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1. 发明申请

WO2008154185A3 THIN POLISHING PAD WITH WINDOW AND MOLDING PROCESS 审中-公开
标题翻译：具有窗口和成型工艺的薄型抛光垫
公开(公告)号：WO2008154185A3
公开(公告)日：2009-02-12
申请号：PCT/US2008065316
申请日：2008-05-30
申请人： APPLIED MATERIALS INC , BENVEGNU DOMINIC J , ZHANG JIMIN , OSTERHELD THOMAS H , SWEDEK BOGUSLAW A
发明人： BENVEGNU DOMINIC J , ZHANG JIMIN , OSTERHELD THOMAS H , SWEDEK BOGUSLAW A
IPC分类号： B24B37/04
CPC分类号： B24B37/205 , B24B37/013
摘要： A polishing pad is described that has a polishing layer with a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The window has a top surface coplanar with the polishing surface and a bottom surface coplanar with a lower surface of the adhesive layer. A method of making a polishing pad includes forming an aperture through a polishing layer and an adhesive layer, securing a backing piece to the adhesive layer on a side opposite a polishing surface of the polishing layer, dispensing a liquid polymer into the aperture, and curing the liquid polymer to form a window.
摘要翻译：描述了具有抛光层的抛光垫，抛光层具有抛光表面，在抛光层的与抛光层相对的一侧上的粘合剂层以及延伸穿过模制到抛光层的固体透光窗。窗口具有与抛光表面共面的顶表面和与粘合剂层的下表面共面的底表面。制造抛光垫的方法包括通过抛光层和粘合剂层形成孔，将背衬片固定在与抛光层的抛光表面相对的一侧上的粘合剂层上，将液体聚合物分配到孔中，并固化液体聚合物形成窗口。

2. 发明申请

WO2010082992A3 POLISHING PAD AND SYSTEM WITH WINDOW SUPPORT 审中-公开
标题翻译：抛光垫和系统与窗口支持
公开(公告)号：WO2010082992A3
公开(公告)日：2010-09-23
申请号：PCT/US2009067587
申请日：2009-12-10
申请人： APPLIED MATERIALS INC , QIAN JUN , BENVEGNU DOMINIC J , CUI NINGZHUO , SWEDEK BOGUSLAW A , OSTERHELD THOMAS H
发明人： QIAN JUN , BENVEGNU DOMINIC J , CUI NINGZHUO , SWEDEK BOGUSLAW A , OSTERHELD THOMAS H
IPC分类号： B24B37/04 , B24B7/12 , B24B49/12 , H01L21/304
CPC分类号： B24B37/013 , B24B37/205 , B24B49/12
摘要： A polishing system includes a polishing pad having a solid light-transmissive window, an optical fiber having an end, and a spacer having a vertical aperture therethrough. A bottom surface of the spacer contacts the end of the optical fiber, a top surface of the spacer contacts the underside of the window, and the vertical aperture is aligned with the optical fiber.
摘要翻译：抛光系统包括具有固体透光窗的抛光垫，具有一端的光纤和具有穿过其的垂直孔的间隔件。间隔件的底表面接触光纤的端部，间隔件的顶表面接触窗口的下侧，并且垂直孔与光纤对准。

3. 发明申请

WO2010053804A3 ENDPOINT CONTROL OF MULTIPLE-WAFER CHEMICAL MECHANICAL POLISHING 审中-公开
标题翻译：多波长化学机械抛光的端点控制
公开(公告)号：WO2010053804A3
公开(公告)日：2010-07-22
申请号：PCT/US2009062433
申请日：2009-10-28
申请人： APPLIED MATERIALS INC , ZHANG JIMIN , OSTERHELD THOMAS H , CARLSSON INGEMAR , SWEDEK BOGUSLAW A , JEW STEPHEN
发明人： ZHANG JIMIN , OSTERHELD THOMAS H , CARLSSON INGEMAR , SWEDEK BOGUSLAW A , JEW STEPHEN
IPC分类号： H01L21/304 , B24B37/013
CPC分类号： B24B37/013 , B24B49/04
摘要： A computer-implemented method includes polishing substrates simultaneously in a polishing apparatus. Each substrate has a polishing rate independently controllable by an independently variable polishing parameter. Measurement data that varies with the thickness of each of the substrates is acquired from each of the substrates during polishing with an in-situ monitoring system. A projected thickness that each substrate will have at a target time is determined based on the measurement data. The polishing parameter for at least one substrate is adjusted to adjust the polishing rate of the at least one substrate such that the substrates have closer to the same thickness at the target time than without the adjustment.
摘要翻译：计算机实现的方法包括在抛光装置中同时抛光衬底。每个基底具有通过独立可变抛光参数独立控制的抛光速率。随着每个基板的厚度变化的测量数据在用原位监测系统进行抛光时从每个基板获得。基于测量数据确定每个基板在目标时间具有的投影厚度。调整至少一个基板的抛光参数以调节至少一个基板的抛光速率，使得基板在目标时间比不进行调节更接近相同的厚度。

