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1. 发明申请

WO2008076601A1 DETERMINING PHYSICAL PROPERTY OF SUBSTRATE 审中-公开
标题翻译：确定基材的物理性质
公开(公告)号：WO2008076601A1
公开(公告)日：2008-06-26
申请号：PCT/US2007/085810
申请日：2007-11-28
申请人： APPLIED MATERIALS, INC. , RAVID, Abraham , SWEDEK, Boguslaw A. , DAVID, Jeffrey Drue , QIAN, Jun , CARLSSON, Ingemar , BENVEGNU, Dominic J. , LEE, Harry Q. , KARUPPIAH, Lakshmanan
发明人： RAVID, Abraham , SWEDEK, Boguslaw A. , DAVID, Jeffrey Drue , QIAN, Jun , CARLSSON, Ingemar , BENVEGNU, Dominic J. , LEE, Harry Q. , KARUPPIAH, Lakshmanan
IPC分类号： G01B11/06
CPC分类号： G01B11/0683 , G01B11/0625 , Y10S707/99936
摘要： A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.
摘要翻译：确定衬底的物理性质的方法包括记录从衬底获得的第一光谱，第一光谱是在改变衬底的物理性能的抛光工艺期间获得的。该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。数据库中的每个光谱具有与之相关联的物理属性值。该方法包括产生指示物理属性的第一值与第一频谱相关联的信号，第一值使用与数据库中识别的先前记录的频谱相关联的物理属性值来确定。用于确定基板的物理性质的系统包括抛光机，端点确定模块和数据库。

2. 发明申请

WO2012145336A2 ADAPTIVELY TRACKING SPECTRUM FEATURES FOR ENDPOINT DETECTION 审中-公开
标题翻译：用于端点检测的适应性追踪光谱特征
公开(公告)号：WO2012145336A2
公开(公告)日：2012-10-26
申请号：PCT/US2012/033969
申请日：2012-04-17
申请人： APPLIED MATERIALS, INC. , DAVID, Jeffrey Drue , BENVEGNU, Dominic J. , SWEDEK, Boguslaw A. , LEE, Harry Q.
发明人： DAVID, Jeffrey Drue , BENVEGNU, Dominic J. , SWEDEK, Boguslaw A. , LEE, Harry Q.
IPC分类号： H01L21/304 , H01L21/66
CPC分类号： B24B49/12 , B24B37/013 , H01L22/12 , H01L22/26
摘要： A method of controlling polishing includes polishing a substrate, monitoring a substrate during polishing with an in-situ monitoring system, generating a sequence of values from measurements from the in-situ monitoring system, fitting a non-linear function to the sequence of values, determining a projected time at which the non-linear function reaches a target value; and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the projected time.
摘要翻译：控制抛光的方法包括抛光衬底，用原位监测系统在抛光过程中监测衬底，从原位监测系统的测量产生一系列值，将非线性函数拟合到数值序列，确定非线性函数达到目标值的预计时间; 以及基于所述预计时间确定抛光终点或抛光速率的调整中的至少一个。

3. 发明申请

WO2010062910A2 USING OPTICAL METROLOGY FOR FEED BACK AND FEED FORWARD PROCESS CONTROL 审中-公开
标题翻译：使用光学计量学进给回馈和进给前进过程控制
公开(公告)号：WO2010062910A2
公开(公告)日：2010-06-03
申请号：PCT/US2009/065772
申请日：2009-11-24
申请人： APPLIED MATERIALS, INC. , DAVID, Jeffrey Drue , LEE, Harry Q. , SWEDEK, Boguslaw A. , BENVEGNU, Dominic J. , ZHU, Zhize , TU, Wen-Chiang
发明人： DAVID, Jeffrey Drue , LEE, Harry Q. , SWEDEK, Boguslaw A. , BENVEGNU, Dominic J. , ZHU, Zhize , TU, Wen-Chiang
IPC分类号： H01L21/304
CPC分类号： B24B37/013 , B24B49/12 , H01L22/12 , H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： A method includes polishing a substrate on a first platen using a first set of parameters, obtaining a plurality of measured spectra from at least two zones, comparing the plurality of measured spectra with a reference spectrum to evaluate the thickness of each of the at least two zones of the substrate, comparing a thickness of a first zone with a thickness of a second zone, determining whether the thickness of the first zone falls within a predetermined range of the thickness of the second zone, and if the thickness does not fall within the predetermined range, at least one of a) adjusting at least one parameter of the first set and polishing a second substrate on the first platen using the adjusted parameters, or b) adjusting at least one parameter of a second set and polishing the substrate on a second platen using the adjusted parameters.
摘要翻译：一种方法包括使用第一组参数来抛光第一台板上的基板，从至少两个区域获得多个测量光谱，将多个测量光谱与参考光谱进行比较，以评估至少两个区域，比较第一区域的厚度和第二区域的厚度，确定第一区域的厚度是否落在第二区域的厚度的预定范围内，并且如果厚度不在第二区域的厚度内预定范围，以下至少一个：a）调整第一组的至少一个参数并使用经调整的参数来研磨第一台上的第二基板，或b）调整第二组的至少一个参数并在一个第二台板使用调整参数。

