , H01L21/561 , H01L23/3107 , H01L23/3121 , H01L24/20 , H01L24/96 , H01L2223/6677 , H01L2224/04105 , H01L2924/14 , H01L2924/1431 , H01L2924/3025
摘要： An electronic device (500) comprising an electronic component (100) with electric terminals (102) and a component carrier (200) in which the electronic component (100) is packaged, wherein the component carrier (200) comprises a shielding cage (400) surrounding all sides of the electronic component (100) at least partially.
摘要翻译：包括具有电端子（102）的电子部件（100）和其中封装电子部件（100）的部件载体（200）的电子装置（500），其中部件载体 200）包括至少部分地围绕电子部件（100）的所有侧面的屏蔽罩（400）。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式