4. 发明申请

WO2012015699A3 SELECTING REFERENCE LIBRARIES FOR MONITORING OF MULTIPLE ZONES ON A SUBSTRATE 审中-公开
标题翻译：选择用于监测基底上多个区域的参考文献
公开(公告)号：WO2012015699A3
公开(公告)日：2012-05-24
申请号：PCT/US2011045096
申请日：2011-07-22
申请人： APPLIED MATERIALS INC , QIAN JUN , SWEDEK BOGUSLAW A , LEE HARRY Q , DAVID JEFFREY DRUE , DHANDAPANI SIVAKUMAR , OSTERHELD THOMAS H
发明人： QIAN JUN , SWEDEK BOGUSLAW A , LEE HARRY Q , DAVID JEFFREY DRUE , DHANDAPANI SIVAKUMAR , OSTERHELD THOMAS H
IPC分类号： H01L21/304 , H01L21/66
CPC分类号： G05B23/0208 , G05B2219/31459 , G05B2219/45232
摘要： A method of configuring a polishing monitoring system includes receiving user input selecting a plurality of libraries, each library of the plurality of libraries comprising a plurality of reference spectra for use in matching to measured spectra during polishing, each reference spectrum of the plurality of reference spectra having an associated index value, for a first zone of a substrate, receiving user input selecting a first subset of the plurality of libraries, and for a second zone of the substrate, receiving user input selecting a second subset of the plurality of libraries.
摘要翻译：配置抛光监视系统的方法包括接收选择多个库的用户输入，多个库的每个库包括多个参考光谱，用于与抛光期间的测量光谱匹配，多个参考光谱的每个参考光谱具有相关联的索引值，对于衬底的第一区域，接收选择所述多个库的第一子集的用户输入以及所述衬底的第二区域，接收选择所述多个库的第二子集的用户输入。

5. 发明申请

WO2010126902A3 TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING 审中-公开
标题翻译：化学机械抛光的温度控制
公开(公告)号：WO2010126902A3
公开(公告)日：2011-02-03
申请号：PCT/US2010032609
申请日：2010-04-27
申请人： APPLIED MATERIALS INC , XU KUN , ZHANG JIMIN , JEW STEPHEN , OSTERHELD THOMAS H
发明人： XU KUN , ZHANG JIMIN , JEW STEPHEN , OSTERHELD THOMAS H
IPC分类号： H01L21/304 , H01L21/66
CPC分类号： B24B55/02 , B24B37/015
摘要： A chemical mechanical polishing apparatus including a platen for holding a pad having a polishing surface, a subsystem for holding a substrate and the polishing surface together during a polishing step, and a temperature sensor oriented to measure a temperature of the polishing surface, wherein the subsystem accepts the temperature measured by the sensor and is programmed to vary a polishing process parameter in response to the measured temperature. In an aspect, a chemical mechanical polishing apparatus having a platen for holding a pad having a polishing surface, a fluid delivery system for transporting a fluid from a source to the polishing surface, and a temperature controller which during operation controls the temperature of the fluid transported by the delivery system.
摘要翻译：一种化学机械抛光设备，包括用于保持具有抛光表面的垫的台板，用于在抛光步骤期间将基板和抛光表面保持在一起的子系统以及定向为测量抛光表面的温度的温度传感器，其中子系统接受由传感器测量的温度并且被编程为响应于测量的温度改变抛光过程参数。在一个方面，一种化学机械抛光设备，其具有用于保持具有抛光表面的垫的台板，用于将流体从源输送到抛光表面的流体输送系统，以及温度控制器，其在操作期间控制流体的温度由运送系统运送。