4. 发明申请

WO2010056679A2 SEMI-QUANTITATIVE THICKNESS DETERMINATION 审中-公开
标题翻译：半定量厚度测定
公开(公告)号：WO2010056679A2
公开(公告)日：2010-05-20
申请号：PCT/US2009/063913
申请日：2009-11-10
申请人： APPLIED MATERIALS, INC. , BENVEGNU, Dominic J. , SWEDEK, Boguslaw A. , DAVID, Jeffrey Drue , LEE, Harry Q.
发明人： BENVEGNU, Dominic J. , SWEDEK, Boguslaw A. , DAVID, Jeffrey Drue , LEE, Harry Q.
IPC分类号： H01L21/304 , H01L21/66
CPC分类号： H01L22/12 , B24B37/013 , B24B49/12 , H01L22/26
摘要： While a substrate is polished, it is also irradiated with light from a light source. A current spectrum of the light reflected from the surface of the substrate is measured. A selected peak, having a first parameter value, is identified in the current spectrum. A value of a second parameter associated with the first parameter is determined from a lookup table using a processor. Depending on the value of the second parameter, the polishing of the substrate is changed. An initial spectrum of light reflected from the substrate before the polishing of the substrate can be measured and a wavelength corresponding to a selected peak of the initial spectrum can be determined.
摘要翻译：当抛光衬底时，它也用来自光源的光照射。测量从衬底表面反射的光的当前光谱。具有第一参数值的选定峰值在当前谱图中被识别。使用处理器从查找表中确定与第一参数相关联的第二参数的值。根据第二参数的值，改变衬底的抛光。可以测量在抛光衬底之前从衬底反射的初始光谱，并且可以确定对应于初始光谱的选定峰值的波长。

5. 发明申请

WO2010028180A2 ADJUSTING POLISHING RATES BY USING SPECTROGRAPHIC MONITORING OF A SUBSTRATE DURING PROCESSING 审中-公开
标题翻译：通过在加工过程中使用基板的光谱监测来调整抛光率
公开(公告)号：WO2010028180A2
公开(公告)日：2010-03-11
申请号：PCT/US2009/055935
申请日：2009-09-03
申请人： APPLIED MATERIALS, INC. , DAVID, Jeffrey Drue , BENVEGNU, Dominic J. , LEE, Harry Q. , SWEDEK, Boguslaw A.
发明人： DAVID, Jeffrey Drue , BENVEGNU, Dominic J. , LEE, Harry Q. , SWEDEK, Boguslaw A.
IPC分类号： H01L21/304
CPC分类号： B24B37/005 , B24B37/013 , B24B49/12 , H01L21/302
摘要： A computer implemented method includes receiving a sequence of current spectra of reflected light from a substrate; comparing each current spectrum from the sequence of current spectra to a plurality of reference spectra from a reference spectra library to generate a sequence of best match reference spectra; determining a goodness of fit for the sequence of best match reference spectra; and determining at least one of whether to adjust a polishing rate or an adjustment for the polishing rate, based on the goodness of fit.
摘要翻译：计算机实现的方法包括从基板接收反射光的当前光谱序列; 将来自当前光谱序列的每个当前光谱与来自参考光谱库的多个参考光谱进行比较，以生成最佳匹配参考光谱的序列; 确定最佳匹配参考光谱序列的拟合优度; 以及基于拟合优度确定是否调整抛光速率或抛光速率的调整中的至少一个。

6. 发明申请

WO2008103964A3 USING SPECTRA TO DETERMINE POLISHING ENDPOINTS 审中-公开
公开(公告)号：WO2008103964A3
公开(公告)日：2008-08-28
申请号：PCT/US2008/054807
申请日：2008-02-22
申请人： APPLIED MATERIALS, INC. , LEE, Harry Q. , SWEDEK, Boguslaw A. , BENVEGNU, Dominic J. , DAVID, Jeffrey Drue
发明人： LEE, Harry Q. , SWEDEK, Boguslaw A. , BENVEGNU, Dominic J. , DAVID, Jeffrey Drue
IPC分类号： B24B49/00
摘要： Methods of determining a polishing endpoint are described using spectra obtained during a polishing sequence. In particular, techniques for using only desired spectra, faster searching methods and more robust rate determination methods are described.