6. 发明申请

WO2010126902A4 TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING 审中-公开
标题翻译：化学机械抛光温度控制
公开(公告)号：WO2010126902A4
公开(公告)日：2011-03-31
申请号：PCT/US2010032609
申请日：2010-04-27
申请人： APPLIED MATERIALS INC , XU KUN , ZHANG JIMIN , JEW STEPHEN , OSTERHELD THOMAS H
发明人： XU KUN , ZHANG JIMIN , JEW STEPHEN , OSTERHELD THOMAS H
IPC分类号： H01L21/304 , H01L21/66
CPC分类号： B24B55/02 , B24B37/015
摘要： A chemical mechanical polishing apparatus including a platen for holding a pad having a polishing surface, a subsystem for holding a substrate and the polishing surface together during a polishing step, and a temperature sensor oriented to measure a temperature of the polishing surface, wherein the subsystem accepts the temperature measured by the sensor and is programmed to vary a polishing process parameter in response to the measured temperature. In an aspect, a chemical mechanical polishing apparatus having a platen for holding a pad having a polishing surface, a fluid delivery system for transporting a fluid from a source to the polishing surface, and a temperature controller which during operation controls the temperature of the fluid transported by the delivery system.
摘要翻译：一种化学机械抛光装置，包括用于在抛光步骤期间将用于保持具有抛光表面的焊盘的垫板，用于保持基板和抛光表面的子系统以及用于测量抛光表面的温度的温度传感器，其中所述子系统接受由传感器测量的温度，并被编程为响应于测量的温度改变抛光工艺参数。一方面，一种具有用于保持具有抛光表面的焊盘的压板的化学机械抛光装置，用于将流体从源传送到抛光表面的流体输送系统以及在操作期间控制流体温度的温度控制器由运送系统运输。

7. 发明申请

WO2012018425A3 REAL-TIME MONITORING OF RETAINING RING THICKNESS AND LIFETIME 审中-公开
标题翻译：保持环厚度和寿命的实时监测
公开(公告)号：WO2012018425A3
公开(公告)日：2012-05-18
申请号：PCT/US2011036731
申请日：2011-05-17
申请人： APPLIED MATERIALS INC , MCREYNOLDS PETER , RONDUM ERIC S , LEUNG GARLEN C , ZHONG ADAM H , MENK GREGORY E , PRABHU GOPALAKRISHNA B , OSTERHELD THOMAS H
发明人： MCREYNOLDS PETER , RONDUM ERIC S , LEUNG GARLEN C , ZHONG ADAM H , MENK GREGORY E , PRABHU GOPALAKRISHNA B , OSTERHELD THOMAS H
IPC分类号： H01L21/304 , H01L21/66
CPC分类号： B24B37/005 , B24B37/042 , B24B37/32
摘要： A method and apparatus for monitoring the condition of a surface of a retaining ring disposed on a carrier head in a polishing module is described. In one embodiment, an apparatus is provided. The apparatus includes a carrier head movable in a travel path between at least one polishing station for polishing a substrate as the substrate is retained in the carrier head, and a transfer station for transferring the substrate to and from the carrier head, the carrier head having a retaining ring, and a sensor disposed in the travel path of the carrier head, the sensor operable to provide a metric indicative of a condition of the retaining ring.
摘要翻译：描述了一种用于监测设置在抛光模块中的载体头上的保持环的表面的状态的方法和设备。在一个实施例中，提供了一种装置。该装置包括一个载体头，该载体头在至少一个抛光站之间的移动路径中可移动，用于当基底保持在载体头中时抛光基底;以及传送站，用于将基底传送到载体头和从载体头传送，载体头具有保持环和布置在承载头的行进路径中的传感器，传感器可操作以提供指示保持环状态的度量。