7. 发明申请

WO2008070736A1 DETERMINING COPPER CONCENTRATION IN SPECTRA 审中-公开
标题翻译：确定光谱中的铜浓度
公开(公告)号：WO2008070736A1
公开(公告)日：2008-06-12
申请号：PCT/US2007/086535
申请日：2007-12-05
申请人： APPLIED MATERIALS, INC. , BENVEGNU, Dominic J. , DAVID, Jeffrey Drue , SWEDEK, Boguslaw A. , ZHANG, Jimin , LEE, Harry Q.
发明人： BENVEGNU, Dominic J. , DAVID, Jeffrey Drue , SWEDEK, Boguslaw A. , ZHANG, Jimin , LEE, Harry Q.
IPC分类号： G01N21/55 , G01N21/84 , G01B11/06
CPC分类号： G01B11/0683 , G01N21/55
摘要： Methods of subtracting the copper contribution to spectra obtained from a substrate during chemical mechanical polishing are described. A method of optically determining the amount of area on a substrate that includes a non-dielectric material by making us of a broad band reflectance spectrum of the surface and in particular to determining the concentration of metal such as copper coverage on the surface of a semiconductor as it is gradually reduced during polishing so as to detect the endpoint in a semiconductor etching process. The method is directed to reliably determining the endpoint via the spectral interference pattern resulting from reflections form different dielectric layer interfaces when regions of the substrate are still covered by metal which reflects strongly over the whole wavelength range considered and which tend to mask the reflectance spectrum from the underlying dielectric layers which varies cyclically with decreasing thickness of the dielectric layers.
摘要翻译：描述了在化学机械抛光期间减去从基板获得的光谱对铜的贡献的方法。通过使我们获得表面的宽带反射光谱，特别是确定半导体表面上的金属浓度（例如铜覆盖度）来光学地确定包括非电介质材料的衬底上的面积量的方法因为它在抛光过程中逐渐减少，以便在半导体蚀刻工艺中检测端点。该方法旨在通过由不同介电层界面的反射产生的光谱干涉图形可靠地确定端点，当衬底的区域仍然被在所考虑的整个波长范围内强烈反射并且倾向于掩蔽反射光谱的金属覆盖时底层电介质层随着介电层的厚度逐渐变化而周期性变化。

8. 发明申请

WO2011094706A3 FEEDBACK CONTROL OF POLISHING USING OPTICAL DETECTION OF CLEARANCE 审中-公开
标题翻译：使用光学检测器清除反射的抛光控制
公开(公告)号：WO2011094706A3
公开(公告)日：2011-08-04
申请号：PCT/US2011/023215
申请日：2011-01-31
申请人： APPLIED MATERIALS, INC. , XU, Kun , CARLSSON, Ingemar , LIU, Feng , GAGE, David Maxwell , WANG, You , BENVEGNU, Dominic J. , SWEDEK, Boguslaw A. , WANG, Yuchun , FONTARENSKY, Pierre , TU, Wen-Chiang , KARUPPIAH, Lakshmanan
发明人： XU, Kun , CARLSSON, Ingemar , LIU, Feng , GAGE, David Maxwell , WANG, You , BENVEGNU, Dominic J. , SWEDEK, Boguslaw A. , WANG, Yuchun , FONTARENSKY, Pierre , TU, Wen-Chiang , KARUPPIAH, Lakshmanan
IPC分类号： H01L21/304 , H01L21/66
摘要： A method of controlling polishing includes polishing a first substrate having an overlying layer on an underlying layer or layer structure. During polishing, the substrate is monitored with an in-situ monitoring system to generate a sequence of measurements. The measurements are sorted into groups, each group associated with a different zone of a plurality of zones on the substrate. For each zone, a time at which the overlying layer is cleared is determined based on the measurements from the associated group. At least one second adjusted polishing pressure for at least zone is calculated based on a pressure applied in the at least one zone during polishing the substrate, the time for the at least one zone, and the time for another zone. A second substrate is polished using the at least one adjusted polishing pressure.
摘要翻译：控制抛光的方法包括抛光在下层或层结构上具有覆盖层的第一基板。在抛光过程中，基板采用现场监控系统进行监控，以生成一系列测量结果。测量值被分类成组，每组与基底上多个区域的不同区域相关联。对于每个区域，基于来自关联组的测量来确定覆盖层被清除的时间。基于在抛光衬底期间施加在至少一个区域中的压力，至少一个区域的时间和另一个区域的时间，计算至少一个区域的至少一个第二调整后的抛光压力。使用至少一个调整后的抛光压力抛光第二衬底。