8. 发明申请

WO2009134865A2 ENDPOINT DETECTION IN CHEMICAL MECHANICAL POLISHING USING MULTIPLE SPECTRA 审中-公开
标题翻译：使用多个光谱的化学机械抛光中的端点检测
公开(公告)号：WO2009134865A2
公开(公告)日：2009-11-05
申请号：PCT/US2009042085
申请日：2009-04-29
申请人： APPLIED MATERIALS INC , QIAN JUN , DHANDAPANI SIVAKUMAR , LEE HARRY Q , OSTERHELD THOMAS H , ZHU ZHIZE
发明人： QIAN JUN , DHANDAPANI SIVAKUMAR , LEE HARRY Q , OSTERHELD THOMAS H , ZHU ZHIZE
IPC分类号： H01L21/304
CPC分类号： B24B37/013 , B24B49/12
摘要： A computer implemented method includes obtaining at least one current spectrum with an in-situ optical monitoring system, comparing the current spectrum to a plurality of different reference spectra, and determining based on the comparing whether a polishing endpoint has been achieved for the substrate having the outermost layer undergoing polishing. The current spectrum is a spectrum of light reflected from a substrate having an outermost layer undergoing polishing and at least one underlying layer. The plurality of reference spectra represent spectra of light reflected from substrates with outermost layers having the same thickness and underlying layers having different thicknesses.
摘要翻译：计算机实现的方法包括：利用原位光学监测系统获得至少一个当前频谱，将当前频谱与多个不同的参考光谱进行比较，并且基于比较是否已经实现了具有最外层进行抛光。当前的光谱是从具有正在研磨的最外层的基底和至少一个下层反射的光的光谱。多个参考光谱表示从具有相同厚度的最外层和具有不同厚度的下层的基底反射的光的光谱。

9. 发明申请

WO2010045162A3 EDDY CURRENT GAIN COMPENSATION 审中-公开
标题翻译： EDDY当前增益补偿
公开(公告)号：WO2010045162A3
公开(公告)日：2010-07-15
申请号：PCT/US2009060397
申请日：2009-10-12
申请人： APPLIED MATERIALS INC , BENNETT DOYLE E , OSTERHELD THOMAS H
发明人： BENNETT DOYLE E , OSTERHELD THOMAS H
IPC分类号： H01L21/304
CPC分类号： B24B37/013 , B24B49/105 , G01B7/105
摘要： In-situ monitoring during processing of a substrate includes processing a conductive film on a substrate in a semiconductor processing apparatus and generating a signal from an eddy current sensor during processing. The signal includes a first portion generated when the eddy current sensor is adjacent the substrate, a second portion generated when the eddy current sensor is adjacent a metal body and not adjacent the substrate, and a third portion generated when the eddy current sensor is adjacent neither the metal body nor the substrate. The second portion of the signal is compared to the third portion of the signal and a gain is determined based at least on a result of the comparing, and the first portion of the signal is multiplied by the gain to generate an adjusted signal.
摘要翻译：在处理衬底期间的原位监测包括在半导体处理设备中的衬底上处理导电膜并且在处理期间产生来自涡流传感器的信号。信号包括当涡电流传感器邻近衬底时产生的第一部分，当涡流传感器邻近金属体并且不邻近衬底时产生的第二部分，以及当涡电流传感器不邻近衬底时产生的第三部分金属体也不是基体。将信号的第二部分与信号的第三部分进行比较，并且至少基于比较的结果确定增益，并且将信号的第一部分乘以增益以产生经调整的信号。

10. 发明申请

WO03009349A3 METHODS AND COMPOSITIONS FOR CHEMICAL MECHANICAL POLISHING SUBSTRATES COVERED WITH AT LEAST TWO DIELECTRIC MATERIALS 审中-公开
标题翻译：用于两种介电材料的化学机械抛光衬底的方法和组合
公开(公告)号：WO03009349A3
公开(公告)日：2003-10-16
申请号：PCT/US0222587
申请日：2002-07-16
申请人： APPLIED MATERIALS INC
发明人： BONNER BENJAMIN A , IYER ANAND N , KUMAR DEEPAK N , OSTERHELD THOMAS H , HSU WEI-YUNG , KIM YONG-SIK R , SMITH CHRISTOPHER W , ZHANG HUANBO
IPC分类号： B24B1/00 , C09G1/02 , H01L21/3105 , H01L21/762 , B24B37/04 , H01L21/768
CPC分类号： H01L21/31053 , C09G1/02 , H01L21/76229
摘要： Methods and compositions are provided for planarizing a substrate surface with reduced or minimal defects in surface topography. In one aspect, a method is provided for processing a substrate including positioning a substrate comprising at least first dielectric material and second dielectric material disposed thereon in a polishing apparatus, polishing the substrate with a first polishing composition having a first selectivity, and polishing the substrate with a second polishing composition having a second selectivity greater than the first selectivity.
摘要翻译：提供的方法和组合物用于在表面形貌中具有减少或最小缺陷的平面化基板表面。在一个方面，提供了一种用于处理衬底的方法，包括将包括至少第一介电材料的衬底和设置在其上的第二电介质材料定位在抛光设备中，用具有第一选择性的第一抛光组合物抛光衬底，以及抛光衬底其具有比第一选择性更大的第二选择性的第二抛光组合物。

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