9. 发明申请

WO2012102871A3 GATHERING SPECTRA FROM MULTIPLE OPTICAL HEADS 审中-公开
公开(公告)号：WO2012102871A3
公开(公告)日：2012-08-02
申请号：PCT/US2012/021135
申请日：2012-01-12
申请人： APPLIED MATERIALS, INC. , DAVID, Jeffrey Drue , SWEDEK, Boguslaw A. , BENVEGNU, Dominic J. , DHANDAPANI, Sivakumar
发明人： DAVID, Jeffrey Drue , SWEDEK, Boguslaw A. , BENVEGNU, Dominic J. , DHANDAPANI, Sivakumar
IPC分类号： H01L21/304
摘要： A polishing apparatus includes a platen to hold a polishing pad having a plurality of optical apertures, a carrier head to hold a substrate against the polishing pad, a motor to generate relative motion between the carrier head and the platen, and an optical monitoring system. The optical monitoring system includes at least one light source, a common detector, and an optical assembly configured to direct light from the at least one light source to each of a plurality of separated positions in the platen, to direct light from each position of the plurality of separated positions to the substrate as the substrate passes over said each position, to receive reflected light from the substrate as the substrate passes over said each position, and to direct the reflected light from each of the plurality of separated positions to the common detector.

10. 发明申请

WO2012019044A2 TECHNIQUES FOR MATCHING MEASURED SPECTRA TO REFERENCE SPECTRA FOR IN-SITU OPTICAL MONITORING 审中-公开
标题翻译：将测量的光谱与现场光学监测参考光谱进行匹配的技术
公开(公告)号：WO2012019044A2
公开(公告)日：2012-02-09
申请号：PCT/US2011/046646
申请日：2011-08-04
申请人： APPLIED MATERIALS, INC. , HU, Xiaoyuan , WANG, Zhihong , LEE, Harry Q. , ZHU, Zhize , DAVID, Jeffrey Drue , BENVEGNU, Dominic J. , ZHANG, Jimin , TU, Wen-Chiang
发明人： HU, Xiaoyuan , WANG, Zhihong , LEE, Harry Q. , ZHU, Zhize , DAVID, Jeffrey Drue , BENVEGNU, Dominic J. , ZHANG, Jimin , TU, Wen-Chiang
IPC分类号： H01L21/304 , H01L21/66
CPC分类号： B24B37/013 , B24B37/042 , B24B37/107 , B24B37/205 , B24B49/045 , B24B49/12
摘要： A method of controlling polishing includes storing a library having a plurality of reference spectra, polishing a substrate, measuring a sequence of spectra of light from the substrate during polishing, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum using a matching technique other than sum of squared differences to generate a sequence of best matching reference spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of best matching reference spectra. Finding a best matching reference spectrum may include performing a cross-correlation of the measured spectrum with each of two or more of the plurality of reference spectra from the library and selecting a reference spectrum with the greatest correlation to the measured spectrum as a best matching reference spectrum.
摘要翻译：控制抛光的方法包括存储具有多个参考光谱的库，抛光衬底，在抛光期间测量来自衬底的光的光谱序列，对于光谱序列的每个测量光谱，使用不同于平方差平方和的匹配技术来找到最佳匹配参考谱以产生最佳匹配参考谱的序列，以及基于最佳匹配序列来确定抛光终点或抛光速率的调整中的至少一个参考光谱。寻找最佳匹配参考光谱可以包括执行测量光谱与来自库的多个参考光谱中的两个或更多个中的每一个的互相关，并选择与测量光谱具有最大相关性的参考光谱作为最佳匹配参考谱。

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